公开(公告)号：US20230332032A1

公开(公告)日：2023-10-19

申请号：US18026889

申请日：2021-09-22

Applicant: DENKA COMPANY LIMITED

Inventor： Takuto OKABE ,  Motoharu FUKAZAWA

IPC: C09K5/14 ,  C01B33/26 ,  C08K3/34 ,  H05K1/03

CPC classification number: C09K5/14 ,  C01B33/26 ,  C08K3/34 ,  H05K1/0373 ,  C01P2006/32 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/12 ,  C01P2002/72 ,  C08K2201/001 ,  C08K2003/343 ,  C08K2201/005

Abstract: Oxide powder, of which a resin composition is obtained by mixing with a resin exhibits a low thermal expansion coefficient, high thermal conductivity and a low dielectric tangent. The oxide powder containing Ca, Al and Si; wherein the oxide powder contains 40% by mass or more of a crystal phase of high-temperature type cristobalite having Ca, Al and Si, based on the mass of the whole oxide powder; and wherein contents of Ca, Al and Si in the oxide powder are 1 to 5% by mole of CaO, 1 to 5% by mole of Al2O3 and 90 to 98% by mole of SiO2, respectively (the sum of contents of CaO, Al2O3 and SiO2 is 100% by mole) when converting the contents of Ca, Al and Si to contents of CaO, Al2O3 and SiO2.

公开(公告)号：US11786160B2

公开(公告)日：2023-10-17

申请号：US16272321

申请日：2019-02-11

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Jun Hatakeyama ,  Osamu Watanabe ,  Motoaki Iwabuchi ,  Shiori Nonaka ,  Koji Hasegawa

IPC: A61B5/25 ,  C08L33/14 ,  C08L41/00 ,  A61B5/00 ,  C08K3/04 ,  C08K3/08 ,  A61B5/0245

CPC classification number: A61B5/25 ,  A61B5/6802 ,  C08L33/14 ,  C08L41/00 ,  A61B5/0245 ,  A61B2562/0215 ,  C08K3/041 ,  C08K3/08 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2003/0831 ,  C08K2003/0862 ,  C08K2201/001 ,  C08L2203/02

Abstract: The present invention provides a bio-electrode composition comprising a polymer compound having a repeating unit A that contains silver salt of fluorosulfonic acid, silver salt of fluorosulfonimide, or silver salt of fluorosulfonamide. This can form a living body contact layer for a bio-electrode with excellent electric conductivity, biocompatibility and light weight, which can be manufactured at low cost and does not cause large lowering of the electric conductivity even when it is wetted with water or dried. The present invention also provides a bio-electrode in which the living body contact layer is formed from the bio-electrode composition and a method for manufacturing the bio-electrode.

公开(公告)号：US11773211B2

公开(公告)日：2023-10-03

申请号：US16404622

申请日：2019-05-06

Applicant: Jason D. Azoulay ,  Lifeng Huang ,  Alexander E. London ,  Naresh Eedugurala

Inventor： Jason D. Azoulay ,  Lifeng Huang ,  Alexander E. London ,  Naresh Eedugurala

IPC: C08G61/12 ,  C08K3/04 ,  C08J5/18 ,  H01B1/16 ,  H01B1/18

CPC classification number: C08G61/126 ,  C08J5/18 ,  C08K3/041 ,  H01B1/16 ,  H01B1/18 ,  C08G2261/122 ,  C08G2261/148 ,  C08G2261/1646 ,  C08G2261/18 ,  C08G2261/3223 ,  C08G2261/3225 ,  C08G2261/3241 ,  C08G2261/3243 ,  C08G2261/3246 ,  C08G2261/414 ,  C08G2261/514 ,  C08J2365/00 ,  C08K2201/001 ,  C08K2201/011

Abstract: The invention provides for polymer structures and their preparation and resulting novel functionalities including open-shell character and high intrinsic conductivity with wide-range tenability. Electrical conductivity can be further modulated by introducing or blending with materials, fillers, dopants, and/or additives. The materials or resultant composites of the invention can be processed by various techniques into different forms to realize multiple applications.

公开(公告)号：US20230295431A1

公开(公告)日：2023-09-21

申请号：US17801539

申请日：2020-05-06

Applicant: Dow Silicones Corporation

Inventor： Yan Huang ,  Dorab Bhagwagar ,  Zhongwei Cao

IPC: C08L83/06 ,  C08K3/36 ,  C08J7/04 ,  C08K3/22

CPC classification number: C08L83/06 ,  C08K3/36 ,  C08J7/0427 ,  C08K3/22 ,  C08J2383/06 ,  C08L2203/20 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/014

Abstract: A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; where the trialkoxy-functional polysiloxane has two or more trialkoxy functionalities per molecule and a number average molecular weight of 1200 or more and where weight-percents are relative to the composition weight.

公开(公告)号：US20230295398A1

公开(公告)日：2023-09-21

申请号：US18013754

申请日：2020-07-08

Applicant: SHOWA DENKO MATERIALS CO., LTD.

Inventor： Mika KOBUNE ,  Michiaki YAJIMA

IPC: C08K3/04 ,  C08J5/18 ,  H01L23/373 ,  H05K7/20

CPC classification number: C08K3/042 ,  C08J5/18 ,  H01L23/3731 ,  H01L23/3735 ,  H05K7/20481 ,  C08J2323/22 ,  C08K2201/001 ,  C08J2333/10

Abstract: One embodiment of the present invention relates to a thermally conductive sheet containing graphite particles (A) including at least one selected from the group consisting of flake-like particles, ellipsoidal particles, and cylindrical particles, in which the graphite particles (A) are oriented in a thickness direction, and a thickness compression ratio is 24% or more at a temperature of 150° C. and a compressive stress of 0.14 MPa.

公开(公告)号：US11749421B2

公开(公告)日：2023-09-05

申请号：US16964254

申请日：2019-03-18

Applicant: DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD.

Inventor： Shingo Tsukaguchi ,  Taiyo Aoyagi

IPC: H01B1/24 ,  C08K3/04 ,  B29C45/00 ,  C08K5/01 ,  C08K5/08 ,  C08K5/23 ,  C08K5/29 ,  C08K5/3437 ,  C08K5/3447 ,  C08K5/45 ,  C08K13/02 ,  C08J3/20 ,  C08K5/00 ,  B29B7/00 ,  B29B7/72 ,  B29K67/00 ,  B29K69/00 ,  B29K77/00 ,  B29K81/00 ,  B29K105/00

CPC classification number: H01B1/24 ,  B29B7/007 ,  B29B7/726 ,  B29C45/0001 ,  C08J3/20 ,  C08J3/203 ,  C08K3/04 ,  C08K3/041 ,  C08K5/0041 ,  C08K5/01 ,  C08K5/08 ,  C08K5/235 ,  C08K5/29 ,  C08K5/3437 ,  C08K5/3447 ,  C08K5/45 ,  C08K13/02 ,  B29K2067/006 ,  B29K2069/00 ,  B29K2077/00 ,  B29K2081/04 ,  B29K2105/0023 ,  B29K2105/0032 ,  B29K2995/0005 ,  C08K2201/001 ,  C08L81/02 ,  C08K3/00 ,  C08L67/00 ,  C08L69/00 ,  C08L77/00

Abstract: Provided is an electrically conductive resin composition with which the characteristics inherent in a thermoplastic resin are easily retained and which exhibits more excellent electrical conductivity even if the blending amount of an electrically conductive filler is small. This electrically conductive resin composition contains a thermoplastic resin, such as a polycarbonate or a polyolefin, and an electrically conductive filler, such as a carbon nanotube. This electrically conductive resin composition further contains a dye, such as a perinone-based dye or a disazo-based dye, which is a component for improving electrical conductivity, and this electrically conductive resin composition can be obtained by kneading or molding a raw material mixture containing a thermoplastic resin, an electrically conductive filler, and a dye under a condition of a temperature equal to or higher than the melting point of the thermoplastic resin.

公开(公告)号：US11746284B2

公开(公告)日：2023-09-05

申请号：US16625170

申请日：2018-06-26

Applicant: Merck Patent GmbH

Inventor： Tadashi Kishimoto ,  Yuki Hirayama ,  Tomohisa Goto ,  Masayoshi Suzuki ,  Teruaki Suzuki

IPC: C09K11/02 ,  C08F20/18 ,  C08F20/28 ,  C08K3/30 ,  C08K3/32 ,  C08K9/02 ,  C09K11/08 ,  C09K11/70 ,  C09K11/88 ,  H01L51/00 ,  B82Y20/00 ,  H01L51/50

CPC classification number: C09K11/02 ,  C08F20/18 ,  C08F20/28 ,  C08K3/30 ,  C08K3/32 ,  C08K9/02 ,  C09K11/0883 ,  C09K11/70 ,  C09K11/883 ,  H01L51/0035 ,  B82Y20/00 ,  C08K2201/001 ,  C08K2201/011 ,  H01L51/502

Abstract: The present invention relates to a composition comprising a semiconducting light emitting nanoparticle.

公开(公告)号：US11732172B2

公开(公告)日：2023-08-22

申请号：US16766121

申请日：2019-01-04

Applicant: CARNEGIE MELLON UNIVERSITY

Inventor： Navid Kazem ,  Michael D. Bartlett ,  Carmel Majidi

IPC: C09K5/14 ,  C08G77/04 ,  C08J3/20 ,  C08K3/08 ,  H01B1/22 ,  C08K3/02 ,  C09K5/10 ,  C08K3/10

CPC classification number: C09K5/14 ,  C08G77/04 ,  C08J3/203 ,  C08K3/02 ,  C08K3/08 ,  C08K3/10 ,  C09K5/10 ,  H01B1/22 ,  C08K2201/001 ,  C08K2201/005

Abstract: A method for synthesizing a thermally conductive and stretchable elastomer composite comprises mixing liquid metal and soft material (e.g., elastomer) in a centrifugal or industrial shear mixer under conditions such that the liquid metal forms microscale liquid metal droplets that are dispersed in the soft elastomer. Liquid metal-embedded elastomers, or “LMEEs,” formed in this manner dramatically increase the fracture energy of soft materials up to 50 times over an unfilled polymer. This extreme toughening is achieved by means of (i) increasing energy dissipation, (ii) adaptive crack movement, and (iii) effective elimination of the crack tip. Such properties arise from the deformability and dynamic rearrangement of the LM inclusions during loading, providing a new mechanism to not only prevent crack initiation, but also resist the propagation of existing tears for ultra-tough, highly functional soft materials.

公开(公告)号：US20230260671A1

公开(公告)日：2023-08-17

申请号：US18085463

申请日：2022-12-20

Applicant: NEXANS

Inventor： Gabriele PEREGO ,  Jihane SAHYOUN ,  Christian KOELBLIN ,  Massimiliano MAURI

IPC: H01B1/12 ,  H01B3/30 ,  C08J5/18 ,  C08J3/24 ,  C08K3/04 ,  C08K5/17 ,  C08J7/04

CPC classification number: H01B1/124 ,  H01B3/30 ,  C08J5/18 ,  C08J3/24 ,  C08K3/04 ,  C08K5/175 ,  C08J7/0427 ,  C08J2323/08 ,  C08J2323/14 ,  C08K2201/001

Abstract: An electrical cable or electrical cable accessory includes at least one semiconducting layer, and at least one electrically insulating layer, at least partially in direct contact with the semiconducting layer. The electrically insulating layer is obtained from an insulating polymer composition having a thermoplastic polymer material, and the semiconducting layer is at least partially crosslinked.

公开(公告)号：US20230250328A1

公开(公告)日：2023-08-10

申请号：US18106157

申请日：2023-02-06

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Naoyuki KUSHIHARA ,  Masahiro KANETA ,  Kazuaki SUMITA

IPC: C09K5/14 ,  C08K7/18

CPC classification number: C09K5/14 ,  C08K7/18 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006

Abstract: Provided is a resin composition that has a low viscosity when in the state of a composition, and provides a cured product having a high thermal conductivity, a high resin strength and a high adhesive force. The composition is a thermally conductive resin composition containing:



(A) 100 parts by mass of a heat-curable resin containing at least one kind selected from an epoxy resin, a cyclic imide compound and a cyanate ester resin; and
(B) a thermally conductive filler that has a thermal conductivity of not smaller than 10 W/m·K, and is in an amount of 100 to 3,000 parts by mass per 100 parts by mass of the component (A),
wherein the component (B) contains therein 40 to 85% by mass of a thermally conductive filler (B1) that has an average particle size of 35 to 200 μm and a specific surface area of not larger than 0.3 mm2/g.