公开(公告)号：US20050224956A1

公开(公告)日：2005-10-13

申请号：US10907340

申请日：2005-03-30

Applicant: Chin-Li Kao ,  Yi-Shao Lai ,  Jeng-Da Wu ,  Tong-Hong Wang

Inventor： Chin-Li Kao ,  Yi-Shao Lai ,  Jeng-Da Wu ,  Tong-Hong Wang

IPC: H01L23/10 ,  H01L23/13 ,  H01L23/28 ,  H01L23/31 ,  H01L23/36

CPC classification number: H01L23/36 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.

Abstract translation: 提供了芯片封装工艺。 首先，在散热器上形成空腔。 第一密封剂形成在空腔的底部。 电路基板设置在散热器的上方。 电路基板具有与空腔相对应的开口。 此后，芯片设置在第一密封剂上，并且芯片电连接到电路基板。 最后，化合物沉积在第一密封剂和芯片上以形成芯片封装。 芯片封装具有抗扭性，芯片封装工艺提高了整体生产成本。

公开(公告)号：US20120267148A1

公开(公告)日：2012-10-25

申请号：US13536988

申请日：2012-06-28

Applicant: YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K1/02

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided.

Abstract translation: 电路板包括信号平面和接地平面。 信号平面被配置为具有多个信号迹线。 每个信号迹线包括多个直线段。 每个线段沿着与其他线不同的路径延伸。 接地平面包括以阵列连接的多个瓦。 每个瓷砖由地面痕迹形成。 映射在接地平面上的每个信号迹线的直线段相对于瓦片的任何一个接地迹线以一定角度布置。 该角度限定在由瓦片的接地轨迹和瓦片的相邻对角线之一确定的范围内。 还提供了布线这种电路板的方法。

公开(公告)号：US08035034B2

公开(公告)日：2011-10-11

申请号：US12118658

申请日：2008-05-09

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09281

Abstract: A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.

Abstract translation: 印刷电路板包括放置在基座上的基座和信号迹线。 信号迹线包括平行于第一光纤的多条直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段部分地叠加第一光纤并且部分地叠加两个相邻的第一光纤之间的间隙。

公开(公告)号：US07929304B2

公开(公告)日：2011-04-19

申请号：US12479959

申请日：2009-06-08

Applicant: Liang-Liang Cao ,  Jeng-Da Wu ,  Yang Li

Inventor： Liang-Liang Cao ,  Jeng-Da Wu ,  Yang Li

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Abstract translation: 用于从两个热源散热的散热装置包括散热器和安装在散热器上的风扇。 散热器包括基座和位于基座上的多个平行翅片，基座与两个热源中的一个接触，用于热传导由两个热源之一产生的热量。 风扇构造成以这样的方式产生通过翅片的气流，使得气流从翅片的第二侧流到翅片的第一侧。 偏转构件安装在翅片的第一侧上，用于将气流从风扇偏转到两个热源中的第二个。

公开(公告)号：US20100014244A1

公开(公告)日：2010-01-21

申请号：US12241645

申请日：2008-09-30

Applicant: LIANG-LIANG CAO ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO ,  YANG LI ,  LEI GUO

Inventor： LIANG-LIANG CAO ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO ,  YANG LI ,  LEI GUO

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins.

Abstract translation: 用于从热源散热的散热器包括被配置为与热源连接的基座和位于基座上的多个翅片。 切口被限定在多个平行翅片内。

公开(公告)号：US20100002373A1

公开(公告)日：2010-01-07

申请号：US12425609

申请日：2009-04-17

Applicant: LEI GUO ,  YU-HSU LIN ,  JENG-DA WU ,  YANG LI

Inventor： LEI GUO ,  YU-HSU LIN ,  JENG-DA WU ,  YANG LI

IPC: H05K7/20 ,  G06F1/20 ,  F28F13/00

CPC classification number: G06F1/20 ,  H01L23/3677 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating device is provided. The heat dissipating device includes a seat and a plurality of fins secured on the seat. The fins are regularly aligned in a matrix. A first set of fins comprise of a convex profile.

Abstract translation: 提供了一种散热装置。 散热装置包括座和固定在座上的多个翅片。 翅片经常排列成矩阵。 第一组翅片包括凸形轮廓。

公开(公告)号：US07606119B2

公开(公告)日：2009-10-20

申请号：US11309126

申请日：2006-06-24

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Chun-Ming Chen

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu ,  Chun-Ming Chen

IPC: G11B7/00

CPC classification number: G11B7/0933

Abstract: In one preferred embodiment, an objective lens actuator includes a base, a suspension apparatus mounted on the base, a holder suspended by the suspension apparatus for holding an objective lens, a voice coil motor (VCM) for driving the holder to vibrate, and a cover. The VCM includes a first yoke, a second yoke and a pair of magnets fixed on the first yoke and the second yoke respectively. The first yoke and the second yoke respectively include a first part and a second part. The cover is made of a material having a magnetic conductivity. The cover connects the first part and the second part of each of the first yoke and the second yoke.

Abstract translation: 在一个优选实施例中，物镜致动器包括基座，安装在基座上的悬架装置，由悬挂装置悬挂以保持物镜的保持架，用于驱动保持器振动的音圈马达（VCM），以及 盖。 VCM包括分别固定在第一磁轭和第二磁轭上的第一磁轭，第二磁轭和一对磁体。 第一磁轭和第二磁轭分别包括第一部分和第二部分。 该盖由具有磁导率的材料制成。 盖子连接第一磁轭和第二磁轭中的每一个的第一部分和第二部分。

公开(公告)号：US20090213549A1

公开(公告)日：2009-08-27

申请号：US12210499

申请日：2008-09-15

Applicant: LEI GUO ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO ,  YANG LI ,  LIANG-LIANG CAO

Inventor： LEI GUO ,  YU-HSU LIN ,  JENG-DA WU ,  CHIH-HANG CHAO ,  YANG LI ,  LIANG-LIANG CAO

IPC: H05K7/20

CPC classification number: H01L23/367 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.

Abstract translation: 散热器组件包括印刷电路板，安装在印刷电路板上的电子部件和安装在印刷电路板上的用于从电子部件散热的散热片。 印刷电路板包括导热层。 散热器包括被配置为接触导热层的基座以及从构造成接触电子部件的基部向上延伸的主体。 基座的横截面大于主体的横截面。 多个翅片从主体延伸。

公开(公告)号：US20090188699A1

公开(公告)日：2009-07-30

申请号：US12118658

申请日：2008-05-09

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/02

CPC classification number: H05K1/0366 ,  H05K1/0245 ,  H05K1/0248 ,  H05K2201/029 ,  H05K2201/09236 ,  H05K2201/09281

Abstract: A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.

Abstract translation: 印刷电路板包括放置在基座上的基座和信号迹线。 信号迹线包括平行于第一光纤的多条直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段部分地叠加第一光纤并且部分地叠加两个相邻的第一光纤之间的间隙。

公开(公告)号：US20090185351A1

公开(公告)日：2009-07-23

申请号：US12180215

申请日：2008-07-25

Applicant: YANG LI ,  YU-HSU LIN ,  JENG-DA WU

Inventor： YANG LI ,  YU-HSU LIN ,  JENG-DA WU

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/183 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board.

Abstract translation: 一种用于将散热器安装在板上的安装装置，包括限定在散热器中的第一锁定孔，限定在板中的第二锁定孔和锁定构件。 锁定构件包括基座和杆。 基座定义了一个孔。 底部的底部在孔周围形成一对分离的弹性爪。 弹性爪通过第一和第二锁定孔插入。 杆包括扩张部分。 杆在基座的孔中滑动，扩张部分位于爪之间，以将爪向外扩张以比第二锁定孔大，以将锁定构件锁定在板上并将散热器安装在板上。