公开(公告)号：US20170090184A1

公开(公告)日：2017-03-30

申请号：US14975871

申请日：2015-12-21

Applicant: APPLE INC.

Inventor： Alexander Shpunt ,  Yuval Gerson

IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  G02B26/08

CPC classification number: G02B26/101 ,  B81B3/0051 ,  B81B2201/042 ,  B81B2203/0136 ,  B81C1/00007 ,  G02B26/0841

Abstract: A mirror assembly includes a frame having a central opening and a mirror plate, which is contained within the central opening of the frame and is shaped to define separate first and second mirrors connected by a bridge extending between the first and second mirrors. A pair of hinges are connected between the frame and the mirror plate at locations on the central axis on opposing sides of the frame so as to enable rotation of the mirror plate about the central axis relative to the frame.

公开(公告)号：US20170031152A1

公开(公告)日：2017-02-02

申请号：US15225628

申请日：2016-08-01

Applicant: INTEL CORPORATION

Inventor： FAOUZI KHECHANA ,  NICOLAS ABELE

IPC: G02B26/08 ,  B81B7/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  G03B21/00 ,  B81C3/00

CPC classification number: G02B26/085 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/098 ,  B81C1/00214 ,  B81C1/00873 ,  B81C3/005 ,  B81C2203/054 ,  B81C2203/057 ,  G02B7/1821 ,  G02B26/0833 ,  G02B26/105 ,  G03B21/008 ,  H01L2224/48091 ,  H01L2924/1461 ,  H05K1/0269 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/189 ,  H05K3/328 ,  H05K3/34 ,  H05K2201/083 ,  H05K2201/10083 ,  H05K2203/049 ,  Y10T29/4913 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A MEMS micro-mirror assembly (250, 300, 270, 400) comprising, a MEMS device (240) which comprises a MEMS die (241) and a magnet (231); a flexible PCB board (205) to which the MEMS device (240) is mechanically, and electrically, connected; wherein the flexible PCB board (205) further comprises a first extension portion (205b) which comprises a least one electrical contact (259a,b) which is useable to electrically connect the MEMS micro-mirror assembly (250, 300, 270, 400) to another electrical component). There is further provided a projection system comprising such a MEMS micro-mirror assembly (250, 300, 270, 400).

Abstract translation: 包括MEMS器件（240）的MEMS微反射镜组件（250,3300,270,400），其包括MEMS管芯（241）和磁体（231）; MEMS器件（240）机械地并电连接到的柔性PCB板（205）; 其中所述柔性PCB板还包括第一延伸部分（205b），所述第一延伸部分包括至少一个电触头（259a，b），所述电触头可用于电连接所述MEMS微反射镜组件（250,300,270,400） 到另一个电气部件）。 还提供了一种包括这种MEMS微镜组件（250,300,270,400）的投影系统。

公开(公告)号：US20170017074A1

公开(公告)日：2017-01-19

申请号：US15280557

申请日：2016-09-29

Applicant: WASEDA UNIVERSITY

Inventor： Eiji Iwase ,  Chisa Iino

IPC: G02B26/08 ,  G02B26/10 ,  B81B3/00

CPC classification number: G02B26/0833 ,  B81B3/00 ,  B81B3/0062 ,  B81B2201/042 ,  G02B26/0841 ,  G02B26/085 ,  G02B26/101

Abstract: Provided is a micro drive unit, which is capable of performing multi-axis drive, the micro drive unit including: a movable object; and at least one pair of beams configured to pivotally support the movable object and formed only in one direction, the movable object being configured to rotate or translate in an x-axis direction, a y-axis direction, and a z-axis direction when the at least one pair of beams is twisted or bent at one or a plurality of resonant frequencies of the at least one pair of beams, thereby being capable of simultaneously avoiding upsizing and complication of the structure. And by incorporating the micro drive unit, a micro device capable of achieving multi-axis drive can be manufactured.

Abstract translation: 提供能够执行多轴驱动的微驱动单元，所述微驱动单元包括：可移动物体; 以及至少一对梁，其被构造成枢转地支撑所述可移动物体并仅在一个方向上形成，所述可移动物体被构造成在x轴方向，y轴方向和z轴方向上旋转或平移， 所述至少一对光束在所述至少一对光束的一个或多个谐振频率处被扭曲或弯曲，从而能够同时避免所述结构的大尺寸和复杂化。 通过并入微驱动单元，可以制造能够实现多轴驱动的微型装置。

公开(公告)号：US09523625B2

公开(公告)日：2016-12-20

申请号：US14433688

申请日：2013-12-12

Applicant: PRIMESENSE LTD.

Inventor： Alexander Shpunt

IPC: G01B9/00 ,  G01M11/00 ,  B81C99/00 ,  G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G01N27/00 ,  G01R31/02 ,  H01L21/306

CPC classification number: G01M11/005 ,  B81B3/004 ,  B81B2201/042 ,  B81B2203/058 ,  B81C1/00015 ,  B81C99/003 ,  G01N27/00 ,  G01R31/026 ,  G02B26/0833 ,  H01L21/306

Abstract: A method for monitoring includes providing a device (64) including a first part (46) and a second part (72) and a movable joint (70) connecting the first part to the second part. An electrical characteristic of a conductive path (80) crossing the movable joint is measured, and a remedial action is initiated in response to detecting a change of the electrical characteristic.

Abstract translation: 一种用于监视的方法包括提供包括第一部分（46）和第二部分（72）的装置（64）和将第一部分连接到第二部分的可移动接头（70）。 测量与可移动接头交叉的导电路径（80）的电特性，并且响应于检测到电特性的变化而启动补救动作。

公开(公告)号：US09493347B2

公开(公告)日：2016-11-15

申请号：US14508194

申请日：2014-10-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Yi-Hsien Chang ,  Chun-Ren Cheng ,  Yi-Shao Liu ,  Allen Timothy Chang ,  Ching-Ray Chen ,  Yeh-Tseng Li ,  Wen-Hsiang Lin

IPC: B23P15/00 ,  C03C25/00 ,  C23F1/00 ,  B44C1/22 ,  C03C25/68 ,  C25F3/00 ,  B81C1/00 ,  G01N27/447 ,  B82Y20/00

CPC classification number: B81C1/00349 ,  B81B2201/042 ,  B81C1/00111 ,  B81C1/00206 ,  B81C1/00214 ,  B82Y20/00 ,  G01N27/44791

Abstract: A method of forming a semiconductor device includes depositing a light reflecting layer over a substrate. The method also includes forming a protection layer over the light reflecting layer. The method further includes forming an anti-reflective coating (ARC) layer over the protection layer. The method additionally includes forming an opening in the ARC layer, the protection layer and the light reflecting layer exposing the substrate. The method also includes removing the ARC layer in a wet solution comprising H2O2, the ARC layer being exposed to the H2O2 at a flow rate greater than about 10 standard cubic centimeters per minute (sccm).

Abstract translation: 形成半导体器件的方法包括在衬底上沉积光反射层。 该方法还包括在光反射层上形成保护层。 该方法还包括在保护层上形成抗反射涂层（ARC）层。 该方法还包括在ARC层中形成开口，保护层和曝光衬底的光反射层。 该方法还包括在包含H 2 O 2的湿溶液中去除ARC层，ARC层以大于约10标准立方厘米每分钟（sccm）的流速暴露于H 2 O 2。

公开(公告)号：US20160311678A1

公开(公告)日：2016-10-27

申请号：US15199604

申请日：2016-06-30

Applicant: Himax Display, Inc.

Inventor： Tung-Feng Wu ,  Wei-Hsiao Chen ,  Chun-Hao Su ,  Jui-Wen Chen ,  Mao-Chien Cheng

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B81B7/0041 ,  B81B7/0058 ,  B81B2201/042 ,  B81C2203/019 ,  G02B26/0833 ,  G02B27/0006 ,  H01L2924/16195 ,  H01L2924/16235

Abstract: A manufacturing method of a microelectromechanical system (MEMS) package structure includes providing a base, wherein the base comprises a recess; disposing a chip in the recess, wherein the chip has an active surface; disposing a MEMS device on the active surface in the recess, wherein the MEMS device is covered by a first cover, the first cover comprises a cavity, and the MEMS device is in the cavity; disposing a sealant at a peripheral gap between the chip and the first cover so as to seal the cavity; disposing a glass frit on a second cover or the base; disposing the second cover on the base, wherein the second cover covers the recess, and the glass frit is disposed between the base and the second cover; and heating the glass frit so as to seal the recess.

Abstract translation: 微机电系统（MEMS）封装结构的制造方法包括提供基座，其中所述基座包括凹部; 在所述凹部中设置芯片，其中所述芯片具有活性表面; 在所述凹部中的所述有源表面上设置MEMS器件，其中所述MEMS器件被第一盖覆盖，所述第一盖包括空腔，并且所述MEMS器件位于所述腔中; 在芯片和第一盖之间的周边间隙处设置密封剂以密封空腔; 将玻璃料放置在第二盖或基底上; 将第二盖设置在基座上，其中第二盖覆盖凹部，玻璃料布置在基座和第二盖之间; 并加热玻璃料以密封凹部。

公开(公告)号：US20160289066A1

公开(公告)日：2016-10-06

申请号：US15177129

申请日：2016-06-08

Applicant: Himax Display, Inc.

Inventor： Roland V. Gelder

IPC: B81C1/00 ,  C10M109/02 ,  C09D1/00 ,  C09D4/00 ,  G02B26/08 ,  B81B3/00

CPC classification number: B81C1/00968 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/00984 ,  B81C2201/112 ,  C09D1/00 ,  C09D4/00 ,  C10M109/02 ,  C10N2240/20 ,  G02B1/12 ,  G02B1/16 ,  G02B26/0833

Abstract: A method for forming an anti-stiction coating on a surface of a semiconductor device is provided. Using atomic layer deposition (ALD) processes to activate surface prior to anti-stiction coating deposition, anti-stiction coating having strong chemical bonding to the surface is obtained.

公开(公告)号：US20160259252A1

公开(公告)日：2016-09-08

申请号：US15155453

申请日：2016-05-16

Applicant: NIKON CORPORATION

Inventor： Yoshihiko SUZUKI ,  Junji SUZUKI

IPC: G03F7/20 ,  G02B26/08 ,  G02B26/06 ,  G02B5/00 ,  G02B26/02

CPC classification number: G03F7/70191 ,  B81B2201/042 ,  B81B2207/012 ,  B81C1/00317 ,  B81C3/005 ,  B81C2203/054 ,  G02B5/003 ,  G02B26/02 ,  G02B26/06 ,  G02B26/0833 ,  G02B26/0841 ,  G03F7/70291

Abstract: A spatial light modulation element module having a large area is manufactured. A spatial light modulation element module comprising a base member and a plurality of spatial light modulation element arrays, wherein each of the plurality of spatial light modulation element arrays has a light modulation element which modulates and emits at least one of the intensity and the phase of an incident light, and the base member maintains the plurality of spatial light modulation element arrays in a predetermined relative position in a bare chip state. In the above-described spatial light modulation element module, the plurality of spatial light modulation element arrays may be in a staggered arrangement in at least 1 direction.

Abstract translation: 制造具有大面积的空间光调制元件模块。 一种空间光调制元件模块，包括基底构件和多个空间光调制元件阵列，其中所述多个空间光调制元件阵列中的每一个具有光调制元件，所述光调制元件调制并发射所述光调制元件阵列的强度和相位中的至少一个 入射光，并且基底构件将多个空间光调制元件阵列保持在裸芯片状态的预定相对位置。 在上述空间光调制元件模块中，多个空间光调制元件阵列可以在至少1个方向上以交错排列。

公开(公告)号：US09359190B2

公开(公告)日：2016-06-07

申请号：US14320562

申请日：2014-06-30

Applicant: Himax Display, Inc.

Inventor： Chun-Hao Su

IPC: B81B7/00

CPC classification number: B81B7/0038 ,  B81B2201/042

Abstract: A MEMS package structure is disclosed. The MEMS package structure includes a first glass substrate on a micro-electromechanical systems (MEMS) structure, a sealant adhered between the first glass substrate and the MEMS structure; and a first moisture barrier on the sidewalls of the first glass substrate, the sealant, and the MEMS structure.

Abstract translation: 公开了一种MEMS封装结构。 MEMS封装结构包括微机电系统（MEMS）结构上的第一玻璃衬底，粘附在第一玻璃衬底和MEMS结构之间的密封剂; 以及在第一玻璃基板，密封剂和MEMS结构的侧壁上的第一湿气屏障。

公开(公告)号：US20160154233A1

公开(公告)日：2016-06-02

申请号：US14904213

申请日：2013-12-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Sadaharu TAKIMOTO ,  Masakuni KIMOTO ,  Norihide ADACHI

IPC: G02B26/08

CPC classification number: G02B26/0816 ,  B81B3/0021 ,  B81B2201/042 ,  G02B26/085 ,  G02B26/101

Abstract: A mirror device includes a mirror structure including a first movable portion and a second movable portion coupled to a support portion so as to be swingable, and, a mirror, a first coil, and a second coil disposed on the movable portions; a first magnetic portion and a second magnetic portion disposed on a same side as a back surface of the mirror structure to be opposed to the mirror structure, and having a magnetic pole of a first polarity and a magnetic pole of a second polarity, respectively; and a cap structure disposed on a same side as a surface of the mirror structure. The cap structure includes a first region having a magnetic pole of the first polarity, a second region having a magnetic pole of the second polarity, and an unmagnetized third region located between the first region and the second region.

Abstract translation: 镜装置包括：反射镜结构，包括第一可动部分和第二可移动部分，其联接到支撑部分以便可摆动;以及镜子，第一线圈和设置在可动部分上的第二线圈; 第一磁性部分和第二磁性部分，其设置在与镜子结构相对的反射镜结构的背面的相同侧上，并且分别具有第一极性的磁极和第二极性的磁极; 以及盖结构，其设置在与所述镜结构的表面相同的一侧上。 盖结构包括具有第一极性的磁极的第一区域，具有第二极性的磁极的第二区域和位于第一区域和第二区域之间的非磁化的第三区域。