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51.发明申请公开(公告)号：US20170278734A1
公开(公告)日：2017-09-28
申请号：US15529590
申请日：2015-08-18
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Zhe Wang
CPC classification number: H01L21/67144 , H01L24/83 , H01L24/95 , H01L27/15 , H01L33/0095 , H01L33/405 , H01L2924/12042
Abstract: A pre-screening method, manufacturing method, device and electronic apparatus of micro-LED. The method for pre-screening defect micro-LEDs comprises: obtaining a defect pattern of defect micro-LEDs on a laser-transparent substrate (S6100); and irradiating the laser-transparent substrate with laser from the laser-transparent substrate side in accordance with the defect pattern (S6200), to lift-off the defect micro-LEDs from the laser-transparent substrate.
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公开(公告)号：US20170263593A1
公开(公告)日：2017-09-14
申请号：US15529612
申请日：2015-04-01
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Zhe Wang
IPC: H01L25/075 , H01L33/00 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/0079 , H01L33/0095 , H01L33/62 , H01L2224/16225 , H01L2933/0066
Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming a micro-LED on a laser-transparent original substrate; bringing the micro-LED into contact with a pad preset on a receiving substrate; and irradiating the original substrate with laser from the original substrate side to lift-off the micro-LED from the original substrate.
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公开(公告)号：US20200039816A1
公开(公告)日：2020-02-06
申请号：US16339455
申请日：2016-10-08
Applicant: GOERTEK.INC
Inventor： QUANBO ZOU
Abstract: An MEMS microphone device and an electronics apparatus are provided. The MEMS microphone device comprises: a substrate; a MEMS microphone element placed on the substrate; a cover encapsulating the MEMS microphone element together with the substrate; and an acoustic port for the MEMS microphone element, wherein a compliant membrane is provided to seal the acoustic port, and the membrane has a mechanical stiffness lower than that of the diaphragm of the MEMS microphone element.
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公开(公告)号：US10473686B2
公开(公告)日：2019-11-12
申请号：US15538230
申请日：2015-07-23
Applicant: Goertek.Inc
Inventor： Tingkai Zhang
IPC: G01P15/125 , G01P15/18
Abstract: An inertia measurement module and three-axis accelerometer, comprising a first pole piece (4) located on a substrate and a mass block (1) suspendingly connected above the substrate via elastic beams (11, 12); the elastic beams (11, 12) includes a first elastic beam (12) and a second elastic beam (11), two ends of the second elastic beams (11) being connected to an anchor point (6) of the substrate, two ends of the first elastic beam (11) being connected to the mass block (1); a center of the first elastic beam (12) and/or the second elastic beam (11) deviates from a center of gravity of the mass block (1); the mass block (1) is further provided with a first movable electrode (9) and a second movable electrode (10) in a Y-axis and an X-axis direction; the movement of one axis in a plane of the inertia measurement module cannot be affected by an eccentric structure feature, such that both X-axis movement and Y-axis movement are linear movements, thus not intensifying an inter-axis coupling, and also not reducing displacement of a mass block on the X-axis and the Y-axis, thus improving capacitance detection precision.
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公开(公告)号：US10397676B2
公开(公告)日：2019-08-27
申请号：US15542866
申请日：2015-11-18
Applicant: Goertek.Inc
Inventor： Minghui Shao , Jianbin Yang
IPC: H04R1/02 , H04R7/12 , H04R7/18 , H04R9/02 , H04R9/06 , H04R31/00 , B29C45/00 , B29K105/16 , B29L31/34
Abstract: The present invention discloses a speaker module, comprising: a speaker assembly, a module shell and a front cover. The module shell is configured to bear the speaker assembly, and comprises a first shell and a second shell, wherein the first shell is doped with a thermally conductive filler. The front cover is configured to cooperate with the module shell to encapsulate the speaker assembly. The speaker module provided by the present invention can quickly discharge heat generated by the speaker assembly during operation through the module shell to prevent overheat of the speaker assembly, thereby avoiding performance loss of a speaker due to high temperature.
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Patent Agency Ranking
公开(公告)号：US10273150B2
公开(公告)日：2019-04-30
申请号：US15554653
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Yanmei Sun
Abstract: The present invention discloses a manufacturing method of an integrated structure of a MEMS microphone and a pressure sensor, which comprises the following steps: depositing an insulating layer, a first polycrystalline silicon layer, a sacrificial layer and a second polycrystalline silicon layer in sequence on a shared substrate; etching the second polycrystalline silicon layer to form a vibrating diaphragm and an upper electrode; eroding the sacrificial layer to form a containing cavity of a microphone and a pressure sensor, and etching the sacrificial layer between the microphone and the pressure sensor; etching the first polycrystalline silicon layer to form a back electrode of the microphone and a lower electrode of the pressure sensor; etching a position of the shared substrate below a back electrode of the microphone to form a back cavity; and etching away the region of the insulating layer below the back electrode. A capacitance structure of a MEMS microphone and that of a pressure sensor are integrated on a shared substrate, improving integration of a MEMS microphone and a pressure sensor, and greatly reducing a size of a whole packaging structure; in addition, a microphone and a pressure sensor can be simultaneously manufactured on a shared substrate to improve the efficiency of production.
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公开(公告)号：US10178477B2
公开(公告)日：2019-01-08
申请号：US15540202
申请日：2015-11-13
Applicant: Goertek.Inc
Inventor： Hairong Wang , Lianwen Shan , Xinfeng Yang
IPC: H04R7/06 , B29C45/14 , G10K13/00 , H04R7/12 , H04R7/16 , H04R9/06 , H04R7/10 , B32B15/088 , B29C45/16 , B29L31/38
Abstract: A vibrating diaphragm assembly related to the technical field of electroacoustic products is provided. The vibrating diaphragm assembly comprises a vibrating diaphragm, wherein the vibrating diaphragm comprises a middle part and a folding ring part surrounding the periphery of the middle part. The vibrating diaphragm also comprises a vibrating diaphragm substrate layer and a silica gel layer; the silica gel layer being at least partially combined with the vibrating diaphragm substrate layer. The vibrating diaphragm substrate layer is also a high molecular material layer; the silica gel layer is combined on the surface of the folding ring part; and the silica gel layer and the high molecular material layer are formed through injection molding.
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公开(公告)号：US10145750B2
公开(公告)日：2018-12-04
申请号：US15572072
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang Zheng
Abstract: An MEMS pressure sensing element is disclosed, comprising a substrate with a groove; a pressure-sensitive film on the substrate for sealing an opening of the groove to form a sealed cavity body; and a pressure-sensitive beam suspended in the sealed cavity body and parallel with the pressure-sensitive film provided with varistors, wherein a center of the pressure-sensitive beam is fixedly connected to that of the pressure-sensitive film, and a periphery is fixedly connected to a bottom wall of the groove of the substrate, such that the pressure-sensitive film drives the pressure-sensitive beam to bending deformation under an external pressure.
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公开(公告)号：US20180335358A1
公开(公告)日：2018-11-22
申请号：US15559647
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
CPC classification number: G01L9/0072 , B81B7/0029 , B81B7/0064 , B81B2201/0264 , B81B2203/0172 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , B81B2203/053 , B81B2207/053 , B81C1/00166 , G01L9/0073 , G01L19/069
Abstract: The present invention discloses an MEMS pressure sensing element, including a substrate provided with a groove; a pressure-sensitive film disposed above the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity; and a movable electrode plate and a fixed electrode plate which are located in the sealed cavity and form a capacitor structure, wherein the fixed electrode plate is fixed on a bottom wall of the groove of the substrate, and the movable electrode plate is suspended above the fixed electrode plate and opposite to the fixed electrode plate; and the pressure-sensitive film is connected to the movable electrode plate so as to drive the movable electrode plate to move under the action of an external pressure. According to the MEMS pressure sensing element, pressure sensitivity and electrical detection are separated, the pressure-sensitive film is exposed in air, the capacitor structures are disposed in the sealed cavity defined by the pressure-sensitive film and the substrate, and the movable electrode plates of the capacitor structures can be driven by the pressure-sensitive film. In this way, not only is a pressure-sensitive function finished, but also external electromagnetic interferences on the capacitor structures are shielded.
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公开(公告)号：US20180288551A1
公开(公告)日：2018-10-04
申请号：US15570616
申请日：2015-12-16
Applicant: Goertek.Inc
Inventor： Qingbin DONG
CPC classification number: H04R31/006 , B29C65/54 , B29L2031/38 , H04R7/16 , H04R31/00
Abstract: The present invention discloses a speaker vibration assembly, comprising: a voice coil, a reinforcement part and a diaphragm, wherein the diaphragm is provided with a central part. The voice coil and the reinforcement part are respectively pasted on two surfaces of the central part, and the central part is provided with an through hole for adhering configured to accommodate an adhesive applied to the surfaces of the diaphragm. In addition, the present invention further provides an assembling method of a speaker vibration assembly. The vibration assembly provided by the present invention avoids an overflow problem of the adhesive, and more reliable structural stability is provided to the reinforcement part and the voice coil. The assembling method provided by the present invention is simple in process, and the application of the adhesive and the solidification operation are required to be performed only once.
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