公开(公告)号：US5341980A

公开(公告)日：1994-08-30

申请号：US890255

申请日：1992-05-29

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Harada ,  Tetsuya Hayashida ,  Mitugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K31/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used. An alignment between two members to be bonded is provided by an alignment mark means which comprises a protrusion on a surface of one member and a complimental recess formed at a center portion of a protrusion means formed on a corresponding surface of the other member.

Abstract translation: 在用于制造电子电路器件的焊接方法中，在焊料的表面上的氧化物层和/或污染层和由此被焊接的部件被去除之后，通过用原子或离子进行溅射清洗，这些部件对准 在预定时间段内的氧化气氛中，然后，在非氧化性气氛中加热焊接材料进行焊接。 用于执行上述方法的装置包括溅射清洁装置，可在大气条件下操作的对准装置和可在非氧化或还原环境中操作的带式炉的形式的加热和焊接装置。 代替溅射清洁装置，可以使用机械抛光或切割装置来清洁焊料或待结合的部件的表面，或者可以使用镀有金的焊球。 要结合的两个构件之间的对准由对准标记装置提供，该对准标记装置包括在一个构件的表面上的突起和形成在形成在另一构件的相应表面上的突出装置的中心部分处的补充凹部。

公开(公告)号：US5340011A

公开(公告)日：1994-08-23

申请号：US988299

申请日：1992-12-09

Applicant: Antonio Sanchez

Inventor： Antonio Sanchez

IPC: B23K20/00 ,  H01L21/00 ,  B23K37/04

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2201/40 ,  H01L2224/45124 ,  H01L2224/4847 ,  H01L2224/78313 ,  H01L2224/7865 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01322 ,  H01L2924/14

Abstract: In a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the die/package off of a carrier. The adjustable stop mechanism includes a first, stationary bracket having a leg extending towards a movable lifting member of the bonder, and a second bracket mounted to the movable lifting member. A set screw extending through the leg of the first bracket limits the upward movement of the movable member, and ensures that the front surface of a die being bonded is at an optimum position for bonding.

Abstract translation: 在半导体引线接合器中，通过提供一种可调整的止动机构来提高模具/封装从载体上的向上位移，减轻了对于每个不同的管芯/封装厚度组合频繁更换卡盘和重新聚焦光学设备的需求。 可调节止动机构包括第一固定支架，其具有朝向连接器的可移动提升构件延伸的支脚，以及安装到可移动提升构件的第二支架。 延伸穿过第一支架的腿部的固定螺钉限制了可动构件的向上运动，并且确保正在接合的模具的前表面处于用于结合的最佳位置。

公开(公告)号：US5305944A

公开(公告)日：1994-04-26

申请号：US40249

申请日：1993-03-30

Applicant: Masaharu Yoshida ,  Yasufumi Nakasu ,  Masataka Takehara

Inventor： Masaharu Yoshida ,  Yasufumi Nakasu ,  Masataka Takehara

IPC: B23K1/005 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  B23K1/0053 ,  H01L21/67144 ,  H01L24/75 ,  B23K2201/40 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81191 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2224/86214 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042

Abstract: A bonding apparatus according to the present invention bonds a semiconductor chip to a conductive member in the face-down style without heating the semiconductor chip. The semiconductor chip which consists essentially of silicon is placed on leads which are put on a TAB tape. A glass plate member is mounted on the semiconductor chip. An infrared light beam is irradiated onto the semiconductor chip from above the semiconductor chip. Transmitted by the semiconductor chip, the infrared light beam illuminates bumps. As a result, the bumps heat up and melt. Since the semiconductor chip does not absorb the infrared light beam, bonding of the semiconductor chip to the leads does not cause a rise in temperature of the semiconductor chip. The bonding apparatus according to the present invention makes the face-down style bonding possible.

Abstract translation: 根据本发明的接合装置将半导体芯片以面朝下的形式粘合到导电构件而不加热半导体芯片。 基本上由硅组成的半导体芯片放置在放在TAB带上的引线上。 玻璃板构件安装在半导体芯片上。 红外光束从半导体芯片上方照射到半导体芯片上。 由半导体芯片传输，红外光束照亮凸起。 结果，凸块加热并熔化。 由于半导体芯片不吸收红外光束，所以半导体芯片与引线的接合不会导致半导体芯片的温度上升。 根据本发明的接合装置使得面朝下的接合成为可能。

公开(公告)号：US5298717A

公开(公告)日：1994-03-29

申请号：US931275

申请日：1992-08-17

Applicant: Thomas A. DeRossett, Jr.

Inventor： Thomas A. DeRossett, Jr.

IPC: B23K26/10 ,  B23K26/12 ,  B23K26/40 ,  B62D65/00 ,  B23K26/00

CPC classification number: B23K26/0643 ,  B23K26/10 ,  B23K26/12 ,  B23K26/1224 ,  B23K26/123 ,  B23K26/362 ,  B23K26/40 ,  B62D65/005 ,  B23K2201/40 ,  B23K2203/50

Abstract: Method and apparatus for scribing indicia into a surface using a laser as an emission source. Means are provided for controlling the beam scan over the surface being inscribed responsive to a digitized control signal representing the indicia. Laser power is controlled to avoid damaging the structural integrity of the glass. The system is suited for automation both for the input of data representing indicia and for the actual inscribing operation. The apparatus includes an emitter housing containing a laser and marking head for positioning the beam on the surface. The emitter housing further includes means for controllably directing the output beam to form the desired pattern in the surface and locating pins which cooperate with system circuitry to permit laser operation only when the emitter housing is properly located with respect to a surface being etched. A support system which includes a controller is provided which comprises means for data input and conversion of the input data into a control signal for controlling the laser.

Abstract translation: 使用激光作为发射源将标记划分成表面的方法和装置。 提供了用于响应于表示标记的数字化控制信号来控制正在被内接的表面上的束扫描的装置。 控制激光功率以避免损坏玻璃的结构完整性。 该系统适用于输入表示标记的数据和实际刻印操作的自动化。 该装置包括一个发射器外壳，其中包含用于将光束定位在表面上的激光和标记头。 发射器壳体还包括用于可控制地引导输出光束以在表面中形成所需图案并且定位销的装置，所述定位销与系统电路配合，以便仅当发射器壳体相对于被蚀刻的表面适当地定位才允许激光操作。 提供了一种包括控制器的支撑系统，其包括用于将输入数据输入和转换成用于控制激光器的控制信号的装置。

公开(公告)号：US5215940A

公开(公告)日：1993-06-01

申请号：US474911

申请日：1990-02-05

Applicant: John W. Orcutt ,  Randy O. Burrows

Inventor： John W. Orcutt ,  Randy O. Burrows

IPC: B23K20/00 ,  H01L21/603

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K20/007 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  B23K2201/40 ,  H01L2224/05554 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

Abstract: A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.

Abstract translation: 用于在接合期间使用于将半导体接合焊盘连接到引线框架指状物的接合线的环路的方法，以改善相邻接合线之间的间隙。

公开(公告)号：US5145531A

公开(公告)日：1992-09-08

申请号：US608042

申请日：1990-10-31

Applicant: Raymond L. Turner ,  Randall L. Mays ,  Billy L. Montgomery

Inventor： Raymond L. Turner ,  Randall L. Mays ,  Billy L. Montgomery

IPC: B23K1/20 ,  H05K3/34

CPC classification number: B23K1/203 ,  H05K3/3489 ,  B23K2201/40

Abstract: Apparatus and methods for fluxing with water-soluble flux. A circuit card assembly has its solderable surface exposed for fluxing. A spray nozzle atomizes the flux to provide a mist that wets the surface without creating flux droplets. A pump is coupled between the spray nozzle and a container which stores the flux for pumping flux and atomizing the flux to create the flux spray. The apparatus may be used as a stand alone fluxing station for use with a liquid wave solder or vapor solder system. Alternatively, the apparatus may be used as an integral part of a wave soldering system that replaces the conventional fluxing station. In this embodiment, the apparatus is located beneath the conveyor and a sensor is used to actuate the flux spray. A plurality of nozzles or pluralities of sets of nozzles may be employed to achieve proper wetting of the assembly. One fluxing and soldering method comprises providing a water-based soldering flux, and atomizing the flux to create a mist that is sufficient to wet the solderable surfaces of the assembly. The assembly is soldered within about ten minutes of the fluxing operation. If wave soldering is used, the conveyor speed is set at twice the speed for soldering with conventional RMA flux. The soldered assembly is cleaned within about fifteen minutes of soldering operation using a surfactant diluted in about forty gallons of deionized water and heated to between about 150 and 160 degrees Fahrenheit. Finally, the assembly is rinsed using deionized water.

Abstract translation: 用水溶性助焊剂助熔的设备和方法。 电路卡组件的可焊接表面暴露以进行焊接。 喷嘴雾化通量以提供润湿表面的雾而不产生通量液滴。 泵连接在喷嘴和容器之间，该容器存储用于泵送助焊剂的助熔剂并使助熔剂雾化以产生助焊剂喷雾。 该装置可以用作与液波焊料或蒸气焊料系统一起使用的独立的助熔炉。 或者，该装置可以用作代替传统的熔化站的波峰焊系统的组成部分。 在该实施例中，设备位于传送器下方，并且使用传感器来致动焊剂喷雾。 可以使用多个喷嘴或多组喷嘴来实现组件的适当润湿。 一种助熔和焊接方法包括提供水基焊剂，并且使助熔剂雾化以产生足以润湿组件的可焊接表面的雾。 组件在焊接操作的约十分钟内焊接。 如果使用波峰焊，传送带速度设定为传统RMA焊剂焊接速度的两倍。 焊接组件在焊接操作的大约十五分钟内使用稀释在约40加仑去离子水中的表面活性剂进行清洁，并加热至约150至160华氏度。 最后，使用去离子水漂洗组件。

公开(公告)号：US4927069A

公开(公告)日：1990-05-22

申请号：US377906

申请日：1989-07-10

Applicant: Takao Ushikubo ,  Yasuhiro Iwasa ,  Yukinori Yamaji

Inventor： Takao Ushikubo ,  Yasuhiro Iwasa ,  Yukinori Yamaji

IPC: B23K1/00 ,  H01L21/60 ,  H01R43/02 ,  H05K3/34

CPC classification number: H05K3/341 ,  B23K1/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01R43/02 ,  B23K2201/40 ,  H01L2224/16 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/14 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/0278 ,  H05K2203/1178 ,  H05K3/3489 ,  H05K3/3494 ,  Y02P70/613

Abstract: A soldering method is disclosed as adapted for attaching semiconductor devices such as transistors to their lead mounts. A layer of a solder paste, premixed with rosin flux, is first printed or otherwise formed on each of a series of interconnected semiconductor mounts which may be in the form of a sheet metal punching. The semiconductor devices are placed on the respective solder layers. Then the solder layers are heated to a prescribed temperature higher than both the melting point of the solder and a flux activation temperature at which the flux starts bubbling within the solder. For thus heating the solder layers, the series of semiconductor mounts with the semiconductor devices placed thereon via the solder layers may be fed longitudinally over a suitably heated surface. Upon lapse of a preassigned length of time following the activation of the flux, a compressive is exerted on the successive solder layers, thereby driving of the gas bubbles generated by the flux for the provision of joints of reduced thermal resistance.

Abstract translation: 公开了一种适于将诸如晶体管的半导体器件附接到它们的引线座上的焊接方法。 首先将一种与松香助熔剂混合的焊膏层印刷或以其它方式形成在一系列互连的半导体安装件中的每一个上，这些半导体安装件可以是金属片冲压的形式。 将半导体器件放置在相应的焊料层上。 然后将焊料层加热到高于焊料熔点的规定温度和焊剂开始在焊料内起泡的焊剂活化温度。 为了加热焊料层，通过焊料层将半导体器件放置在其上的一系列半导体安装件可以在适当加热的表面上纵向进给。 在磁通激活后经过预先指定的时间长度后，对连续的焊料层施加压缩，从而驱动由焊剂产生的气泡，以提供具有降低的热阻的接头。

公开(公告)号：US4767049A

公开(公告)日：1988-08-30

申请号：US864662

申请日：1986-05-19

Applicant: Sheldon H. Butt ,  Julius C. Fister ,  Jacob Crane

Inventor： Sheldon H. Butt ,  Julius C. Fister ,  Jacob Crane

IPC: B23K7/06 ,  B23K20/24 ,  B23K26/36 ,  H01L21/48 ,  H01L23/495 ,  H01L21/88

CPC classification number: H01L21/4821 ,  B23K20/24 ,  B23K26/362 ,  H01L23/49548 ,  H01L23/49586 ,  B23K2201/40 ,  B23K7/06 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T428/12472 ,  Y10T428/12993

Abstract: The present invention relates to a process for forming improved bonds between components of electrical or electronic devices. The process of the present invention preferably comprises annealing a metallic substrate to form a substantially uniform, substantially continuous oxide layer on a surface of the substrate, exposing the oxidized substrate to a reducing atmosphere so as to form an irregular surface on the substrate, and bonding another component to the irregular surface.

Abstract translation: 本发明涉及在电气或电子设备的部件之间形成改进的接合的方法。 本发明的方法优选包括退火金属基材以在基材的表面上形成基本均匀的基本上连续的氧化物层，将氧化的基底暴露于还原气氛中，以在基底上形成不规则的表面， 另一个组件到不规则表面。

公开(公告)号：US4632294A

公开(公告)日：1986-12-30

申请号：US684823

申请日：1984-12-20

Applicant: William O. Druschel ,  Alexander Kostenko ,  Rolf G. Meinert

Inventor： William O. Druschel ,  Alexander Kostenko ,  Rolf G. Meinert

IPC: H01L23/50 ,  B23K1/012 ,  B23K1/018 ,  H01R43/02 ,  H05K13/04 ,  B23K31/00

CPC classification number: H05K13/0404 ,  B23K1/012 ,  B23K1/018 ,  H05K13/0486 ,  B23K2201/40 ,  H01R43/02

Abstract: The disclosure is directed to process and apparatus for the removal, site preparation, and replacement of any single connector pin contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (substrate or module) without causing deleterious metallurgical effects either to the remaining pins or the ceramic substrate.

Abstract translation: 本公开涉及用于去除，现场准备和替换包含在电子封装结构（基板或模块）上的紧密间隔非常小的连接器针的相当大阵列中的任何单个连接器针的处理和装置，而不会引起有害的冶金效应 到剩余的引脚或陶瓷基板。

公开(公告)号：US4618088A

公开(公告)日：1986-10-21

申请号：US679170

申请日：1984-12-07

Applicant: Heinz Karla

Inventor： Heinz Karla

IPC: H01R4/02 ,  B23K1/20 ,  C03C27/04 ,  H01R43/02 ,  B23K1/19

CPC classification number: H01R43/02 ,  B23K1/203 ,  B23K2201/40

Abstract: A process for improving the solderability of a layer of a silver frit burnt onto a glass pane and a current connecting element wherein a layer of enamel is disposed and the surface of soldering and the glass pane. According to the process the surface is treated with a fluorine containing etching agent prior to soldering. The fluorine containing etching agent may be an aqueous solution of an acid fluoride, such as ammonium hydrogen fluoride or alkali hydrogen fluoride.

Abstract translation: 一种用于改善燃烧到玻璃板上的银玻璃料层和当前连接元件的可焊性的方法，其中设置有一层搪瓷和焊接表面和玻璃板。 根据该方法，在焊接之前，用含氟蚀刻剂处理表面。 含氟蚀刻剂可以是氟化氢等氟化氢或碱金属氟化氢的水溶液。