公开(公告)号：US20140209691A1

公开(公告)日：2014-07-31

申请号：US14225570

申请日：2014-03-26

Applicant: David Finn ,  Mustafa Lotya

Inventor： David Finn ,  Mustafa Lotya

IPC: G06K19/077

CPC classification number: G06K19/07769 ,  G06K19/07794 ,  H01F27/365 ,  H01F38/14 ,  H01F41/16 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0233 ,  H05K1/183 ,  H05K3/1275 ,  H05K2201/0218 ,  H05K2201/0723 ,  H05K2201/086 ,  H05K2201/10098

Abstract: Selective deposition of magnetic material such as particles, and producing a pre-laminated stack of shielding layers for offsetting attenuation of RF caused by a metal face plate of a smart card (or tag) or a metallized layer near a passive transponder. Coated or uncoated magnetic particles of different sizes may be used to increase the packing density of the material after its deposition on a substrate. Magnetography-based techniques may be used to apply the particles, at high packing density, including different-sized particles to a substrate such as PVC. Magnetic particles may be used as a carrier medium to deposit other particles nanoparticles. A system for selective deposition is disclosed.

Abstract translation: 选择性沉积诸如颗粒的磁性材料，并且产生用于抵消由智能卡（或标签）的金属面板或无源应答器附近的金属化层引起的RF衰减的屏蔽层的预叠层叠层。 可以使用不同尺寸的涂覆或未涂覆的磁性颗粒来增加材料沉积在基底上后的堆积密度。 可以使用基于磁图的技术将颗粒以高填充密度（包括不同大小的颗粒）施加到诸如PVC的基材上。 磁性颗粒可以用作载体介质以沉积其他颗粒纳米颗粒。 公开了用于选择性沉积的系统。

公开(公告)号：US08608080B2

公开(公告)日：2013-12-17

申请号：US12545825

申请日：2009-08-22

Applicant: David Finn

Inventor： David Finn

IPC: G06K19/00

CPC classification number: B42D15/00 ,  B32B37/1207 ,  B32B38/10 ,  B32B2037/1269 ,  B32B2305/342 ,  B32B2425/00 ,  G06K19/025 ,  G06K19/0672 ,  G06K19/07318 ,  G06K19/07327 ,  G06K19/07722 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  Y10T156/10 ,  Y10T156/1002 ,  Y10T156/1082 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2224/45639 ,  H01L2924/00015 ,  H01L2924/20752 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758

Abstract: Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.

公开(公告)号：US08522431B2

公开(公告)日：2013-09-03

申请号：US12877085

申请日：2010-09-07

Applicant: David Finn

Inventor： David Finn

IPC: H01R43/00

CPC classification number: G06K19/07783 ,  G06K19/07722 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/78301 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49167 ,  Y10T29/49174 ,  Y10T29/5313 ,  Y10T29/532 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for nicking the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.

Abstract translation: 在安装到嵌入式基板期间，天线的至少一个端部（包括端部）直接定位在芯片模块的端子上，用于随后连接到芯片模块。 公开了一种超声波发生器，其具有用于切割线的毛细管上方的切割器。 天线可以包括两个单独的短截线，每个短截线具有位于芯片模块的端子上的端部（包括端部）。 公开了用于安装天线线的附加技术。

公开(公告)号：US08366009B2

公开(公告)日：2013-02-05

申请号：US13310718

申请日：2011-12-03

Applicant: David Finn ,  Klaus Ummenhofer

Inventor： David Finn ,  Klaus Ummenhofer

IPC: G06K19/06

CPC classification number: G06K19/077 ,  G06K19/07747 ,  G06K19/07756 ,  G06K19/07769 ,  H01F38/14 ,  H01L2224/45015 ,  H01L2924/181 ,  H01L2924/20758 ,  H01L2924/00012

Abstract: A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a “quasi-dipole”. Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).

Abstract translation: 一种双接口（DI）智能卡（100），包括芯片模块（CM），模块天线（MA），卡体（CB）和具有两个绕组（D，E）的反向连接的卡片天线 相作为准偶极子。 与模块天线（MA）的天线结构（A）连接的电容性短截线（B，C）。 模块天线（MA）仅与卡天线（CA）的绕组（D或E）中的一个重叠。 卡片天线（CA）可以由一根连续的线形成。 铁氧体（156）屏蔽模块天线（MA）与接触焊盘（CP），并增强模块天线（MA）和卡片天线（CA）之间的耦合。

公开(公告)号：US20120080527A1

公开(公告)日：2012-04-05

申请号：US13027415

申请日：2011-02-15

Applicant: David Finn

Inventor： David Finn

IPC: G06K19/077 ,  H01P11/00

CPC classification number: H01P11/001 ,  G06K19/07722 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/78301 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/181 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q7/00 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49124 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49162 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/20759 ,  H01L2924/20758 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2924/01033

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract translation: 在天线基板（载体层或薄膜或网状物）上形成具有多个导线（导线，箔，导电材料）的天线结构，使用拾取台架或通过冲模将天线结构从天线基板单独移除， 激光切割或层压，以及将其端部（终端）的天线结构传送到固定位置，以安装到嵌入式衬底上的选定的应答器位置上，并将天线结构的对准终端连接到RFID（无线电 频率识别）芯片或芯片模块设置在嵌入式衬底上或其中。 接触传递过程能够将多个天线结构同时传送到多个应答器站点。

公开(公告)号：US07980477B2

公开(公告)日：2011-07-19

申请号：US12117748

申请日：2008-05-09

Applicant: David Finn

Inventor： David Finn

IPC: G06K19/06 ,  H01Q1/40 ,  H01Q1/36 ,  G08B13/14

CPC classification number: G06K19/077 ,  G06K19/0775 ,  G06K19/07769 ,  Y10T29/49016 ,  Y10T29/49124

Abstract: A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.

Abstract translation: 具有底片的双界面嵌体; 安装在底片顶面的天线; 天线线的端部形成有波纹或曲折形成的表面积增加的接触区域，用于随后将芯片或芯片模块附接到天线线; 导电材料施加到天线的端部; 设置在所述底部片材上以用于层压的顶片; 以及形成在顶片的底表面中的与接触区域对应的位置的凹部。 天线线可以是绝缘线，并且可以从天线线的端部去除绝缘。 硅垫可以设置在接触区域下方的底部片材中。

公开(公告)号：US20100141453A1

公开(公告)日：2010-06-10

申请号：US11860162

申请日：2007-09-24

Applicant: David Finn

Inventor： David Finn

IPC: G08B13/14 ,  H01S4/00 ,  H01P11/00 ,  H05K3/00

CPC classification number: H01L23/49855 ,  G06K19/07749 ,  G06K19/0775 ,  H01F41/041 ,  H01F41/064 ,  H01L23/48 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2223/6677 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/4809 ,  H01L2224/4813 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/2076 ,  H01L2924/30107 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49071 ,  Y10T29/49117 ,  Y10T29/49128 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.

Abstract translation: 提供了一种用于制造射频（RF）嵌体的方法和装置。 RF嵌体包括集成电路和固定到承载集成电路的基板材料的天线。 在处理期间，形成天线的线的部分位于与集成电路相邻而不是直接位于集成电路上。 在随后的处理步骤中，将导线端部放置成与集成电路端子区域接触并固定到集成电路端子区域。

公开(公告)号：US20060208066A1

公开(公告)日：2006-09-21

申请号：US11355264

申请日：2006-02-15

Applicant: David Finn ,  Dennis Ryan

Inventor： David Finn ,  Dennis Ryan

IPC: G06K5/00 ,  G06K7/06 ,  G06K7/08

CPC classification number: H04H60/63 ,  G06K7/0004 ,  G06K19/07732 ,  G06K19/07733 ,  G06K19/07769 ,  G06Q20/353 ,  G07F7/0873 ,  H04H20/93 ,  H04H60/372 ,  H04H60/74 ,  H04L67/02

Abstract: An RFID token apparatus has a connection module for interfacing with an appliance capable of communicating and interacting with remote servers and networks, a translation module for moving signals between a USB interface and a smart card interface, a processor module which may be capable of operating as a dual-interface (DI) chip; and an input/output module having at least one RF antenna and a modulator. An RFID-contactless interface according to ISO 14443 & ISO 15693 and/or NFC. A wireless interface according to Zigbee, Bluetooth, WLAN 802.11, UWB, USB wireless and/or any similar interface. An RFID reader apparatus has a housing; a slot for a contact or contactless fob; and a USB stick alternately protruding from the housing and retracted within the housing.

Abstract translation: RFID标记设备具有用于与能够与远程服务器和网络通信和交互的设备进行接口的连接模块，用于在USB接口和智能卡接口之间移动信号的翻译模块，可以作为 双接口（DI）芯片; 以及具有至少一个RF天线和调制器的输入/输出模块。 根据ISO 14443和ISO 15693和/或NFC的RFID无接触接口。 根据ZigBee，Bluetooth，WLAN 802.11，UWB，USB无线和/或任何类似接口的无线接口。 RFID读取器装置具有壳体; 用于接触或非接触式小袋的槽; 以及从外壳交替地突出并缩回到外壳内的U盘。

公开(公告)号：US20210056374A1

公开(公告)日：2021-02-25

申请号：US17006792

申请日：2020-08-29

Applicant: Mustafa Lotya ,  David Finn ,  Darren Molloy

Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16

Abstract: A capacitive coupling enhanced (CCE) transponder chip module (TCM) comprises an RFID chip (CM, IC), optionally contact pads (CP), a module antenna (MA), and a coupling frame (CF), all on a common substrate or module tape (MT). The coupling frame (CF, 320A) may be in the form of a ring, having an inner edge (IE), an outer edge IE, 324) and a central opening (OP), disposed closely adjacent to and surrounding the module antenna (MA). A slit (S) may extend from the inner edge (IE) to the outer edge (OE) of the coupling frame (CF) so that the coupling frame (CF) is “open loop”. An RFID device may comprise a transponder chip module (TCM) having a module antenna (MA), a device substrate (DS), and an antenna structure (AS) disposed on the device substrate (DS) and connected with the module antenna (MA). A portion of a conductive layer (CL, 904) remaining after etching a module antenna (MA) may be segmented to have several smaller isolated conductive structures.

公开(公告)号：US10599972B2

公开(公告)日：2020-03-24

申请号：US16199271

申请日：2018-11-26

Applicant: David Finn ,  Mustafa Lotya ,  Darren Molloy

Inventor： David Finn ,  Mustafa Lotya ,  Darren Molloy

IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16 ,  H05K3/10 ,  H01F38/14 ,  H01F27/28

Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.