公开(公告)号：US20080138637A1

公开(公告)日：2008-06-12

申请号：US11792937

申请日：2005-12-07

Applicant: Masami Yanagida ,  Kenji Ueshima ,  Toshiyuki Komatsu

Inventor： Masami Yanagida ,  Kenji Ueshima ,  Toshiyuki Komatsu

IPC: B32B27/16 ,  B32B27/06 ,  B01J19/08

CPC classification number: H05K3/386 ,  B29C48/08 ,  B29C48/92 ,  B29C2948/92152 ,  B29C2948/92438 ,  B29C2948/92647 ,  B29C2948/92933 ,  B32B7/12 ,  B32B27/34 ,  C09J7/20 ,  C09J7/25 ,  C09J179/08 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K2201/0112 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2203/162 ,  Y10T428/31721

Abstract: An object of the present invention is to provide a polyimide multilayer adhesive film in which the thicknesses of the respective layers can be precisely measured by an infrared absorption method and a method for producing the same. In an adhesive film including a highly heat-resistant polyimide layer and an adhesive layer that contains a thermoplastic polyimide and that is disposed on at least one surface of the highly heat-resistant polyimide layer, the adhesive film is produced by a coextrusion-flow casting method and either of the highly heat-resistant polyimide layer or the adhesive layer contains, as a principal component, a polyimide resin having a functional group showing a characteristic infrared absorption wavelength. In the subsequent step of measuring the film thickness, the thickness dimensions of the respective layers are measured with an infrared absorption type thickness gauge, and the thicknesses of the respective layers during the film formation are controlled and adjusted on the basis of the data of the thickness dimensions to produce the adhesive film. Thereby, the polyimide multilayer adhesive film of the present invention can be provided.

Abstract translation: 本发明的目的是提供一种聚酰亚胺多层粘合膜，其中各层的厚度可以通过红外线吸收法及其制造方法精确测量。 在包含高耐热聚酰亚胺层的粘合剂膜和含有热塑性聚酰亚胺的粘合剂层中，并且设置在高耐热聚酰亚胺层的至少一个表面上，粘合膜通过共挤出流铸造 方法中，高耐热聚酰亚胺层或粘合层中的任一种作为主要成分含有具有特征红外线吸收波长的官能团的聚酰亚胺树脂。 在随后的测量薄膜厚度的步骤中，用红外线吸收型厚度计测量各层的厚度尺寸，并且根据成膜的数据来控制和调整成膜期间各层的厚度 厚度尺寸来生产粘合膜。 由此，可以提供本发明的聚酰亚胺多层粘合膜。

公开(公告)号：US20080011515A1

公开(公告)日：2008-01-17

申请号：US11486249

申请日：2006-07-13

Applicant: Atsuhiko Sato

Inventor： Atsuhiko Sato

IPC: H01R4/18

CPC classification number: H05K1/092 ,  G03F7/0047 ,  H01J9/02 ,  H01J2211/225 ,  H05K3/02 ,  H05K2201/0112 ,  H05K2201/0323 ,  H05K2203/0514

Abstract: A photosensitive conductive paste for electrode formation, containing conductive metal particles, a glass binder, a monomer, a photoinitiator, an organic polymer binder, an organic medium and carbon black.

Abstract translation: 一种用于电极形成的感光性导电糊剂，其包含导电金属颗粒，玻璃粘合剂，单体，光引发剂，有机聚合物粘合剂，有机介质和炭黑。

公开(公告)号：US20070246514A1

公开(公告)日：2007-10-25

申请号：US11578263

申请日：2005-04-06

Applicant: Horst Lettner ,  Rolf Diehm

Inventor： Horst Lettner ,  Rolf Diehm

IPC: B23K1/002 ,  H05K3/00

CPC classification number: H05K3/3494 ,  B23K1/0056 ,  B23K2101/42 ,  H05K3/3484 ,  H05K2201/0112 ,  H05K2203/111

Abstract: The invention relates to a method and a device for the reflow soldering of circuit-board conductors with components and modules applied to a printed-circuit board by means of a solder paste, wherein, through radiation of an electromagnetic wave, an absorption material absorbing the radiation is heated and said heating is transferred to the solder paste for melting a solder contained in the solder paste. The solder paste is mixed with the absorption material to form a mixed material and the mixed material is applied to the soldering joints of the circuit-board conductors.

Abstract translation: 本发明涉及一种用于回流焊接电路板导体的方法和装置，其中组件和模块通过焊膏施加到印刷电路板上，其中通过电磁波的辐射吸收吸收材料的吸收材料 辐射被加热，并且所述加热被转移到焊膏以熔化包含在焊膏中的焊料。 将焊膏与吸收材料混合以形成混合材料，并将混合材料施加到电路板导体的焊接接头。

公开(公告)号：US07083848B2

公开(公告)日：2006-08-01

申请号：US11037624

申请日：2005-01-18

Applicant: Holger Kliesch ,  Thorsten Kiehne ,  Gottfried Hilkert ,  Ingo Fischer

Inventor： Holger Kliesch ,  Thorsten Kiehne ,  Gottfried Hilkert ,  Ingo Fischer

IPC: B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B27/34 ,  B32B27/36

CPC classification number: B32B27/20 ,  B29C35/0805 ,  B29C47/0021 ,  B29C47/065 ,  B29C47/14 ,  B29C55/12 ,  B29D7/01 ,  B29K2067/00 ,  B29K2077/00 ,  B29K2105/26 ,  B32B5/20 ,  B32B27/08 ,  B32B27/34 ,  B32B27/36 ,  B32B2272/00 ,  B32B2305/70 ,  B32B2307/514 ,  B32B2309/105 ,  C08G63/6856 ,  C08J3/22 ,  C08J5/18 ,  C08J7/18 ,  C08J2367/02 ,  C08J2377/00 ,  C08K3/04 ,  C08K3/22 ,  C08K3/34 ,  C08K13/00 ,  C08L67/02 ,  C08L77/00 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/105 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2203/107 ,  Y10S428/91 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31736 ,  Y10T428/31786 ,  C08L2666/20

Abstract: The invention relates to a single- or multilayer, oriented film in which at least one layer is comprised of a thermoplastic polymer having a minimum amount of amide groups. The polymer is a polyester, a polyamide, or a mixture comprised of polyester and polyamide, or is a copolymer comprised of these two materials. The film also comprises a component a) which, when irradiated with electromagnetic or particulate radiation, forms metal nuclei onto which further metal can be accumulated in further steps of the process. The invention also relates to a process for the production of this film, and to its use in printed circuit boards, ribbon cables, smart cards, RFID labels, membrane keyboards, or film-based circuits of any type.

Abstract translation: 本发明涉及单层或多层定向膜，其中至少一层由具有最少量酰胺基团的热塑性聚合物组成。 聚合物是聚酯，聚酰胺或由聚酯和聚酰胺组成的混合物，或是由这两种材料组成的共聚物。 该膜还包括组分a），当用电磁或微粒辐射照射时，其形成金属核，在该过程的进一步步骤中可以积聚另外的金属。 本发明还涉及一种用于生产该膜的方法及其在印刷电路板，带状电缆，智能卡，RFID标签，膜键盘或任何类型的基于胶片的电路中的应用。

公开(公告)号：US20060003262A1

公开(公告)日：2006-01-05

申请号：US10881301

申请日：2004-06-30

Applicant: Zhihao Yang ,  David Kay ,  Lee Tutt

Inventor： Zhihao Yang ,  David Kay ,  Lee Tutt

IPC: G03C5/00 ,  B44C1/22

CPC classification number: H05K3/02 ,  H05K3/102 ,  H05K2201/0112 ,  H05K2201/0257 ,  H05K2203/107

Abstract: A method of forming a pattern of electrical conductors on a substrate (18) consists of forming metal nanoparticles on a conductive material. A light absorbing dye is mixed with the metal nanoparticles. The mixture is then coated on the substrate. The pattern is formed on the coated substrate with laser light (14). Unannealed material is removed from the substrate.

Abstract translation: 在基板（18）上形成电导体图案的方法包括在导电材料上形成金属纳米颗粒。 吸光染料与金属纳米粒子混合。 然后将混合物涂覆在基材上。 用激光在涂覆的基板上形成图案（14）。 未退火的材料从基材上除去。

公开(公告)号：US20050244621A1

公开(公告)日：2005-11-03

申请号：US11117505

申请日：2005-04-29

Applicant: Kunio Arai ,  Haruo Akahoshi

Inventor： Kunio Arai ,  Haruo Akahoshi

IPC: B32B3/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4679 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/06 ,  H05K3/062 ,  H05K3/421 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0315 ,  H05K2203/0346 ,  H05K2203/0554 ,  Y10T428/24917

Abstract: The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. There is provided a printed circuit board including an alternate laminate of electric conductor layers and electrically insulating layers, wherein a coating layer capable of absorbing laser light but insoluble in an etching solution dissolving the electric conductor layers is provided on a front surface of a first one of the electric conductor layers. In this case, the coating layer may be provided on a front surface of a rear one of the electric conductor layers. Each of the electric conductor layers may contain Cu as a main component while the coating layer may contain CuO as a main component. The coating layer may have a thickness not thinner than 0.6 μm.

Abstract translation: 本发明提供一种印刷电路板，其中能够使加工质量均匀的印刷电路板的封装密度的提高和生产成本的降低，印刷电路板的处理方法和制造方法 印刷电路板。 提供了一种印刷电路板，其包括导电层和电绝缘层的交替叠层，其中在第一个的前表面上设置有能够吸收激光但不溶于溶解导电层的蚀刻溶液的涂层 的导电层。 在这种情况下，涂层可以设置在后导体层的前表面上。 每个导电体层可以包含Cu作为主要成分，而涂层可以包含CuO作为主要成分。 涂层可以具有不小于0.6μm的厚度。

公开(公告)号：US20050145411A1

公开(公告)日：2005-07-07

申请号：US10497757

申请日：2003-01-23

Applicant: Ulf Feistel ,  Roland Diener ,  Uwe Weinzierl

Inventor： Ulf Feistel ,  Roland Diener ,  Uwe Weinzierl

IPC: G02B6/42 ,  G02B6/44 ,  H05K1/00 ,  H05K3/40

CPC classification number: G02B6/4405 ,  G02B6/4226 ,  H05K1/0281 ,  H05K1/0289 ,  H05K3/4084 ,  H05K2201/0112 ,  H05K2201/057 ,  H05K2201/2009 ,  H05K2203/107 ,  H05K2203/1189

Abstract: The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supply energy. At least one of said areas is used as a positioning element for positioning an object or for stiffening flexible or easily bendable materials in a shape-stabilizing manner.

Abstract translation: 本发明的目的是提供即使在难以进入的地方或在其他困难条件下的改进的处理特性的定位和安装选项。 所述目的通过使用包括至少一个可通过供应能发泡的区域的功能元件实现。 所述区域中的至少一个用作用于定位物体的定位元件或用于以形状稳定的方式加固柔性或易弯曲的材料。

公开(公告)号：US20050079338A1

公开(公告)日：2005-04-14

申请号：US10922098

申请日：2004-08-20

Applicant: Naoyuki Toyoda

Inventor： Naoyuki Toyoda

IPC: H01L21/288 ,  B32B3/26 ,  H01L21/268 ,  H01L21/3205 ,  H05B33/10 ,  H05B33/26 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/22

CPC classification number: H05K3/22 ,  H01L21/268 ,  H05K1/092 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/249953

Abstract: To provide a heat treatment method to efficiently heat-treat an object without depending on the material of the object, a heat treatment layer includes a light-to-heat conversion layer to convert light energy into thermal energy and a base material. The heat treatment sheet is opposed to an object and exposed to light. Thus, the object is heat-treated by thermal energy generated from the light-to-heat conversion layer.

Abstract translation: 为了提供一种在不依赖于物体的情况下有效地热处理物体的热处理方法，热处理层包括将光能转换为热能的光热转换层和基材。 热处理片与物体相对并曝光。 因此，通过从热 - 热转换层产生的热能对该物体进行热处理。

公开(公告)号：US06861008B1

公开(公告)日：2005-03-01

申请号：US10089308

申请日：2000-09-29

Applicant: Hubert De Steur ,  Marcel Heerman ,  Jozef Van Puymbroeck

Inventor： Hubert De Steur ,  Marcel Heerman ,  Jozef Van Puymbroeck

IPC: B23K26/18 ,  B23K26/402 ,  B23K101/42 ,  H01S3/00 ,  H05K3/00 ,  C03C15/00

CPC classification number: H05K3/0032 ,  B23K2103/30 ,  B23K2103/50 ,  H05K2201/0112

Abstract: For the laser drilling of organic materials, in particular for making blind holes in dielectric layers, a frequency-doubled Nd-vanadate laser with the following parameters is used: pulse width

Abstract translation: 对于有机材料的激光钻孔，特别是在电介质层中制造盲孔，使用具有以下参数的倍频Nd-钒酸盐激光器：

公开(公告)号：US20050026051A1

公开(公告)日：2005-02-03

申请号：US10928178

申请日：2004-08-30

Applicant: Robert Japp ,  Pamela Lulkoski ,  Jeffrey McKeveny ,  Jan Obrzut ,  Kenneth Potter

Inventor： Robert Japp ,  Pamela Lulkoski ,  Jeffrey McKeveny ,  Jan Obrzut ,  Kenneth Potter

IPC: B32B5/26 ,  B32B17/04 ,  C03C25/42 ,  D03D15/00 ,  H05K1/03 ,  H05K3/00 ,  G03F9/00

CPC classification number: D03D1/0082 ,  B32B5/26 ,  B32B17/04 ,  C03C25/42 ,  D03D15/0011 ,  H05K1/0366 ,  H05K3/0082 ,  H05K2201/0112 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T156/10 ,  Y10T428/31525 ,  Y10T442/2008 ,  Y10T442/2926 ,  Y10T442/2951 ,  Y10T442/2992 ,  Y10T442/3976

Abstract: The glass transmittance of UV light having a wavelength of 365 nanometers is reduced by compounding an oxide or salt of at least one of Fe, Cu, Cr, Ce, Mn and mixtures thereof. The fiberglass cloth can be used for providing reinforced prepregs used in producing printed circuit boards or laminated chip carrier substrates.