公开(公告)号：US08256111B2

公开(公告)日：2012-09-04

申请号：US12645303

申请日：2009-12-22

Applicant: Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K3/02 ,  H05K3/10

CPC classification number: H01L23/50 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0224 ,  H05K1/0253 ,  H05K2201/09281 ,  H05K2201/09681 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5° to 32.5°.

Abstract translation: 布线电路板的方法包括以下步骤。 衬底板形成有多个板侧。 提供包括多个瓦片的接地平面。 每个接地迹线瓦片由多个接地迹线限定。 衬底板上的信号平面具有包括多个直线段的多个信号迹线。 每个瓦片的任何一个接地迹线相对于一个确定的电路板侧以非零度的角度布置。 直线段被施加以映射在跨越由瓦片的接地轨迹和瓦片的相邻对角线确定的角度范围内的一个瓦片的一个接地轨迹的接地平面上。 一个接地迹线和直线段以可在22.5°至32.5°的范围内的角度施加。

公开(公告)号：US20110188219A1

公开(公告)日：2011-08-04

申请号：US12753299

申请日：2010-04-02

Applicant: JENG-DA WU

Inventor： JENG-DA WU

IPC: H05K1/18

CPC classification number: H05K1/18

Abstract: A circuit board assembly includes a circuit board having a first side and a second side opposite to the first side. A chip module is connected to the first side of the circuit board. The chip module includes a substrate and a chip disposed on the substrate. The first clamping member defines a recess and a contact portion around the recess. The chip is received in the recess, and the contact portion abuts the substrate. A second clamping member abuts the second side of the circuit board. A plurality of stress adjusting members extends through the second clamping member and engages the first clamping member.

Abstract translation: 电路板组件包括具有第一侧和与第一侧相对的第二侧的电路板。 芯片模块连接到电路板的第一侧。 芯片模块包括衬底和设置在衬底上的芯片。 第一夹紧构件限定凹部和围绕凹部的接触部分。 芯片被容纳在凹部中，并且接触部分邻接衬底。 第二夹紧构件邻接电路板的第二侧。 多个应力调节构件延伸穿过第二夹紧构件并接合第一夹紧构件。

公开(公告)号：US20110188208A1

公开(公告)日：2011-08-04

申请号：US12830483

申请日：2010-07-06

Applicant: JENG-DA WU

Inventor： JENG-DA WU

IPC: H05K7/20

CPC classification number: H05K7/20

Abstract: A heat dissipating system includes a circuit board, a chip module, a first clamping member, a second clamping member, and a plurality of stress adjusting members. The circuit board includes a top surface and a bottom surface opposite to the top surface. The chip module includes a base portion located on the top surface of the circuit board via solder balls and a chip disposed on the base portion. The first clamping member abuts the chip. The second clamping member abuts the bottom surface of the circuit board. The stress adjusting members extend through the second clamping member and engage with the first clamping member.

Abstract translation: 散热系统包括电路板，芯片模块，第一夹紧构件，第二夹紧构件和多个应力调节构件。 电路板包括顶表面和与顶表面相对的底表面。 芯片模块包括通过焊球位于电路板的顶表面上的基部和设置在基部上的芯片。 第一夹紧构件邻接芯片。 第二夹紧构件邻接电路板的底面。 应力调节构件延伸穿过第二夹紧构件并与第一夹紧构件接合。

公开(公告)号：US20110164380A1

公开(公告)日：2011-07-07

申请号：US12750927

申请日：2010-03-31

Applicant: Jeng-Da WU ,  Chih-Hang CHAO ,  Zhi-Ping WU

Inventor： Jeng-Da WU ,  Chih-Hang CHAO ,  Zhi-Ping WU

IPC: H05K7/20

CPC classification number: G06F1/20 ,  H01L23/36 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A circuit board assembly is provided, includes a circuit board having a first side and a second side opposite to the first side. A chip is connected to the first side of the circuit board. A first heat dissipating device is located on the first side of the circuit board. The chip is located between the first heat dissipating device and the first side of the circuit board. A second heat dissipating device abuts the second side of the circuit board, and the second heat dissipating device are secured to the first heat dissipating device to clamp the circuit board and the chip.

Abstract translation: 提供一种电路板组件，包括具有与第一侧相对的第一侧和第二侧的电路板。 芯片连接到电路板的第一侧。 第一散热装置位于电路板的第一侧。 该芯片位于第一散热装置和电路板的第一侧之间。 第二散热装置邻接电路板的第二侧，第二散热装置固定在第一散热装置上，夹紧电路板和芯片。

公开(公告)号：US07973244B2

公开(公告)日：2011-07-05

申请号：US11765453

申请日：2007-06-20

Applicant: Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

Inventor： Yu-Hsu Lin ,  Chan-Fei Tai ,  Jeng-Da Wu ,  Chih-Hang Chao

IPC: H05K1/03

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。

公开(公告)号：US20100149749A1

公开(公告)日：2010-06-17

申请号：US12479959

申请日：2009-06-08

Applicant: Liang-Liang CAO ,  Jeng-Da WU ,  Yang LI

Inventor： Liang-Liang CAO ,  Jeng-Da WU ,  Yang LI

IPC: G06F1/20

CPC classification number: H01L23/467 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Abstract translation: 用于从两个热源散热的散热装置包括散热器和安装在散热器上的风扇。 散热器包括基座和位于基座上的多个平行翅片，基座与两个热源中的一个接触，用于热传导由两个热源之一产生的热量。 风扇构造成以这样的方式产生通过翅片的气流，使得气流从翅片的第二侧流到翅片的第一侧。 偏转构件安装在翅片的第一侧上，用于将气流从风扇偏转到两个热源中的第二个。

公开(公告)号：US07633169B2

公开(公告)日：2009-12-15

申请号：US11679131

申请日：2007-02-26

Applicant: Jeng-Da Wu

Inventor： Jeng-Da Wu

IPC: H01L23/48

CPC classification number: H01L21/563 ,  H01L23/3128 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps is formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

Abstract translation: 芯片封装结构包括载体，芯片和底部填充物。 芯片具有形成多个凸起的活性表面。 该芯片以有源表面面向载体的方式倒装芯片结合到载体上，并通过凸块与载体电连接。 底部填充物填充在芯片和载体之间。 芯片附近的一部分底部填充物用作第一底部填充部分。 载体附近的底部填充部分用作第二底部填充部分。 第一底部填充部分的杨氏模量小于第二底部填充部分的杨氏模量。 第二底部填充部分可以任选地用选择的封装代替。 所选择的封装覆盖芯片周围的芯片和载体。

公开(公告)号：US20090016024A1

公开(公告)日：2009-01-15

申请号：US11849306

申请日：2007-09-03

Applicant: CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

Inventor： CHIH-HANG CHAO ,  YU-HSU LIN ,  JENG-DA WU

IPC: H05K7/20 ,  H05K7/02

CPC classification number: H05K1/0271 ,  H05K1/0203 ,  H05K2201/09063 ,  H05K2201/10734

Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括平行布置在印刷电路板上的印刷电路板，第一芯片和第二芯片。 在第一芯片周围的印刷电路板中限定多个固定孔。 在第二芯片和由靠近第二芯片的两个固定孔确定的第一线之间的印刷电路板中限定至少一个隔离孔。 如果印刷电路板受到冲击，则可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US07447039B2

公开(公告)日：2008-11-04

申请号：US11309887

申请日：2006-10-17

Applicant: Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

Inventor： Chih-Hang Chao ,  Yu-Hsu Lin ,  Jeng-Da Wu

IPC: H05K1/00

CPC classification number: H05K1/181 ,  H05K1/0203 ,  H05K2201/09418 ,  H05K2201/10522 ,  H05K2201/10598 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract translation: 主板包括电路板，第一芯片和设置在电路板上的第二芯片。 在第一芯片周围的电路板中定义了四个固定孔，用于将散热模块安装在第一芯片上。 两个固定孔确定第一条线，另外两个固定孔确定与第一条线平行的第二条线。 第二芯片的中心位于第一和第二线之间的中心线处。 如果电路板受到冲击，可以有效地最小化或防止对芯片的损坏。

公开(公告)号：US20080186687A1

公开(公告)日：2008-08-07

申请号：US11765453

申请日：2007-06-20

Applicant: YU-HSU LIN ,  CHAN-FEI TAI ,  JENG-DA WU ,  CHIH-HANG CHAO

Inventor： YU-HSU LIN ,  CHAN-FEI TAI ,  JENG-DA WU ,  CHIH-HANG CHAO

IPC: H05K1/09

CPC classification number: H05K1/0248 ,  H05K1/025 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09227 ,  H05K2201/09281

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract translation: 印刷电路板包括由多根编织纤维形成的底座和放置在基座上的信号迹线。 每个信号迹线至少包括直线段。 信号迹线以这样的方式铺设在基座上，使得映射在基座上的信号迹线的线段以不等于零度的角度跨越光纤。