Semiconductor wafer scanning system
    51.
    发明授权
    Semiconductor wafer scanning system 失效
    半导体晶圆扫描系统

    公开(公告)号:US4689491A

    公开(公告)日:1987-08-25

    申请号:US725082

    申请日:1985-04-19

    Abstract: A semiconductor wafer scanning system includes a confocal optical imaging system with a laser beam being focused on a small spot on the wafer surface to be scanned. The optics include an objective lens located closest to the wafer with means being provided to vary the spacing of the lens from the wafer over small distances to thus change the focal plane of the system. The wafer may be independently driven in two orthogonal directions in a plane generally perpendicular to the imaging system to bring selected portions thereof into view of the optics. During scanning, the wafer is rapidly vibrated in one of the directions while it is slowly moved in the other direction with a series of digital output signals being provided by the light reflected back from the laser spot on the moving wafer to provide precise information for constructing a three dimensional representation of the surface pattern of the wafer.

    Abstract translation: 半导体晶片扫描系统包括共聚焦光学成像系统,其中激光束聚焦在要扫描的晶片表面上的小点上。 光学器件包括位于最靠近晶片的物镜,其具有用于在较小距离上改变透镜与晶片的间隔,从而改变系统的焦平面。 晶片可以在大致垂直于成像系统的平面中在两个正交方向独立地驱动,以将其选定的部分带入光学器件的视野。 在扫描期间,晶片在其中一个方向上快速振动,同时沿着另一个方向缓慢移动,一系列数字输出信号由从移动晶片上的激光点反射回来的光提供,以提供用于构造的精确信息 晶片的表面图案的三维表示。

    OPTICAL INSPECTION SYSTEMS WITH PULSED LIGHT SOURCES AND PULSE MULTIPLEXING

    公开(公告)号:US20240280506A1

    公开(公告)日:2024-08-22

    申请号:US18409698

    申请日:2024-01-10

    CPC classification number: G01N21/9501 G01N2201/06113 G01N2201/103

    Abstract: Implementations disclosed describe, among other things, a sample inspection system that includes an illumination subsystem to illuminate a sample with a plurality of time-spaced light pulses generated, using a pulse multiplexing system, from a source light pulse. The pulse multiplexing system includes a plurality of optical loops, each deploying an optical coupler that outputs a first portion of incident light to a sample and provides a second portion of incident light as an input into the next optical loop. The sample inspection system further includes a collection subsystem to collect a portion of light generated upon interaction of the plurality of time-spaced light pulses with the sample, and a light detection subsystem to detect the collected portion of light.

    METHOD AND SENSOR FOR TESTING VALUE DOCUMENTS

    公开(公告)号:US20230316842A1

    公开(公告)日:2023-10-05

    申请号:US18017312

    申请日:2021-07-08

    Abstract: AMENDMENT TO THE ABSTRACT Please replace the Abstract in the application with the following Abstract, insert the following after the claims:
    ABSTRACT A method for checking value documents, in particular with regard to their authenticity and/or with regard to their value-document type, involves the following steps: detecting a first plurality of intensity courses on a value document, combining the first plurality of intensity courses or a second plurality of intensity courses selected from the first plurality into a combined intensity course, determining a time constant τ of the combined intensity course, checking the value document based on the time constant τ of the combined intensity course. A corresponding sensor is provided for checking value documents, and an apparatus enables value-document processing with the aforementioned sensor.

    EDGE PORTION MEASURING APPARATUS AND METHOD FOR MEASURING EDGE PORTION

    公开(公告)号:US20230258577A1

    公开(公告)日:2023-08-17

    申请号:US18153036

    申请日:2023-01-11

    Inventor: Shigeru Oba

    Abstract: An edge portion measuring apparatus for measuring shape of an edge portion of a wafer, including, a holding portion that holds the wafer, a rotating means for rotating the wafer, a sensor including a light projecting portion for projecting a laser light from a light source onto the edge portion of the wafer held by the holding portion, and a light receiving detection unit receiving diffuse reflected light that the laser light projected is reflected at the edge portion of the wafer, wherein, rotating the wafer while holding the wafer, at least in a range from normal direction of a held surface of the wafer to normal direction of a surface opposite to the held surface, projecting the laser light and detecting the diffuse reflected light by the sensor, being able to measure the shape of an entire area of the edge portion of the wafer by a triangulation method.

    REDUCING MEASUREMENT VARIATION TO OPTICAL MEASURING OF SAMPLE MATERIAL

    公开(公告)号:US20180038801A1

    公开(公告)日:2018-02-08

    申请号:US15787747

    申请日:2017-10-19

    Applicant: WALLAC OY

    Inventor: Ville LAITALA

    Abstract: A measurement device includes mechanical support elements (101-104) for supporting a sample well, other mechanical support elements (105-109) for supporting a measurement head (112) suitable for optical measurements, and a control system (111) configured to control the measurement head to carry out at least two optical measurements from at least two different measurement locations inside the sample well, where each measurement location is a center point of a capture range from which radiation is captured in the respective optical measurement. The final measurement result is formed from the results of the at least two optical measurements in accordance with a pre-determined rule. The use of the at least two optical measurements from different measurement locations reduces measurement variation in situations where the sample well (153) contains a piece (158) of sample carrier.

    ILLUMINATION UNIT FOR DIGITAL PATHOLOGY SCANNING

    公开(公告)号:US20180024345A1

    公开(公告)日:2018-01-25

    申请号:US15535178

    申请日:2016-02-19

    Abstract: The present invention relates to digital pathology, and relates in particular to a digital pathology scanner illumination unit. In order to provide digital pathology scanning with improved illumination, a digital pathology scanner illumination unit (10) is provided that comprises a light source (12), a light mixing chamber (14), and a light diffuser (16). The light source comprises a plurality of light elements (18) that are arranged longitudinally along a linear extension direction. The mixing chamber comprises a transparent volume (22) providing a mixing distance (DM) between the plurality of the light elements and the light diffuser such that light with a uniform intensity is provided at a downstream edge (26) of the mixing chamber; and the mixing chamber is arranged, in terms of light propagation, between the plurality of the light elements and the light diffuser. Further, the light diffuser comprises a diffusing material such that the light is transformed into light that has uniformity at different angles, in particular low angles.

    METHOD OF INSPECTING SURFACE AND METHOD OF INSPECTING PHOTOMASK USING THE SAME
    60.
    发明申请
    METHOD OF INSPECTING SURFACE AND METHOD OF INSPECTING PHOTOMASK USING THE SAME 有权
    检查表面的方法和使用其检查光电子的方法

    公开(公告)号:US20160356727A1

    公开(公告)日:2016-12-08

    申请号:US15093770

    申请日:2016-04-08

    Abstract: A method of inspecting a surface includes loading an inspection object on a stage of a multibeam inspection device configured to generate a beam array, and scanning a plurality of inspection areas of the inspection object at a same time with the beam array, wherein one of the first inspection areas is smaller than an area formed by a quadrangle connecting respective centers of corresponding four adjacent beams of the beam array, and an adjacent area of the one first inspection area is not scanned with the beam array.

    Abstract translation: 检查表面的方法包括将检查对象加载在被配置为产生光束阵列的多光束检查装置的台上,并且与所述光束阵列同时扫描所述检查对象的多个检查区域,其中, 第一检查区域小于由连接梁阵列的对应的四个相邻梁的各个中心的四边形形成的区域,并且一个第一检查区域的相邻区域不被光束阵列扫描。

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