公开(公告)号：US20060257664A1

公开(公告)日：2006-11-16

申请号：US11307854

申请日：2006-02-24

Applicant: Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

Inventor： Ming-Hang Hwang ,  Yu-Chiang Cheng ,  Chao-Yi Chen ,  Hsin-Lung Kuo ,  Bin-Wei Lee ,  Wei-Chung Hsiao

IPC: B32B9/00

CPC classification number: H05K3/28 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0179 ,  H05K2201/0323 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/30

Abstract: This invention discloses a manufacturing method and a structure for printed circuit boards. The printed circuit boards are often used for supporting electronic components in circuit and conducting the heat from electronic components. The printed circuit board structure includes a laminated structure. The laminated structure comprises an electric conduction layer and an insulation layer. The electric conduction layer can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element. The insulation layer can be made of thermal conduction material as well, combining a bracket structure of carbon element. The bracket structure of carbon element has high thermal conductivity so as to improve the heat conduction efficiency. The corresponding manufacturing method for this thermal conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on a surface of the metal and also can be mixed into the metal.

Abstract translation: 本发明公开了一种印刷电路板的制造方法和结构。 印刷电路板通常用于支持电路中的电子元件并从电子元件传导热量。 印刷电路板结构包括层叠结构。 层叠结构包括导电层和绝缘层。 导电层可以由特殊的导热材料制成，包括金属和碳元素的支架结构。 绝缘层也可以由导热材料制成，结合碳元素的支架结构。 碳元素的支架结构具有高导热性，从而提高导热效率。 该导热材料的相应制造方法可以通过化学气相沉积，物理气相沉积，电镀或其它材料制备方法制备。 碳元素的支架结构可以涂覆在金属的表面上，并且也可以混入金属中。

公开(公告)号：US06792056B1

公开(公告)日：2004-09-14

申请号：US09698098

申请日：2000-10-30

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H04L2508

CPC classification number: H01L23/66 ,  H01L23/552 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/1903 ,  H01L2924/00

Abstract: The specification discloses a cancellation circuit that suppresses electromagnetic interference in a high speed circuit using a function generator so as to utilize differential signals to cancel the magnetic field and to couple with the electric field without affecting the quality of signals. The differential signals are generated from a clock pin of the function generator, which is phase shifted by a phase shifter and passes through a microstrip antenna or a stripline antenna so as to emit electromagnetic waves with inversed phases, canceling the originally existent electromagnetic waves.

Abstract translation: 本说明书公开了一种消除电路，其使用功能发生器抑制高速电路中的电磁干扰，以利用差分信号来消除磁场并与电场耦合而不影响信号的质量。 差分信号由函数发生器的时钟引脚产生，该时钟引脚被移相器相移并通过微带天线或带状天线，以发射具有反相的电磁波，从而抵消了原本存在的电磁波。

公开(公告)号：US06429749B1

公开(公告)日：2002-08-06

申请号：US09708013

申请日：2000-11-08

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H04B328

CPC classification number: H04B3/28

Abstract: The invention is a cancellation circuit that suppresses electromagnetic interference in a high speed circuit, which achieves the objects of canceling the magnetic field and coupling the electric field through a differential signal under the premise of not affecting the signal quality. The differential signal is generated from the original high speed circuit using a phase shifter. Suitable phase shifters include a same-layer type, a meander type and a different-layer stacking type.

Abstract translation: 本发明是抑制高速电路中的电磁干扰的消除电路，其实现了在不影响信号质量的前提下通过差分信号来消除磁场和耦合电场的目的。 使用移相器从原始高速电路产生差分信号。 合适的移相器包括相同层型，曲折型和不同层叠式。

公开(公告)号：US06384340B1

公开(公告)日：2002-05-07

申请号：US09800408

申请日：2001-03-06

Applicant: Yu-Chiang Cheng

Inventor： Yu-Chiang Cheng

IPC: H05K103

CPC classification number: H05K1/024 ,  H05K1/0298 ,  H05K3/4688 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2201/09327

Abstract: A multi-layer circuit board includes first, second, third, fourth and fifth insulating substrates, first, second, third and fourth signal wiring layers, a ground wiring layer, and a power wiring layer. The insulating substrates and the wiring layers are press-bonded to each other to form the circuit board with a thickness of about 1.2 mm. Each of the first and fifth insulating substrates has a thickness ranging from 4.175 to 4.725 mil. Each of the second and fourth insulating substrates has a thickness ranging from 5.7 to 6.3 mil. The third insulating substrate has a thickness ranging to 16.8 mil.

Abstract translation: 多层电路板包括第一，第二，第三，第四和第五绝缘基板，第一，第二，第三和第四信号布线层，接地布线层和电源布线层。 绝缘基板和布线层彼此压接，形成约1.2mm厚度的电路板。 第一和第五绝缘基板中的每一个的厚度范围为4.175至4.725密耳。 第二绝缘基板和第四绝缘基板中的每一个具有5.7至6.3密耳的厚度。 第三绝缘基板的厚度为16.8密耳。