Abstract:
The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.
Abstract:
An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.
Abstract:
A semiconductor strain gauge may be incorporated into a flexible printed circuit. The semiconductor strain gauge may be mounted in an opening in the flexible printed circuit. Electrical connections such as wire bonds may couple the semiconductor strain gauge to metal traces on a flexible printed circuit substrate in the flexible printed circuit. A flexible printed circuit opening may be filled with an encapsulant that encapsulates a semiconductor strain gauge. Vias may be formed through the encapsulant to contact the semiconductor strain gauge. Metal traces that run across the surface of the substrate and the encapsulant may contact the vias to form paths to the semiconductor strain gauge. A semiconductor strain gauge may be mounted on a substrate and covered with dielectric. Metal traces in a redistribution layer in the dielectric may overlap the semiconductor strain gauge and make contact to the semiconductor strain gauge.
Abstract:
A personal audio device has a bone conduction pickup transducer, having a housing of which a rigid outer wall has an opening formed therein. A volume of yielding material fills the opening in the rigid outer wall. An electronic vibration sensing element is embedded in the volume of yielding material. The housing is shaped, and the opening is located, so that the volume of yielding material comes into contact with an ear or cheek of a user who is using the personal audio device. Other embodiments are also described and claimed.
Abstract:
A portable consumer electronics device has a handheld portable device housing, and an electronic camera module integrated in the housing. The module has a focusing lens to focus light from a scene, an imaging sensor to receive the focused light, and an electro-optic variable aperture to allow different amounts of the light from the scene to reach the imaging sensor. The aperture has a stack that includes a front transparent conductor medium, an electrolyte medium, an active electro-chromic medium, and a rear transparent conductor medium. Other embodiments are also described and claimed.