公开(公告)号：US5462628A

公开(公告)日：1995-10-31

申请号：US232417

申请日：1994-04-25

Applicant: Alfred Viehbeck ,  Martin Goldberg ,  Stephen L. Tisdale ,  Stephen L. Buchwalter ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew

Inventor： Alfred Viehbeck ,  Martin Goldberg ,  Stephen L. Tisdale ,  Stephen L. Buchwalter ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  B32B31/00

CPC classification number: C23C18/1608 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  H05K3/381 ,  Y10S525/903

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material. The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

Abstract translation: 某些有机聚合材料能够可逆地接受或捐赠来自还原剂的电子。 聚合物中的氧化还原位点接受电子，结果发生聚合物的性质变化。 该改变可用于改性或蚀刻聚合物材料。 可以通过在受控的深度将金属种子并入材料中来修饰材料。 种子通过金属阳离子与聚合物中的氧化还原位点的相互作用而引入，这导致阳离子还原形成中性金属种子。 随后将含有种子的聚合材料暴露于无电镀浴中，导致具有对聚合物材料具有良好粘附性的所需特性的金属的进一步沉积。 聚合物材料的蚀刻可以作为聚合物在非质子传递溶剂中当其氧化还原位点已经接受电子时的溶解度增加的结果进行。 增加的溶解度允许在已经还原的聚合物材料的某些区域中蚀刻开口，留下其它区域不变。

公开(公告)号：US5373627A

公开(公告)日：1994-12-20

申请号：US156446

申请日：1993-11-23

Applicant: Kurt R. Grebe

Inventor： Kurt R. Grebe

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H01L23/538 ,  H05K3/30

CPC classification number: H01L23/3672 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L21/568 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: A multi-chip module having very high density interconnect structures and a technique for making it, where all of the chips have their active device surfaces in a common plane. The chips are placed face down on an adjacent adhesive layer located on a substrate, which is preferably a flexible material. A conformal material is deposited over the backsides of the chips and in the spaces between the chips. A ground plane or metallic shield can then be formed over the conformal layer, if desired. The structure is then turned over and the glass layer on which the substrate is located is removed. Access vias are made through the substrate to the chip I/O's, and metallization provided to the chips. Interconnect metallization is then provided to complete the multi-chip module. In one embodiment, the substrate on which the chips are first supported is the first level of insulation above the active device surfaces of the chips and also ensures that the active device surfaces are in a common plane.

Abstract translation: 具有非常高密度互连结构的多芯片模块和用于制造它的技术，其中所有芯片在其共同平面中具有其有源器件表面。 将芯片面朝下放置在位于衬底上的相邻粘合剂层上，该衬底优选为柔性材料。 保形材料沉积在芯片的背面和芯片之间的空间中。 如果需要，可以在保形层上形成接地平面或金属屏蔽。 然后将结构翻转，除去其上放置基板的玻璃层。 通孔通过衬底到芯片I / O，以及提供给芯片的金属化。 然后提供互连金属化以完成多芯片模块。 在一个实施例中，其上首先被支撑芯片的基板是在芯片的有源器件表面上方的第一级绝缘层，并且还确保有源器件表面处于公共平面。

公开(公告)号：US5242713A

公开(公告)日：1993-09-07

申请号：US290486

申请日：1988-12-23

Applicant: Alfred Viehbeck ,  Stephen L. Buchwalter ,  William A. Donson ,  John J. Glenning ,  Martin J. Goldberg ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew ,  Walter P. Pawlowski ,  Mark J. Schadt ,  Michael R. Scheuermann ,  Stephen L. Tisdale

Inventor： Alfred Viehbeck ,  Stephen L. Buchwalter ,  William A. Donson ,  John J. Glenning ,  Martin J. Goldberg ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Linda C. Matthew ,  Walter P. Pawlowski ,  Mark J. Schadt ,  Michael R. Scheuermann ,  Stephen L. Tisdale

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

CPC classification number: C23C18/1608 ,  C23C18/166 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  H05K3/381 ,  Y10S525/903

Abstract: Certain organic polymeric materials are capable of reversibly accepting or donating electrons from a reducing entity. The redox sites in the polymer accept electrons and, as a result, a change in the properties of the polymer occurs. This change is useful in modifying or etching the polymeric material The material can be modified by incorporation of metallic seeds into the material at a controlled depth. The seeds are incorporated by interaction of cations of the metals with the redox sites in the polymer, which cause the reduction of the cations to form the neutral metallic seeds. Subsequent exposure of the polymeric material containing the seeds to an electroless bath causes further deposition of metal having the desirable characteristic of good adhesion to the polymeric material. Etching of the polymeric material can be carried out as a result of an increase in solubility of the polymer in aprotic solvents when its redox sites have accepted electrons. The increased solubility allows openings to be etched in certain areas of the polymeric material that have been reduced, leaving other areas unchanged.

公开(公告)号：US4725850A

公开(公告)日：1988-02-16

申请号：US027710

申请日：1987-03-19

Applicant: Derek B. Dove ,  Kurt R. Grebe ,  George E. Keefe ,  Edward J. Yarmchuk

Inventor： Derek B. Dove ,  Kurt R. Grebe ,  George E. Keefe ,  Edward J. Yarmchuk

IPC: B41J2/43 ,  G01D15/00

CPC classification number: B41J2/43

Abstract: An electromagnetic printhead is fabricated with a common flux returning backplate and an array of writing elements extending from the common backplate. The writing elements consist of large pedestals and small pedestals. The placement of the large pedestals provides addressability resolution; the small pedestals provide imaging resolution. The large pedestals accept electromagnetic flux from addressing conductors and transfer the flux through the respectively related small pedestals to an image receptor. There are several fabrication techniques which are eased by the separation of addressability resolution and imaging resolution, primarily because the wide separation of the large pedestals required for the addressing conductors mandate relatively massive removal of material and thus suggest relatively low precision machining techniques. The imaging resolution requires both high spacial precision and accurate dimension control, normally achievable by relatively high precision techniques. With the functions addressability resolution and imaging resolution functions separately provided, the best and most economical techniques may be used for each. The magnetic flux path for recording may be either vertical or in-plane, and the flux return may be common via the relatively low reluctance path provided by very large area paths through the mass of nonferromagnetic material to the common flux returning backplate. This simplified printhead lends itself to the use of standard flexible circuit fabrication techniques for the addressing conductors.

Abstract translation: 制造电磁打印头具有常见的磁通返回背板和从公共背板延伸的书写元件阵列。 书写元素由大型基座和小座构成。 大基座的放置提供了可寻址性分辨率; 小基座提供成像分辨率。 大基座接受来自寻址导体的电磁通量，并将磁通通过相应的小基座转移到图像接收器。 存在通过分离寻址能力分辨率和成像分辨率而减轻的几种制造技术，主要是因为寻址导体所需的大基座的宽分离需要相对大量的材料去除并因此提出相对低精度的加工技术。 成像分辨率需要高空间精度和精确的尺寸控制，通常可以通过相对较高的精度技术实现。 通过独立提供的功能寻址能力分辨率和成像分辨率功能，可以使用最佳和最经济的技术。 用于记录的磁通路径可以是垂直的或平面的，并且磁通返回可以通过通过穿过非铁磁材料的非常大的面积路径提供给相同的磁通返回背板而提供的相对低的磁阻路径是共同的。 这种简化的打印头本身适用于寻址导体的标准柔性电路制造技术。

公开(公告)号：US5274913A

公开(公告)日：1994-01-04

申请号：US782701

申请日：1991-10-25

Applicant: Kurt R. Grebe ,  Jack M. McCreary ,  Darbha Suryanarayana ,  Ho-Ming Tong

Inventor： Kurt R. Grebe ,  Jack M. McCreary ,  Darbha Suryanarayana ,  Ho-Ming Tong

IPC: C08G61/02 ,  C08G61/00 ,  C08J5/18 ,  H01L21/56 ,  H01L21/60 ,  H01L23/08 ,  H01L23/50 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/3135 ,  H05K3/284 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/8192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: Disclosed is a reworkable circuit .package formed by controlled collapse chip connection ("C4") bonding of integrated circuit chips to circuit cards and boards, and direct chip attachment ("DCA") where an encapsulant is disposed under the chip. The encapsulant offers protection of the C4 connections and a thermal expansion matched to that of the C4 joints. However, most encapsulants interfere with reworkability. The disclosed circuit package overcomes this problem by the provision of a passivating layer of Parylene is reworkable, dry processable, uniformly depositable by vapor phase deposition, forming thin films on facing surfaces at the 3-5 micron film thickness corresponding to the C4 lift-off distance.

Abstract translation: 公开了一种可重复工作的电路，通过集成电路芯片与电路卡和电路板的控制崩溃芯片连接（“C4”）接合形成的封装，以及在芯片下方设置密封剂的直接芯片附接（“DCA”）。 密封剂提供C4连接的保护和与C4接头匹配的热膨胀。 然而，大多数密封剂干扰可再加工性。 所公开的电路封装通过提供帕利灵的钝化层是可再加工的，可干法加工的，通过气相沉积可均匀沉积来克服这个问题，在相对于C4剥离的3-5微米膜厚度的相对表面上形成薄膜 距离。

公开(公告)号：US5074969A

公开(公告)日：1991-12-24

申请号：US666007

申请日：1991-03-07

Applicant: William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

Inventor： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC: H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393

Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

Abstract translation: 本发明包括使用含铜/镍的合金组合物或者对铜载流导线施加保护性镍合金涂层，以防止带状自动键合（TAB）封装引线之间的电解迁移。

公开(公告)号：US5022462A

公开(公告)日：1991-06-11

申请号：US492601

申请日：1990-03-12

Applicant: Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

Inventor： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

IPC: H01L23/433 ,  H01L23/467

CPC classification number: H01L23/4338 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/3025

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.

Abstract translation: 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。

公开(公告)号：US4379218A

公开(公告)日：1983-04-05

申请号：US278964

申请日：1981-06-30

Applicant: Kurt R. Grebe ,  James M. E. Harper

Inventor： Kurt R. Grebe ,  James M. E. Harper

IPC: H05K3/34 ,  B23K1/005 ,  B23K1/20 ,  B23K17/00 ,  C23G5/00 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  B23K15/00

CPC classification number: H01L24/81 ,  B23K1/005 ,  B23K1/206 ,  B23K17/00 ,  C23G5/00 ,  H01L21/4864 ,  B23K2201/40 ,  H01L2224/75 ,  H01L2224/75102 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15787 ,  H05K3/3489

Abstract: A method for fluxlessly joining members having relatively low melting materials is provided. The members to be joined are exposed to ion beam radiation of sufficient intensity and a time sufficient to cause cleaning of the low melting materials after cooling. The members are then placed into juxtaposition with each other and again exposed to ion beam radiation of an intensity and for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members.

Abstract translation: 提供一种无熔接合具有较低熔点的材料的方法。 要连接的构件暴露于足够强度的离子束辐射和足以在冷却后对低熔点材料进行清洁的时间。 然后将构件彼此并置放置并再次暴露于强度的离子束辐射，并且足够的时间引起在冷却结合所述构件时低熔点材料的回流。

公开(公告)号：US5042709A

公开(公告)日：1991-08-27

申请号：US542271

申请日：1990-06-22

Applicant: Michael F. Cina ,  Mitchell S. Cohen ,  Ephraim B. Flint ,  Kurt R. Grebe ,  Douglas J. Hall ,  Kenneth P. Jackson ,  Modest M. Oprysko

Inventor： Michael F. Cina ,  Mitchell S. Cohen ,  Ephraim B. Flint ,  Kurt R. Grebe ,  Douglas J. Hall ,  Kenneth P. Jackson ,  Modest M. Oprysko

IPC: H01L21/30 ,  G02B6/42 ,  H01L21/027 ,  H01L21/68 ,  H01S5/00

CPC classification number: H01L21/681 ,  G02B6/4224 ,  G02B6/4236 ,  G02B6/4249 ,  G02B6/4226 ,  Y10T29/49131 ,  Y10T29/49133

Abstract: Methods and apparatus are set forth for passively and precisely aligning pairs of objects, in particular, microelectronic components such as semiconductor lasers and fibers, utilizing fiducial marks. Additionally, methods and apparatus are set forth for combining passive and active alignment techniques where high degrees of alignment precision are required. Still further, techniques are described for fixing prealigned objects, independent of how the objects are prealigned, to a mounting surface in a manner that maintains the relative (aligned) position of the objects. Further yet, in order to help minimize manufacturing costs with respect to production of, for example, microelectronic assemblies, batch processing techniques are described which utilize the novel alignment procedures contemplated by the invention.

公开(公告)号：US4970868A

公开(公告)日：1990-11-20

申请号：US370437

申请日：1989-06-23

Applicant: Kurt R. Grebe ,  Robert E. Schwall ,  Ho-Ming Tong

Inventor： Kurt R. Grebe ,  Robert E. Schwall ,  Ho-Ming Tong

IPC: H01L23/427 ,  H01L23/44 ,  H01L39/04

CPC classification number: H01L23/427 ,  H01L23/445 ,  H01L2924/0002

Abstract: The superior thermal conductivity of immersion cooling combined with the service convenience of conduction cooling is provided through the use of unitary thermal transfer replaceable units positioned beneath a refrigeration source. Each unit contains electronic devices in a thermal transfer fluid. The unit construction permits replaceability in service without exposing a central fluid reservoir or opening a refrigerator.