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    Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods
    51.
    发明授权
    Microelectromechanical flexible membrane electrostatic valve device and related fabrication methods 失效
    微机电柔性膜静电阀装置及相关制造方法

    公开(公告)号：US06590267B1

    公开(公告)日：2003-07-08

    申请号：US09661997

    申请日：2000-09-14

    Applicant: Scott H. Goodwin-Johansson ,  Gary E. McGuire

    Inventor： Scott H. Goodwin-Johansson ,  Gary E. McGuire

    IPC: H01L2978

    CPC classification number: F16K99/0001 ,  B81B3/0021 ,  B81B2201/054 ,  B81B2203/0127 ,  B81B2203/04 ,  F15C5/00 ,  F16K99/0007 ,  F16K99/0028 ,  F16K99/0051 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2059/0081

    Abstract: A MEMS (Micro Electro Mechanical System) valve device driven by electrostatic forces is provided. This valve device can provide for fast actuation, large valve force and large displacements while utilizing minimal power. The MEMS valve device includes a substrate having an aperture formed therein, a substrate electrode, a moveable membrane that overlies the aperture and has an electrode element and a biasing element. Additionally, at least one resiliently compressible dielectric layer is provided to insure electrical isolation between the substrate electrode and electrode element of the moveable membrane. In operation, a voltage differential is established between the substrate electrode and the electrode element of the moveable membrane to move the membrane relative to the aperture to thereby controllably adjust the portion of the aperture that is covered by the membrane. Additional embodiments provide for the resiliently compressible dielectric layer to be formed on either or both the substrate electrode and the moveable membrane and provide for either or both the valve seat surface and the valve seal surface. In yet another embodiment the resiliently compressible dielectric layer(s) have a textured surface; either at the valve seat, the valve seal or at both surfaces. In another embodiment of the invention a pressure-relieving aperture is defined within the substrate and is positioned to underlie the moveable membrane. Alternatively, additional embodiments of the present invention provide for MEMS valve arrays driven by electrostatic forces. The MEMS valve array comprises a substrate having a plurality of apertures defined therein. A method for making the MEMS valve device is also provided.

    Abstract translation: 提供了由静电力驱动的MEMS（微机电系统）阀装置。 该阀装置可以提供快速致动，大的阀力和大的位移，同时利用最小的功率。 MEMS阀装置包括其中形成有孔的基板，基板电极，覆盖在孔上并具有电极元件和偏置元件的可移动膜。 此外，提供至少一个可弹性压缩介电层以确保基板电极和可移动​​膜的电极元件之间的电隔离。 在操作中，在基板电极和可移动​​膜的电极元件之间建立电压差以使膜相对于孔移动，从而可控地调节由膜覆盖的孔的部分。 另外的实施例提供了可弹性压缩的介电层，其形成在基板电极和可移动​​膜之一或两者上，并为阀座表面和阀密封表面中的一个或两者提供。 在另一个实施例中，弹性可压缩介电层具有纹理表面; 无论是在阀座，阀门密封件还是在两个表面。 在本发明的另一个实施例中，压力释放孔限定在衬底内并且被定位成可移动膜的下面。 或者，本发明的另外的实施例提供了由静电力驱动的MEMS阀阵列。 MEMS阀阵列包括其中限定有多个孔的基板。 还提供了制造MEMS阀装置的方法。

    Microelectromechanical valves including single crystalline material components
    54.
    发明授权
    Microelectromechanical valves including single crystalline material components 有权
    微电机阀包括单晶材料组分

    公开(公告)号：US06386507B2

    公开(公告)日：2002-05-14

    申请号：US09802260

    申请日：2001-03-08

    Applicant: Vijayakumar R. Dhuler ,  Mark David Walters

    Inventor： Vijayakumar R. Dhuler ,  Mark David Walters

    IPC: F16K3100

    CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening.

    Abstract translation: 提供了一种微电子机械（MEMS）装置，其包括微电子基板和热致动的微致动器以及设置在基板上并由单晶材料形成为单一结构的相关部件，其中相关部​​件由热致动器由微致动器致动 。 例如，MEMS器件可以是阀。 因此，阀可以包括至少一个阀板，该阀板通过选择性地致动微致动器而可控制地与微电子衬底中的至少一个阀开口接合。 虽然MEMS器件可以包括各种微致动器，微致动器有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱起，使得微致动器在关闭位置之间移动，在该关闭位置中阀板密封地接合阀开口和打开位置，在该位置阀板至少部分地 与阀开口脱离并不密封。

    Microelectromechanical valves including single crystalline material components
    56.
    发明申请
    Microelectromechanical valves including single crystalline material components 有权
    微电机阀包括单晶材料组分

    公开(公告)号：US20010017358A1

    公开(公告)日：2001-08-30

    申请号：US09802260

    申请日：2001-03-08

    Inventor： Vijayakumar R. Dhuler ,  Mark David Walters

    IPC: F16K031/02

    CPC classification number: F15C5/00 ,  B81B3/0051 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  B81C2203/031 ,  B81C2203/036 ,  F16K99/0001 ,  F16K99/0007 ,  F16K99/0009 ,  F16K99/0011 ,  F16K99/0036 ,  F16K2099/0074 ,  F16K2099/008 ,  H01H2001/0042

    Abstract: A microelectromechanical (MEMS) device is provided that includes a microelectronic substrate and a thermally actuated microactuator and associated components disposed on the substrate and formed as a unitary structure from a single crystalline material, wherein the associated components are actuated by the microactuator upon thermal actuation thereof. For example, the MEMS device may be a valve. As such, the valve may include at least one valve plate that is controllably brought into engagement with at least one valve opening in the microelectronic substrate by selective actuation of the microactuator. While the MEMS device can include various microactuators, the microactuator advantageously includes a pair of spaced apart supports disposed on the substrate and at least one arched beam extending therebetween. By heating the at least one arched beam of the microactuator, the arched beams will further arch such that the microactuator moves between a closed position in which the valve plate sealingly engages the valve opening and an open position in which the valve plate is at least partly disengaged from and does not seal the valve opening. The microactuator may further include metallization traces on distal portions of the arched beams to constrain the thermally actuated regions of arched beams to medial portions thereof. The valve may also include a latch for maintaining the valve plate in a desired position without requiring continuous energy input to the microactuator. An advantageous method for fabricating a MEMS valve having unitary structure single crystalline components is also provided.

    Abstract translation: 提供了一种微电子机械（MEMS）装置，其包括微电子基板和热致动的微致动器以及设置在基板上并由单晶材料形成为单一结构的相关部件，其中相关部​​件由热致动器由微致动器致动 。 例如，MEMS器件可以是阀。 因此，阀可以包括至少一个阀板，该阀板通过选择性地致动微致动器而可控制地与微电子衬底中的至少一个阀开口接合。 虽然MEMS器件可以包括各种微致动器，微致动器有利地包括设置在基板上的一对间隔开的支撑件和在其间延伸的至少一个拱形梁。 通过加热微致动器的至少一个拱形梁，拱形梁将进一步拱起，使得微致动器在关闭位置之间移动，在该关闭位置中阀板密封地接合阀开口和打开位置，在该位置阀板至少部分地 与阀开口脱离并不密封。 微致动器还可以包括在拱形梁的远侧部分上的金属化迹线，以将拱形梁的热致动区域约束到其中间部分。 阀还可以包括用于将阀板保持在期望位置的闩锁，而不需要连续的能量输入到微致动器。 还提供了一种用于制造具有单一结构单晶组件的MEMS阀的有利方法。

    Micropump with valve structure
    58.
    发明授权
    Micropump with valve structure 失效
    微型阀门结构

    公开(公告)号：US5259737A

    公开(公告)日：1993-11-09

    申请号：US724697

    申请日：1991-07-02

    Applicant: Shinichi Kamisuki ,  Yasuto Nose ,  Nobuo Shimizu ,  Shinichi Yotsuya

    Inventor： Shinichi Kamisuki ,  Yasuto Nose ,  Nobuo Shimizu ,  Shinichi Yotsuya

    IPC: B81B3/00 ,  F04B43/04 ,  F04B53/10 ,  H01L21/308 ,  F04B35/04

    CPC classification number: B81B3/0005 ,  F04B43/046 ,  F04B53/102 ,  H01L21/3083 ,  B81B2201/036 ,  B81B2201/054 ,  B81B2203/0127

    Abstract: A micropump for pumping liquid from an entry channel to an exit channel is disclosed. The micropump is formed in a semiconductor substrate sealed by two glass substrates. The micropump includes first and second chambers and flow channel means coupled between the two chambers. The micropump also includes a valve coupled between the entry channel and the first chamber. The valve includes a flexible valve membrane positioned closer to a second side of the semiconductor substrate than to its first side for causing the valve to be or not to be in contact with the second side of the semiconductor substrate for closing or opening the valve on the glass substrate. Additionally, the micropump includes a diaphragm forming part of a flexible wall of the second chamber and positioned closer to the second side of the semiconductor substrate than to its first side. The diaphragm is responsive to external pressure for causing liquid to be pumped from the entry channel to the exit channel. Thus, the height of the valve is reduced, preventing deformation due to strength such as its own weight and may impact due to a dropping. As a result, the valve sealing is improve on the glass substrate. Therefore, the micropump can accurately discharge a small quantity of liquid.

    Abstract translation: 公开了一种用于将液体从进入通道泵送到出口通道的微型泵。 微型泵形成在由两块玻璃基板密封的半导体基板中。 微型泵包括连接在两个室之间的第一和第二室和流动通道装置。 微型泵还包括连接在入口通道和第一室之间的阀。 阀包括位于比半导体衬底的第二侧更靠近第一侧的柔性阀膜，用于使阀与半导体衬底的第二侧接触或不与第二侧接触，以关闭或打开阀 玻璃基板。 此外，微型泵包括形成第二室的柔性壁的一部分并且比其第一侧更靠近半导体衬底的第二侧的膜片。 隔膜响应于外部压力，以使液体从入口通道泵送到出口通道。 因此，阀的高度减小，防止由于其自身重量等强度而引起的变形，并且可能由于跌落而撞击。 结果，玻璃基板上的阀密封得到改善。 因此，微型泵可以精确地排出少量的液体。

    Boron nitride membrane in wafer structure and process of forming the same
    59.
    发明授权
    Boron nitride membrane in wafer structure and process of forming the same 失效
    晶圆结构中的氮化硼薄膜及其形成过程

    公开(公告)号：US5066533A

    公开(公告)日：1991-11-19

    申请号：US754004

    申请日：1990-06-21

    Applicant: William G. America ,  Richard R. Poole

    Inventor： William G. America ,  Richard R. Poole

    IPC: C23C16/34 ,  G01N25/18 ,  G03F1/22

    CPC classification number: B81C1/00063 ,  C23C16/342 ,  G01N25/18 ,  G03F1/22 ,  B81B2201/054 ,  B81C2201/0136 ,  Y10T428/24479

    Abstract: A laminated structure includes a wafer member with a membrane attached thereto, the membrane being formed of substantially hydrogen-free boron nitride having a nominal composition B.sub.3 N. The structure may be a component in a mechanical device for effecting a mechanical function, or the membrane may form a masking layer on the wafer. The structure includes a body formed of at least two wafer members laminated together with a cavity formed therebetween, with the boron nitride membrane extending into the cavity so as to provide the structural component such as a support for a heating element or a membrane in a gas valve. In another aspect borom is selectively diffused from the boron nitride into a surface of a silicon wafer. The surface is then exposed to EDP etchant to which the diffusion layer is resistant, thereby forming a channel the wafer member with smooth walls for fluid flow.

    Abstract translation: 叠层结构包括具有膜的膜片构件，膜由具有标称组成B3N的基本上无氢的氮化硼形成。 该结构可以是用于实现机械功能的机械装置中的部件，或者膜可以在晶片上形成掩模层。 该结构包括由至少两个晶片构件形成的主体，所述至少两个晶片构件与形成在其间的空腔层压在一起，氮化硼膜延伸到空腔中，以便提供结构部件，例如气体中的加热元件或膜的支撑体 阀。 在另一方面，硼化物选择性地从氮化硼扩散到硅晶片的<100>表面。 然后将表面暴露于扩散层所抵抗的EDP蚀刻剂，从而形成具有平滑壁用于流体流动的晶片构件的通道。

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