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51.发明公开公开(公告)号：US20240204484A1
公开(公告)日：2024-06-20
申请号：US18084896
申请日：2022-12-20
Applicant: Applied Optoelectronics, Inc.
Inventor： Dapeng XU , Klaus Alexander ANSELM , Huanlin ZHANG
CPC classification number: H01S5/2054 , H01S5/0206 , H01S5/2275 , H01S5/34
Abstract: A multi-section semiconductor optical amplifier (SOA) includes at least two sections in series—an input section at an input side and an output section at an output side—with the input section having a higher optical confinement (also referred to as a high gamma) and the output section having a lower optical confinement (also referred to as a low gamma). The input section may also have a shorter length than the output section. The multi-section structure allows optimizing the input side and the output side design separately such that the input section provides a high gain section configured to quickly increase optical power and the output section provides a low differential gain section that improves saturation. As a result, the multi-section SOA can achieve higher output power with high gain and lower signal noise while demanding low input power.
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52.发明授权公开(公告)号：US11812072B2
公开(公告)日：2023-11-07
申请号：US17533642
申请日：2021-11-23
Applicant: Applied Optoelectronics, Inc.
Inventor： William G. Mahoney , Simon Farfoud , Steve Blashewski
IPC: H05K5/00 , H04N21/226 , H05K5/02 , H05K7/20
CPC classification number: H04N21/226 , H05K5/0004 , H05K5/0247 , H05K7/20409
Abstract: An aspect of the present disclosure includes a node housing for use in a broadband distribution network that includes coupling the amplifier to a lid portion and providing an interface plate in a base portion that allows for RF and power signals to be provided to the RF amplifier within the lid portion. The interface plate disposed within the base portion further preferably provides power pass-through to downstream nodes that remains electrically connected even when the amplifier is decoupled from the lid portion. Thus, the amplifier and/or lid portion may be decoupled from the base portion without disrupting power distribution to the down-stream nodes.
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公开(公告)号：US11698497B2
公开(公告)日：2023-07-11
申请号：US17192062
申请日：2021-03-04
Applicant: Applied Optoelectronics, Inc.
Inventor： Hao-Chiang Cheng , Kai-Sheng Lin
CPC classification number: G02B6/4209 , G02B6/4215 , G02B6/4246 , H04B10/40 , H04B10/60
Abstract: An optical fiber holder is disclosed herein that includes at least one confinement slot for routing intermediate optical fibers within a housing of an optical assembly module, and preferably, a plurality of confinement slots for maintaining a target/nominal fiber bending radius for one or more intermediate optical fibers within the housing. Preferably, the optical fiber holder is disposed within the housing of an optical subassembly between an optical component, e.g., a TOSA arrangement and/or ROSA arrangement, and optical coupling receptacles, e.g., LC coupling receptacles, for optically coupling with external fibers for sending and/or receiving optical signals.
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公开(公告)号：US20230114839A1
公开(公告)日：2023-04-13
申请号：US17500269
申请日：2021-10-13
Applicant: Applied Optoelectronics, Inc.
Inventor： William G. MAHONEY
Abstract: The present disclosure is generally directed to an RF connector assembly for use within a node of a broadband distribution network, and can receive a center conductor pin of a coaxial cable, e.g., via insertion by a technician, and electrically couple the center conductor pin to circuitry within the node, such as an amplifier. The RF connector assembly preferably also securely physically couples to the center conductor pin via a spring-biased arrangement (and thus by extension securely couples the coaxial cable to the housing of the node) which can supply a bias force to the center conductor pin in response to insertion of the same into the RF connector assembly. This advantageously eliminates the necessity of opening the housing of the node to couple/decouple the center conducting pin of the coaxial cable to the node.
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公开(公告)号：US20230006402A1
公开(公告)日：2023-01-05
申请号：US17366851
申请日：2021-07-02
Applicant: Applied Optoelectronics, Inc.
Inventor： William G. MAHONEY , Rafael CELEDON , Simon FARFOUD
Abstract: The present disclosure is generally directed to a connector assembly that includes an increased outer diameter of the connector member relative to the equivalent G-type connector and an increased inner diameter of the receptable member relative to the equivalent G-type receptacle (also referred to as a seizure nut) to achieve higher current carrying capacity and target frequency rates of up to 3.0 Ghz, for example. In one preferred example, this results in a connector assembly consistent with the present disclosure having a connector member with an outer diameter of at least 10.70 mm, and more preferably 10.76±0.01 mm, rather than the 9.4 mm diameter of existing G-type connectors. Despite this increased diameter, a seizure assembly consistent with the present disclosure can achieve a functional impedance of 75 ohms to maintain nominal signal quality.
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Patent Agency Ranking
公开(公告)号：US20220283390A1
公开(公告)日：2022-09-08
申请号：US17192062
申请日：2021-03-04
Applicant: Applied Optoelectronics, Inc.
Inventor： Hao-Chiang CHENG , Kai-Sheng LIN
Abstract: An optical fiber holder is disclosed herein that includes at least one confinement slot for routing intermediate optical fibers within a housing of an optical assembly module, and preferably, a plurality of confinement slots for maintaining a target/nominal fiber bending radius for one or more intermediate optical fibers within the housing. Preferably, the optical fiber holder is disposed within the housing of an optical subassembly between an optical component, e.g., a TOSA arrangement and/or ROSA arrangement, and optical coupling receptacles, e.g., LC coupling receptacles, for optically coupling with external fibers for sending and/or receiving optical signals.
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公开(公告)号：US11411650B2
公开(公告)日：2022-08-09
申请号：US16751817
申请日：2020-01-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Kevin Liu , Hao-Chiang Cheng
Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.
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公开(公告)号：US11177887B2
公开(公告)日：2021-11-16
申请号：US16737438
申请日：2020-01-08
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Hang Xie , Yi Wang
Abstract: The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.
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59.发明申请公开(公告)号：US20210211198A1
公开(公告)日：2021-07-08
申请号：US16737414
申请日：2020-01-08
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng LIN , Hao-Chiang CHENG , Hang XIE
Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
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60.发明申请公开(公告)号：US20210157074A1
公开(公告)日：2021-05-27
申请号：US16693361
申请日：2019-11-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng LIN , Hao-Chiang CHENG , Ziliang CAI
Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
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