公开(公告)号：US5863706A

公开(公告)日：1999-01-26

申请号：US429287

申请日：1995-04-25

Applicant: Toshiyuki Komatsu ,  Yasue Sato ,  Shin-Ichi Kawate

Inventor： Toshiyuki Komatsu ,  Yasue Sato ,  Shin-Ichi Kawate

IPC: C23C16/04 ,  G03F1/00 ,  G03F7/00 ,  G03F7/004 ,  G03F7/20 ,  G03F7/26 ,  G03F7/36 ,  G03F7/38 ,  H01L21/02 ,  H01L21/033 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/316 ,  H01L21/32 ,  H01L21/321 ,  H01L21/3213

CPC classification number: H01L21/02071 ,  C23C16/047 ,  G03F1/68 ,  G03F7/2002 ,  G03F7/201 ,  G03F7/2022 ,  G03F7/2043 ,  G03F7/2053 ,  G03F7/265 ,  G03F7/36 ,  G03F7/38 ,  G03F7/7005 ,  G03F7/70841 ,  G03F7/70866 ,  G03F7/70875 ,  G03F7/70991 ,  H01L21/033 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/3086 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/31662 ,  H01L21/31683 ,  H01L21/32 ,  H01L21/321 ,  H01L21/32139 ,  G03F7/00 ,  G03F7/0035 ,  G03F7/0042

Abstract: A processing method is described which has a first step of depositing on a substrate a specimen film which may be any one of a semiconductor, a metal and a insulator.In a second step, the surface of the specimen film deposited in the first step, is irradiated with an ion beam to produce a physical damage on the surface, next, in a third step, the damaged specimen film surface is selectively irradiated with the light to partially cause a photochemical reaction so that a mask pattern, which depends on the desired device structure, is formed on the film surface. Finally, in a fourth step, photoetching is performed using the mask pattern formed in the third step as a shielding member.

Abstract translation: 描述了一种处理方法，其具有在基板上沉积可以是半导体，金属和绝缘体中的任何一个的试样膜的第一步骤。 在第二步骤中，在第一步骤中沉积的样品膜的表面用离子束照射以在表面上产生物理损伤，接下来，在第三步骤中，损伤的样品膜表面被选择性地照射光 以部分地引起光化学反应，使得在膜表面上形成取决于期望的器件结构的掩模图案。 最后，在第四步骤中，使用在第三步骤中形成的掩模图案作为屏蔽部件进行光刻。

公开(公告)号：US5714306A

公开(公告)日：1998-02-03

申请号：US428431

申请日：1995-04-25

Applicant: Toshiyuki Komatsu ,  Yasue Sato ,  Shin-Ichi Kawate

Inventor： Toshiyuki Komatsu ,  Yasue Sato ,  Shin-Ichi Kawate

IPC: C23C16/04 ,  G03F1/68 ,  G03F7/00 ,  G03F7/004 ,  G03F7/20 ,  G03F7/26 ,  G03F7/36 ,  G03F7/38 ,  H01L21/02 ,  H01L21/033 ,  H01L21/285 ,  H01L21/308 ,  H01L21/311 ,  H01L21/316 ,  H01L21/32 ,  H01L21/3213

CPC classification number: G03F1/68 ,  C23C16/047 ,  G03F7/2002 ,  G03F7/201 ,  G03F7/2022 ,  G03F7/2043 ,  G03F7/2053 ,  G03F7/265 ,  G03F7/36 ,  G03F7/38 ,  G03F7/7005 ,  G03F7/70841 ,  G03F7/70866 ,  G03F7/70875 ,  G03F7/70991 ,  H01L21/02071 ,  H01L21/033 ,  H01L21/0332 ,  H01L21/0337 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/3086 ,  H01L21/31116 ,  H01L21/31144 ,  H01L21/31662 ,  H01L21/31683 ,  H01L21/32 ,  H01L21/32139 ,  G03F7/00 ,  G03F7/0035 ,  G03F7/0042

Abstract: A processing method comprises: a first step of depositing on a substrate which is a specimen a film of any one of a semiconductor, a metal and an insulator; a second step of subjecting the surface of the film deposited in the first step, to irradiation with a beam having a given energy to produce a physical damage on the surface; a third step of subjecting the film surface on which the physical damage is produced in the second step, to selective irradiation with light to partially cause a photochemical reaction so that a mask pattern depending on the desired device structure is formed on the film surface; and a fourth step of carrying out photoetching using as a shielding member the mask pattern formed in the third step.

公开(公告)号：US5462837A

公开(公告)日：1995-10-31

申请号：US299406

申请日：1994-09-01

Applicant: Masahiro Yamaguchi

Inventor： Masahiro Yamaguchi

IPC: G03F7/20 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34

CPC classification number: H05K3/3452 ,  G03F7/201 ,  H05K3/0082 ,  H05K3/28 ,  H05K2201/09909 ,  H05K2203/056 ,  H05K2203/0594

Abstract: A method of fabricating a printed circuit board includes the steps of forming a circuit pattern, applying solder resist, and exposing the solder resist. The circuit pattern including pads is formed on a substrate. The solder resist is applied on the substrate and the circuit pattern. The solder resist between the pads is exposed using a light source which emits scattered light and a mask film which is equipped with light transmission portions. The width of each light transmission portion is narrower than the distance between the pads. This method enables the formation of the solder resist in between fine pads in such a way that it does not cover an upper surface of the pad. The solder resist thus formed between the fine pads provides sufficient adhesion to the substrate.

Abstract translation: 一种制造印刷电路板的方法包括以下步骤：形成电路图案，施加阻焊剂和暴露阻焊剂。 包括焊盘的电路图案形成在基板上。 将阻焊剂施加在基板和电路图案上。 使用发射散射光的光源和配备有透光部的掩模膜来曝光焊盘之间的阻焊剂。 每个光传输部分的宽度比焊盘之间的距离窄。 该方法使得能够在细焊盘之间形成阻焊剂，使得其不覆盖焊盘的上表面。 如此形成的细焊盘之间的阻焊层提供了对基板的足够的粘附。

公开(公告)号：US5443932A

公开(公告)日：1995-08-22

申请号：US161099

申请日：1993-12-03

Applicant: Hirohisa Ohta ,  Kunitaka Ozawa ,  Eigo Kawakami ,  Shunichi Uzawa

Inventor： Hirohisa Ohta ,  Kunitaka Ozawa ,  Eigo Kawakami ,  Shunichi Uzawa

IPC: G03F7/20 ,  G03F9/00 ,  H01L21/027 ,  H01L21/30

CPC classification number: G03F9/7023 ,  G03F7/201

Abstract: An exposure method includes disposing a mask and a semiconductor wafer opposed to each other in a close proximity relation with respect to a Z-axis direction and printing a pattern of the mask on each of different shot areas of the semiconductor wafer in a step-and-repeat manner, with a predetermined exposure energy. In this method, the spacing between the mask and the wafer for the paralleling of them is made larger than the spacing therebetween as assumed at the time of mask-to-wafer alignment with respect to X-Y plane or the spacing between the mask and the wafer as assumed at the time of exposure of the wafer to the mask. After the paralleling of the mask and the wafer, the mask and the wafer are moved closer to each other in the Z-axis direction and alignment and exposure is performed. This ensures that the alignment and exposure are effected at an optimum spacing while, on the other hand, contact of the mask and the wafer at the time of paralleling is precluded.

Abstract translation: 曝光方法包括以相对于Z轴方向彼此紧密相对的方式设置掩模和半导体晶片，并且在半导体晶片的不同照射区域的每一个上以均匀的方式印刷掩模的图案，并且 以预定的曝光能量。 在这种方法中，掩模和与它们并联的晶片之间的间隔被制成大于它们之间的间隔，如假设在相对于XY平面的掩模到晶片对准时或掩模和晶片之间的间隔 如在晶片暴露于掩模时所假设的那样。 在掩模和晶片平行之后，掩模和晶片在Z轴方向上彼此靠近移动，并进行对准和曝光。 这确保了对准和曝光以最佳间隔进行，另一方面，阻止了并联时的掩模与晶片的接触。

公开(公告)号：US5316897A

公开(公告)日：1994-05-31

申请号：US761159

申请日：1991-09-17

Applicant: Aaron Shafir

Inventor： Aaron Shafir

IPC: B05B15/04 ,  B05D1/32 ,  C03C23/00 ,  G03F7/20 ,  G03F9/00 ,  G03C5/04 ,  B32B31/00 ,  B05C9/08

CPC classification number: G03F9/00 ,  B05B15/045 ,  B05D1/32 ,  C03C23/001 ,  C03C23/002 ,  G03F7/201

Abstract: A method and apparatus for exposing a substrate of relatively large surface area to radiation according to a predetermined pattern recorded on a mask, particularly useful in applying a painted border to an automobile windshield, includes the steps of progressively recording the predetermined pattern on a mask in the form of a continuous strip, and moving the radiation source to progressively scan the surface of the substrate with radiation, while at the same time moving the continuous strip mask relative to the radiation source, such that portions of the pattern on the continuous strip mask progressively become aligned with their corresponding portions of the substrate as the substrate is progressively scanned by the radiation source.

Abstract translation: 一种用于根据记录在掩模上的预定图案将相对大的表面积的基底曝光于辐射的方法和装置，特别可用于将汽车挡风玻璃涂上的边框特别有用的方法和装置包括以下步骤：将预定图案逐渐记录在掩模上 连续条带的形式，并且移动辐射源以用辐射逐渐地扫描基片的表面，同时相对于辐射源移动连续带状掩模，使得连续条形掩模上的图案的部分 随着基板被辐射源逐渐扫描，它逐渐地与基板的相应部分对齐。

公开(公告)号：US5291315A

公开(公告)日：1994-03-01

申请号：US65449

申请日：1993-05-21

Applicant: Shigeru Hosoe

Inventor： Shigeru Hosoe

IPC: G03F7/20 ,  G03H1/08 ,  G03H1/02 ,  G01B9/021 ,  G02B5/32

CPC classification number: G03H1/08 ,  G03F7/201

Abstract: A hologram exposure apparatus for and method of obtaining a hologram using a photoresist for an in-line type interferometer wherein a photoresist substrate is detachably mounted on a substrate rotating device. A concentric pattern of a hologram from a source of light is projected onto the photoresist on the substrate mounted on the substrate rotating device while rotating the substrate and moving a projecting device in a direction at right angles with the rotary shaft of the photoresist substrate.

Abstract translation: 一种使用用于直列式干涉仪的光致抗蚀剂获得全息图的全息图曝光装置，其中光致抗蚀剂基板可拆卸地安装在基板旋转装置上。 将来自光源的全息图的同心图案投影到安装在基板旋转装置上的基板上的光致抗蚀剂上，同时旋转基板并使投影装置沿与光致抗蚀剂基板的旋转轴成直角的方向移动。

公开(公告)号：US4682277A

公开(公告)日：1987-07-21

申请号：US884516

申请日：1986-07-11

Applicant: Yoshio Yazaki

Inventor： Yoshio Yazaki

IPC: G03B27/54 ,  G03F7/20 ,  G03F9/00 ,  H05K3/00 ,  F21V7/00

CPC classification number: G03B27/54 ,  G03F7/201 ,  H05K3/0082

Abstract: A movable light-source type exposure apparatus comprising a light source disposed at the focal point of a parabolic reflector, a first light-shielding member disposed right beneath the light source and intended to prevent the light rays from the light source from being irradiated directly over a mask and a work, a second light-shielding member disposed closely to the mask and work so as to cause the formation of a shadow capable of equalizing the cumulated amounts of light rays at points thereon, a positioning/fixing means intended, for each exposure, to position and fix a retaining frame for the mask and a retaining frame for the work, and a light-source moving means for moving a lamp house having the parabolic reflector, light source, first light-shielding member and second shielding member over the mask and work for purpose of causing the same to be exposed.

Abstract translation: 一种可移动光源型曝光设备，包括设置在抛物面反射器的焦点处的光源，设置在光源正下方的旨在防止来自光源的光线被直接照射的第一遮光部件 掩模和工件，第二遮光部件，其紧密配置在掩模上并进行加工，从而形成能够在其上的点上累积的光线的均匀性的阴影;对于每个所述的定位/固定装置， 曝光，定位和固定用于掩模的保持框架和用于工作的保持框架;以及光源移动装置，用于将具有抛物面反射器，光源，第一遮光构件和第二屏蔽构件的灯室移动到 面具和工作的目的是使同样的暴露。

公开(公告)号：US4444616A

公开(公告)日：1984-04-24

申请号：US384111

申请日：1982-06-01

Applicant: Yoshimi Fujita ,  Toshiharu Yamashita

Inventor： Yoshimi Fujita ,  Toshiharu Yamashita

IPC: G03B27/02 ,  C03B33/00 ,  C03C15/00 ,  C03C23/00 ,  G03B27/04 ,  G03F7/20 ,  H01J17/49 ,  B44C1/22 ,  C03C25/06

CPC classification number: H01J17/49 ,  C03C15/00 ,  C03C23/002 ,  G03F7/201

Abstract: A method for irradiating a chemically machinable light-sensitive glass plate with a parallel bundle of ultraviolet rays so as to form tapered holes or slits in the glass plate. A mask having a desired shaped opening is mounted on the light-sensitive glass plate and the plate is disposed so that its surface forms a predetermined angle with a plane which is perpendicular to the parallel bundle of ultraviolet rays. The glass plate is then rotated about a central vertical axis thereof.

Abstract translation: 照射具有平行紫外线束的化学机械加工的感光玻璃板以在玻璃板中形成锥形孔或狭缝的方法。 具有所需形状的开口的掩模安装在感光玻璃板上，并且板被设置成使其表面与垂直于平行的紫外线束的平面形成预定角度。 然后将玻璃板围绕其中心垂直轴旋转。

公开(公告)号：US4182569A

公开(公告)日：1980-01-08

申请号：US799332

申请日：1977-05-23

Applicant: Terry L. Smith

Inventor： Terry L. Smith

IPC: B41B13/00 ,  G03F7/20 ,  G03B27/10

CPC classification number: G03F7/201 ,  B41B13/00

Abstract: An apparatus is disclosed for alternatively positioning a quartz or pinpoint light above a vacuum printing frame in a lithographic process. Either a quartz or a pinpoint light is required to produce fine line contacts, duplicates and reverses which are subsequently arranged in the desired orientation and transferred onto a printing plate for offset printing. The apparatus is located over a vacuum printing frame, or similar device, and has both the quartz light and pinpoint light attached to a movable housing. The housing is movable along two rails so as to accurately position either of the lights in its proper position over the printing frame. Movement of the housing is initiated by the operator and ceases when the housing contacts a limit switch.

Abstract translation: 公开了一种用于在光刻工艺中将真空印刷框架上的石英或精确点光定位的设备。 需要石英或精确点光以产生细线接触，复制和反转，随后以期望的方向布置并转印到用于胶版印刷的印刷版上。 该设备位于真空打印框架或类似装置之上，并且具有连接到可动壳体的石英光和精确点光。 外壳可沿着两个轨道移动，以便将任何一个光线准确地定位在打印框架上的正确位置。 外壳的移动由操作员启动，并且当外壳接触限位开关时停止。

公开(公告)号：US3776633A

公开(公告)日：1973-12-04

申请号：US3776633D

申请日：1972-02-10

Applicant: IBM

Inventor： FROSCH A ,  SCHMACKPFEFFER A

IPC: G02B27/58 ,  G03F7/20 ,  G03C5/00

CPC classification number: G03F7/70075 ,  G02B27/58 ,  G03F7/201 ,  G03F7/70091 ,  G03F7/70208 ,  G03F7/7035 ,  G03F7/70583

Abstract: A photographic method and apparatus for exposing a light sensitive layer using a mask spaced from said layer while avoiding ''''ghost lines'''' due to diffraction effects in the developed pattern on the layer. The mask is illuminated by pairs of collimated ray sets, either sequentially or simultaneously, at an angle relative to each other so that the constituent diffraction pattern on the light sensitive layer resulting from one ray set of a pair is shifted with respect to the constituent diffraction pattern attributable to the other ray set of the pair. The shift is such that the ratio of the ''''ghost line'''' intensity to the maximum intensity in the composite diffraction pattern is reduced relative to the corresponding ratio in each of the constituent diffraction patterns. The pairs of ray sets are produced by spacially displaced fixed light sources or by a rotating optical system using a single light source.

Abstract translation: 一种用于使用与所述层间隔开的掩模曝光光敏层的照相方法和装置，同时由于层上显影图案中的衍射效应而避免“幻影线”。 相对于彼此以一定角度顺序地或同时地对准平行光线集，掩模被掩模，使得由一对光线组得到的光敏层上的成分衍射图相对于构成衍射 可归因于该对的其他射线组的图案。 这种移动使得复合衍射图案中的“鬼线”强度与最大强度的比率相对于每个构成衍射图案中的相应比率降低。 这些光线组由空间移动的固定光源或使用单个光源的旋转光学系统产生。