公开(公告)号：US20110100543A1

公开(公告)日：2011-05-05

申请号：US12783806

申请日：2010-05-20

Applicant: Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

Inventor： Tzyy-Jang Tseng ,  Chang-Ming Lee ,  Wen-Fang Liu ,  Cheng-Po Yu

IPC: B32B38/10 ,  B32B38/04

CPC classification number: H05K3/465 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/184 ,  H05K3/421 ,  H05K3/4661 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1056

Abstract: A manufacturing method of circuit structure is described as follows. Firstly, a composite dielectric layer, a circuit board and an insulating layer disposed therebetween are provided. The composite dielectric layer includes a non-platable dielectric layer and a platable dielectric layer between the non-platable dielectric layer and the insulating layer wherein the non-platable dielectric layer includes a chemical non-platable material and the platable dielectric layer includes a chemical platable material. Then, the composite dielectric layer, the circuit board and the insulating layer are compressed. Subsequently, a through hole passing through the composite dielectric layer and the insulating layer is formed and a conductive via connecting a circuit layer of the circuit board is formed therein. Then, a trench pattern passing through the non-platable dielectric layer is formed on the composite dielectric layer. Subsequently, a chemical plating process is performed to form a conductive pattern in the trench pattern.

Abstract translation: 电路结构的制造方法如下所述。 首先，提供复合电介质层，电路基板和设置在它们之间的绝缘层。 复合电介质层包括不可镀介电层和介于非平板电介质层和绝缘层之间的可镀介电层，其中非可镀介电层包括化学不可镀材料，并且可镀介电层包括化学镀层 材料。 然后，复合介电层，电路板和绝缘层被压缩。 随后，形成穿过复合介电层和绝缘层的通孔，并且在其中形成连接电路板的电路层的导电通孔。 然后，在复合电介质层上形成通过非电介质层的沟槽图案。 随后，执行化学镀处理以在沟槽图案中形成导电图案。

公开(公告)号：US20100065319A1

公开(公告)日：2010-03-18

申请号：US12328446

申请日：2008-12-04

Applicant: Tsung-Yuan Chen ,  Chun-Chien Chen ,  Cheng-Po Yu

Inventor： Tsung-Yuan Chen ,  Chun-Chien Chen ,  Cheng-Po Yu

IPC: H01R12/06 ,  H05K3/36

CPC classification number: H05K3/428 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/20 ,  H05K3/205 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0554 ,  H05K2203/108 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A process for fabricating a wiring board is provided. In the process, a wiring carrying substrate including a carry substrate and a wiring layer is formed. Next, at least one blind via is formed in the wiring carrying substrate. Next, the wiring carrying substrate is laminated to another wiring carrying substrate via an insulation layer. The insulation layer is disposed between the wiring layers of the wiring carrying substrates and full fills the blind via. Next, parts of the carry substrates are removed to expose the insulation layer in the blind via. Next, a conductive pillar connected between the wiring layers is formed. Next, the rest carry substrates are removed.

Abstract translation: 提供一种制造布线板的工艺。 在该过程中，形成包括携带衬底和布线层的布线承载衬底。 接下来，在布线承载基板中形成至少一个盲孔。 接下来，通过绝缘层将布线承载基板层叠到另一布线承载基板。 绝缘层设置在布线基板的布线层之间，并且完全填充盲孔。 接下来，去除部分搬运基板以露出盲孔中的绝缘层。 接下来，形成连接在布线层之间的导电柱。 接下来，其余的携带衬底被去除。

公开(公告)号：US20090250247A1

公开(公告)日：2009-10-08

申请号：US12170082

申请日：2008-07-09

Applicant: Cheng-Po Yu ,  Cheng-Hung Yu

Inventor： Cheng-Po Yu ,  Cheng-Hung Yu

IPC: H05K1/02 ,  H01R43/00

CPC classification number: H05K1/0231 ,  H05K1/0219 ,  H05K1/162 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09809 ,  Y10T29/49117

Abstract: A circuit board including a first dielectric layer having a first surface and a second surface, a first circuit layer, a second dielectric layer, and a second circuit layer is provided. At least one trench is formed on the first surface, and the first circuit layer is formed on an inside wall of the trench. In addition, the second dielectric layer is disposed in the trench, and covers the first circuit layer. The second circuit layer is disposed in the trench, and the second dielectric layer is located between the first circuit layer and the second circuit layer. A manufacturing method of the circuit board is further provided.

Abstract translation: 提供一种电路板，包括具有第一表面和第二表面的第一介电层，第一电路层，第二电介质层和第二电路层。 在第一表面上形成至少一个沟槽，并且第一电路层形成在沟槽的内壁上。 此外，第二电介质层设置在沟槽中并覆盖第一电路层。 第二电路层设置在沟槽中，第二电介质层位于第一电路层和第二电路层之间。 还提供了电路板的制造方法。

公开(公告)号：US20070263862A1

公开(公告)日：2007-11-15

申请号：US11465814

申请日：2006-08-21

Applicant: Tzyy-Jang Tseng ,  Cheng-Po Yu ,  Chi-Min Chang ,  Cheng-Hung Yu

Inventor： Tzyy-Jang Tseng ,  Cheng-Po Yu ,  Chi-Min Chang ,  Cheng-Hung Yu

IPC: G09C3/08

CPC classification number: H05K1/0269 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/09936 ,  H05K2203/013

Abstract: A manufacturing process and an apparatus for printing imprint on defective board are provided. An automatic printing device is used for replacing operator, so as to reduce manpower and to increase the correctness and veracity of defect mark printing. The manufacturing process includes the following steps: first, an image sensor captures an image of a defect mark and transmits the image to a processing unit for data processing. Next, the data is compared, and an inkjet head is notified of the correct printing position to print ink on the customer identification mark of the printed circuit board.

Abstract translation: 提供了制造工艺和用于在缺陷板上印刷压印的装置。 使用自动打印装置来代替操作者，以减少人力和提高缺陷标记打印的正确性和真实性。 制造过程包括以下步骤：首先，图像传感器捕获缺陷标记的图像，并将图像发送到用于数据处理的处理单元。 接下来，比较数据，并且通知喷墨头正确的打印位置以在印刷电路板的客户识别标记上印刷墨水。

公开(公告)号：US20070087457A1

公开(公告)日：2007-04-19

申请号：US11164855

申请日：2005-12-08

Applicant: Tzyy-Jang Tseng ,  Cheng-Po Yu

Inventor： Tzyy-Jang Tseng ,  Cheng-Po Yu

IPC: H01L21/00

CPC classification number: H05K3/225 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/064 ,  H05K2203/013

Abstract: A method for inspecting and mending defects of photo-resist is provided. It includes the following steps. First, a substrate having at least one film is provided. Then, a patterned photo-resist layer is formed on the film. Next, an optical inspection procedure is performed to inspect whether the patterned photo-resist layer has defects or not. If the patterned photo-resist layer has defects, the defects are classified into gaps and protrusions and then the gaps and the protrusions are positioned. If the patterned photo-resist layer has defects such as gaps, an ink-jet printing method, for example, is performed on the patterned photo-resist layer to fill the gaps up. If the patterned photo-resist layer has defects such as protrusions, a laser method, for example, is performed on the patterned photo-resist layer to remove the protrusions. So the defects of the patterned photo-resist layer can be mended.

Abstract translation: 提供了一种检查和修补光刻胶缺陷的方法。 它包括以下步骤。 首先，提供具有至少一个膜的基板。 然后，在膜上形成图案化的光致抗蚀剂层。 接下来，执行光学检查程序以检查图案化的光致抗蚀剂层是否具有缺陷。 如果图案的光致抗蚀剂层具有缺陷，则将缺陷分为间隙和突起，然后定位间隙和突起。 如果图案化的光致抗蚀剂层具有诸如间隙的缺陷，则在图案化的光致抗蚀剂层上进行例如喷墨打印方法来填充间隙。 如果图案化的光致抗蚀剂层具有诸如突起的缺陷，则在图案化的光致抗蚀剂层上执行例如激光方法以去除突起。 因此，可以修补图案化光致抗蚀剂层的缺陷。