公开(公告)号：US07338710B2

公开(公告)日：2008-03-04

申请号：US10517076

申请日：2003-06-06

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: B32B5/16

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US20070138649A1

公开(公告)日：2007-06-21

申请号：US11315138

申请日：2005-12-21

Applicant: John Knights

Inventor： John Knights

IPC: H01L23/48

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/11332 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2924/09701 ,  H05K3/125 ,  H05K3/245 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2203/013

Abstract: A method of forming a contact structure and a contact structure. The contact structure includes a contact location, and contact elements disposed substantially on the contact location, at least one such contact element including a deformable center and a conducting layer covering at least a part of the deformable center.

Abstract translation: 形成接触结构和接触结构的方法。 接触结构包括接触位置和基本上设置在接触位置上的接触元件，至少一个这样的接触元件包括可变形的中心和覆盖可变形中心的至少一部分的导电层。

公开(公告)号：US20060286721A1

公开(公告)日：2006-12-21

申请号：US11155208

申请日：2005-06-16

Applicant: Daoqiang Lu ,  Henning Braunisch

Inventor： Daoqiang Lu ,  Henning Braunisch

IPC: H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01G7/00

CPC classification number: H01L23/49827 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/838 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K3/365 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0314 ,  H01L2924/00

Abstract: Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

公开(公告)号：US20060033873A1

公开(公告)日：2006-02-16

申请号：US11250426

申请日：2005-10-17

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/1345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

公开(公告)号：US20050228144A1

公开(公告)日：2005-10-13

申请号：US10517076

申请日：2003-06-06

Applicant: Kazunobu Kamiya ,  Ryoji Kojima

Inventor： Kazunobu Kamiya ,  Ryoji Kojima

IPC: C08F2/00 ,  C08J3/12 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/32 ,  B32B5/16 ,  C08L67/00

CPC classification number: C08J3/128 ,  C01P2004/84 ,  C08J2333/06 ,  C09C3/10 ,  C09J9/02 ,  H01R4/04 ,  H01R4/58 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998

Abstract: Resin particles comprised of an acrylic resin. Not only is the maximum compression deformation ratio thereof as great as 60% or more but also the load required for 60% compression deformation is as small as 60 mN or less. Wiring boards are therefore coupled in using an anisotropic conductive adhesive obtained by first manufacturing conductive particles having a conductive coating formed on a resin particle surface of the resin particles by adhering a conductive material to the surface of the above resin particles as a core. On dispersing the conductive particles in an adhesive material, the conductive particles sandwiched between metallic wires of the wiring boards are greatly deformed by a small load, so that the electrical devices having a high conduction reliability can be obtained.

Abstract translation: 由丙烯酸树脂构成的树脂颗粒。 其最大压缩变形率不仅高达60％以上，而且60％压缩变形所需的载荷也小至60mN以下。 因此，使用各向异性导电粘合剂，将导电性材料粘接到作为核心的上述树脂粒子的表面，使用各向异性导电粘合剂，将导电性粒子形成在树脂粒子表面上的导电性粒子。 在将导电粒子分散在粘合剂材料中时，夹在布线板的金属线之间的导电颗粒由于负载较小而大大地变形，从而可以获得具有高导电可靠性的电子器件。

公开(公告)号：US06942824B1

公开(公告)日：2005-09-13

申请号：US10155598

申请日：2002-05-22

Applicant: Weijin Li

Inventor： Weijin Li

IPC: G11B17/32 ,  H01B1/22 ,  H05K3/32

CPC classification number: H01B1/22 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233

Abstract: An electrically conductive adhesive includes a resin component, a photoinitiator, and metal-coated polymer beads. The beads have an average diameter and a very narrow size distribution around the average diameter. The adhesive is applied between a read/write head and a suspension to attach the two, and the adhesive is cured by exposure to an illumination and/or heat. The beads in the adhesive can form a monolayer between the read/write head and the suspension such that a spacing therebetween is equal to the average diameter of the beads. The metal coating of the beads provide electrical conductivity between the read/write head and the suspension.

Abstract translation: 导电粘合剂包括树脂组分，光引发剂和金属涂覆的聚合物珠粒。 珠具有围绕平均直径的平均直径和非常窄的尺寸分布。 将粘合剂施加在读/写头和悬架之间以附接两者，并且粘合剂通过暴露于照明和/或热而固化。 粘合剂中的珠粒可以在读/写头和悬浮液之间形成单层，使得它们之间的间隔等于珠的平均直径。 珠的金属涂层在读/写头和悬架之间提供导电性。

公开(公告)号：US20050110406A1

公开(公告)日：2005-05-26

申请号：US10969845

申请日：2004-10-22

Applicant: Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

Inventor： Young-Chul Jeong ,  Eun-Gon Kim ,  Ki-Jung Kim

IPC: C09J11/00 ,  C09J201/00 ,  G09F9/00 ,  H01J17/16 ,  H01J17/49 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R12/62 ,  H01J2211/46 ,  H01R4/04 ,  H05K1/147 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/1189

Abstract: A plasma display device may include a plasma display panel, a driving circuit portion for driving the plasma display panel, a connecter for electrically connecting electrodes of the plasma display panel with the driving circuit portion, and an interconnecter for electrically connecting the connecter with the plasma display panel. The interconnecter may include an adhesive layer, a plurality of conductive pellets, and a plurality of non-conductive pellets dispersed in the adhesive layer. The conductive pellets may be positioned substantially within a first region where the wiring of the connecter overlaps the electrodes of the plasma display panel. The non-conductive pellets may be positioned substantially at least at a second region other than the first region in the adhesive layer.

Abstract translation: 等离子体显示装置可以包括等离子体显示面板，用于驱动等离子体显示面板的驱动电路部分，用于将等离子体显示面板的电极与驱动电路部分电连接的连接器和用于将连接器与等离子体电连接的互连器 显示面板。 互连器可以包括粘合剂层，多个导电颗粒和分散在粘合剂层中的多个非导电颗粒。 导电颗粒可以位于第一区域中，其中连接器的布线与等离子体显示面板的电极重叠。 非导电性颗粒可以基本上至少位于粘合剂层中除了第一区域之外的第二区域。

公开(公告)号：US06404476B1

公开(公告)日：2002-06-11

申请号：US08962448

申请日：1997-10-31

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F11345

CPC classification number: G02F1/13452 ,  G02F2203/69 ,  H01R4/04 ,  H05K1/0306 ,  H05K1/148 ,  H05K3/323 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US06356333B1

公开(公告)日：2002-03-12

申请号：US09448552

申请日：1999-11-23

Applicant: Kenji Uchiyama

Inventor： Kenji Uchiyama

IPC: G02F11345

CPC classification number: H01L24/83 ,  G02F1/13452 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/189 ,  H05K3/323 ,  H05K3/341 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A conductive adhesive which can withstand exposure to high temperature during a solder reflow process comprises an adhesive resin and a plurality of conductive particles mixed in the adhesive resin. The conductive particles each include a core formed of a synthetic resin and a conductive material coated around the core. The cores are each formed of a material having a thermal deformation temperature higher than that of the adhesive resin, and more preferably formed of a material having a thermal deformation temperature (18.6 kg/cm2) higher than 120° C. as measured according to the measuring method defined in the ASTM standard D648, and still more preferably formed of a material selected from the group consisting of polyphenylene oxide, polysulfone, polycarbonate, polyacetal, and polyethylene terephthalate.

Abstract translation: 在回流焊接过程中可承受高温暴露的导电粘合剂包括粘合树脂和粘合树脂中混合的多个导电颗粒。 导电颗粒各自包括由合成树脂形成的芯和围绕芯部涂覆的导电材料。 芯部由热变形温度高于粘合剂树脂的材料形成，更优选由热变形温度（18.6kg / cm 2）高于120℃的材料形成，如根据 测定方法在ASTM标准D648中定义，并且还更优选由选自聚苯醚，聚砜，聚碳酸酯，聚缩醛和聚对苯二甲酸乙二醇酯的材料形成。

公开(公告)号：US20010046021A1

公开(公告)日：2001-11-29

申请号：US09141021

申请日：1998-08-27

Inventor： TAKESHI KOZUKA ,  TSUTOMU YAMAZAKI ,  IKUMI SAKATA

IPC: G02F001/1345

CPC classification number: G02F1/13452 ,  C09J9/02 ,  H01L2224/29399 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0307 ,  H01L2924/00

Abstract: A conductive particle used for an anisotropic conductive adhesive provides an anisotropic conductive bonding between terminal electrodes without deforming a wiring pattern or the terminal electrode of a circuit board. A conductive layer is formed on a surface of a core particle of the conductive particle. The conductive particle has a yield point within a range of degree of deformation from 5% to 40% so that a modulus of compressive deformation of the conductive particle drastically increases at the yield point.

Abstract translation: 用于各向异性导电粘合剂的导电颗粒在端子电极之间提供各向异性导电结合，而不会使电路板的布线图案或端子电极变形。 在导电性粒子的核心粒子的表面上形成导电层。 导电颗粒的屈服点在5％至40％的变形度范围内，使得导电颗粒的压缩变形模量在屈服点显着增加。