Abstract:
The present invention is a reflective mask blank used to fabricate a reflective mask, which has a laminated structure of a multilayer reflective film, an absorber film and an etching mask film in this order on a substrate, wherein the etching mask film comprises a material containing chromium, the absorber film comprises a material containing tantalum, a highly oxidized layer is formed on the surface layer of the absorber film on the opposite side from the substrate, and a Ta 4f narrow spectrum of the highly oxidized layer when analyzed by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of more than 23 eV.
Abstract:
Provided are a mask blank for which worsening of flatness has been inhibited, a transfer mask, a method of manufacturing a mask blank, a method of manufacturing a transfer mask, and a method of manufacturing a semiconductor device using this transfer mask. The mask blank is a mask blank provided with a thin film on a main surface of a glass substrate, wherein the glass substrate has a hydrogen content of less than 7.4×1018 molecules/cm3, the thin film is made of a material containing tantalum and being substantially free of hydrogen, and the thin film is formed in contact with the main surface of the glass substrate.
Abstract translation:提供了一种掩模坯料,其平面度恶化被抑制,转印掩模,掩模板的制造方法,制造转印掩模的方法以及使用该转印掩模制造半导体器件的方法。 掩模坯料是在玻璃基板的主表面上设置有薄膜的掩模坯料,其中玻璃基板的氢含量小于7.4×10 18分子/ cm 3,薄膜由含钽的材料制成, 基本上不含氢,并且薄膜形成为与玻璃基板的主表面接触。
Abstract:
The present invention is a mask blank used to fabricate a transfer mask, which has a laminated structure of a light shielding film and an etching mask film in this order on a transparent substrate, wherein the etching mask film comprises a material containing chromium, the light shielding film comprises a material containing tantalum, a highly oxidized layer is formed on the surface layer of the light shielding film on the opposite side from the transparent substrate, and a Ta 4 f narrow spectrum of the highly oxidized layer analyzed by X-ray photoelectron spectroscopy has a maximum peak at a binding energy of more than 23 eV.
Abstract:
A mask blank is used for manufacturing a binary mask adapted to be applied with ArF excimer laser exposure light and has a light-shielding film for forming a transfer pattern on a transparent substrate. The light-shielding film has a laminated structure of a lower layer and an upper layer and has an optical density of 2.8 or more for the exposure light. The lower layer is made of a material containing tantalum and nitrogen and has a thickness of 33 nm or more. The upper layer is made of a material containing tantalum and oxygen and has a thickness of 3 nm or more. The phase difference between the exposure light transmitted through the light-shielding film and the exposure light transmitted in air for a distance equal to the thickness of the light-shielding film is 60 degrees or less.