公开(公告)号：US20080023526A1

公开(公告)日：2008-01-31

申请号：US11495966

申请日：2006-07-28

Applicant: Glen N. Biggs ,  John J. Garant ,  Peter A. Gruber ,  Bouwe W. Leenstra ,  Christopher L. Tessler ,  Thomas Weiss

Inventor： Glen N. Biggs ,  John J. Garant ,  Peter A. Gruber ,  Bouwe W. Leenstra ,  Christopher L. Tessler ,  Thomas Weiss

IPC: B23K1/00 ,  B22D18/04

CPC classification number: B23K3/0638

Abstract: A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

公开(公告)号：US06924171B2

公开(公告)日：2005-08-02

申请号：US09782494

申请日：2001-02-13

Applicant: Stephen L. Buchwalter ,  David Danovitch ,  Fuad Elias Doany ,  Claudius Feger ,  Peter A. Gruber ,  Revathi Iyengar ,  Nancy C. LaBianca

Inventor： Stephen L. Buchwalter ,  David Danovitch ,  Fuad Elias Doany ,  Claudius Feger ,  Peter A. Gruber ,  Revathi Iyengar ,  Nancy C. LaBianca

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/29 ,  H01L24/94 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/01083 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials applied on the wafer prior to dicing eliminates the need for dispensing and curing underfill for each semiconductor at the package level, thereby improving manufacturing throughput and reducing cost.

Abstract translation: 公开了制造微电子互连结构的方法以及通过这些方法形成的结构，其提高了组装倒装芯片半导体器件的制造吞吐量。 在切割之前使用在晶片上施加的聚合物材料的双层，消除了在封装级别为每个半导体分配和固化底部填充物的需要，从而提高制造产量并降低成本。

公开(公告)号：US5244143A

公开(公告)日：1993-09-14

申请号：US869676

申请日：1992-04-16

Applicant: Thomas G. Ference ,  Peter A. Gruber ,  Bernardo Hernandez ,  Michael J. Palmer ,  Arthur R. Zingher

Inventor： Thomas G. Ference ,  Peter A. Gruber ,  Bernardo Hernandez ,  Michael J. Palmer ,  Arthur R. Zingher

IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34

CPC classification number: B23K3/0607 ,  B23K1/20 ,  H05K3/3468 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/111 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

Abstract: An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir for molten solder which is disposed over a cavity in an injection plate. The injection plate is disposed over a mold having an array of cavities therein into which solder in injection molded. The mold is disposed over a workpiece, such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity in the injection plate disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

公开(公告)号：US5198189A

公开(公告)日：1993-03-30

申请号：US870152

申请日：1992-04-13

Applicant: Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

Inventor： Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

IPC: B22F1/02 ,  B23K35/14 ,  C22C1/02 ,  H01L23/373

CPC classification number: C22C1/02 ,  B22F1/025 ,  H01L23/3733 ,  H01L2924/0002

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Abstract translation: 液态金属基体热膏包括在低熔点液体金属基体中的非反应导热颗粒的分散体。 颗粒优选是硅，钼，钨或其它在低于约100℃的温度下不与镓反应的材料。优选的液态金属是镓和铟共晶，镓和锡共晶以及镓，铟和锡三元共晶。 颗粒可以用贵金属涂覆以最小化表面氧化并增强颗粒的润湿性。 液体金属基质热膏用作高导热浆料，以与传统的流体冷却系统一起冷却高功率耗散部件。

公开(公告)号：US5173256A

公开(公告)日：1992-12-22

申请号：US790904

申请日：1991-11-08

Applicant: Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

Inventor： Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

IPC: B22F1/02 ,  C22C1/02 ,  H01L23/373

CPC classification number: B22F1/025 ,  C22C1/02 ,  H01L23/3733 ,  H01L2924/0002

Abstract: A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Abstract translation: 液态金属基体热膏包括在低熔点液体金属基体中的非反应导热颗粒的分散体。 颗粒优选是硅，钼，钨或其它在低于约100℃的温度下不与镓反应的材料。优选的液态金属是镓和铟共晶，镓和锡共晶以及镓，铟和锡三元共晶。 颗粒可以用贵金属涂覆以最小化表面氧化并增强颗粒的润湿性。 液体金属基质热膏用作高导热浆料，以与传统的流体冷却系统一起冷却高功率耗散部件。

公开(公告)号：US5022462A

公开(公告)日：1991-06-11

申请号：US492601

申请日：1990-03-12

Applicant: Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

Inventor： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

IPC: H01L23/433 ,  H01L23/467

CPC classification number: H01L23/4338 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/3025

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.

Abstract translation: 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。

公开(公告)号：US4549407A

公开(公告)日：1985-10-29

申请号：US597306

申请日：1984-04-06

Applicant: Peter A. Gruber

Inventor： Peter A. Gruber

IPC: H05K7/20 ,  F25D7/00 ,  F28C3/08 ,  F28D5/00 ,  F28F13/00 ,  H01L23/427 ,  H01L23/473

CPC classification number: F28F13/00 ,  F28D5/00 ,  H01L23/427 ,  F28F13/003 ,  H01L2924/0002 ,  Y10S165/907 ,  Y10S165/911

Abstract: Evaporative cooling particularly useful for semiconductor integrated circuits is more efficient when a liquid is completely evaporated at the heat radiating surface. The liquid is converted to droplets and mixed with the gas at the heat radiating surface.

Abstract translation: 当液体在散热表面完全蒸发时，对半导体集成电路特别有用的蒸发冷却效果更好。 将液体转化成液滴并与散热表面的气体混合。

公开(公告)号：US08828860B2

公开(公告)日：2014-09-09

申请号：US13600204

申请日：2012-08-30

Applicant: Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/00

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K3/0638 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81065 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/14 ,  H01L2924/20104 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/35 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.

Abstract translation: 采用多次注入熔融焊料来形成双层焊料凸点，其外层在比其内部部分更低的温度下熔化。 在倒装芯片组装过程中，回流温度高于外层的熔化温度并低于焊料凸块的内部部分的熔化温度。 由于焊料凸块的内部在回流期间不会塌陷，所以可以在相对低的温度下制造倒装芯片组件并具有高的间隔高度。 具有双重焊料凸块的结构有助于倒装芯片组装。

公开(公告)号：US20140065771A1

公开(公告)日：2014-03-06

申请号：US13600204

申请日：2012-08-30

Applicant: Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC: H01L21/60

CPC classification number: H05K3/3436 ,  B23K1/0016 ,  B23K3/0638 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81065 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/14 ,  H01L2924/20104 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/35 ,  H05K3/3494 ,  H05K13/0465 ,  H05K2203/043 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Multiple injections of molten solder are employed to form double solder bumps having outer layers that melt at lower temperatures than the inner portions thereof. During a flip chip assembly process, the reflow temperature is above the melting temperature of the outer layers and below the melting temperature of the inner portions of the solder bumps. As the inner portions of the solder bumps do not collapse during reflow, a flip chip assembly can be made at relatively low temperatures and have a high stand-off height. A structure having double solder bumps facilitates flip chip assembly.

公开(公告)号：US08381962B2

公开(公告)日：2013-02-26

申请号：US13025419

申请日：2011-02-11

Applicant: Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

Inventor： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

IPC: B23K1/00 ,  B23K37/00

CPC classification number: B23K3/0638 ,  B23K1/0016

Abstract: A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.

Abstract translation: 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。