公开(公告)号：US08166647B2

公开(公告)日：2012-05-01

申请号：US12352090

申请日：2009-01-12

Applicant: Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

Inventor： Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

IPC: H05K3/02

CPC classification number: B82Y10/00 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/183 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0108 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述凹槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。

公开(公告)号：US08119220B2

公开(公告)日：2012-02-21

申请号：US12086983

申请日：2006-08-10

Applicant: Xinhe Tang ,  Ka Chun Tse ,  Ernst Hammel ,  Ben Zhong Tang

Inventor： Xinhe Tang ,  Ka Chun Tse ,  Ernst Hammel ,  Ben Zhong Tang

IPC: B32B5/12 ,  B32B27/38 ,  C08L63/00 ,  C08L67/00 ,  H01F1/42

CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B2250/40 ,  B32B2255/26 ,  B32B2262/02 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2307/208 ,  B32B2307/302 ,  B82Y10/00 ,  B82Y30/00 ,  C08K7/02 ,  C08K2201/011 ,  C09J11/00 ,  H01L23/373 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/24 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249942 ,  Y10T428/31515 ,  H01L2924/00

Abstract: Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

Abstract translation: 公开了一种多层材料，其中至少两种组分经由粘合剂粘结而相互连接。 粘合剂粘合剂是由适合作为粘合剂的基质中含有纳米纤维材料的粘合剂或粘合层形成的。

公开(公告)号：US08076583B2

公开(公告)日：2011-12-13

申请号：US12476786

申请日：2009-06-02

Applicant: Keisuke Shimizu

Inventor： Keisuke Shimizu

IPC: H01B5/14

CPC classification number: H05K1/02 ,  B82Y10/00 ,  H05K1/097 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/0323

Abstract: Disclosed herein is a light-transmitting electric conductor including, on a surface of a light-transmitting support, a conductive material in which a multiplicity of carbon nanolinear structures are accumulated in two dimensions while making partial contact with each other, wherein the conductive material is a light-transmitting conductive material composed only of the carbon nanolinear structures, and direct bonds are formed between the surface of the light-transmitting support and the carbon nanolinear structures making contact with the surface, and between the carbon nanolinear structures making contact with each other.

Abstract translation: 本文公开了一种透光电导体，其在透光性支撑体的表面上具有导电材料，其中多个碳纳米线结构在两个维度上彼此积累，同时彼此部分接触，其中导电材料为 在透光性载体的表面与与表面接触的碳纳米线结构之间形成与碳纳米线结构构成的透光性导电材料和直接接合，并且在彼此接触的碳纳米线结构之间形成 。

公开(公告)号：US20110272176A1

公开(公告)日：2011-11-10

申请号：US13144412

申请日：2009-12-18

Applicant: Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

Inventor： Masaki Goto ,  Akihiko Takeda ,  Kazuaki Nakamura

IPC: H01B13/00 ,  H05K1/00 ,  B82Y99/00

CPC classification number: H05K3/067 ,  B82Y10/00 ,  G02F1/13439 ,  H01L23/53276 ,  H01L31/022491 ,  H01L2924/0002 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2203/0766 ,  H01L2924/00

Abstract: The present invention can easily provide a method of manufacturing a pattern electrode with excellent electroconductivity and excellent transparency and a pattern electrode manufactured according to the method. The method of manufacturing a pattern electrode is characterized in that it comprises the steps of forming on a substrate an electroconductive layer containing metal nanowires, and carrying out pattern printing on the electroconductive layer employing a metal nanowire removing solution, followed by washing with water.

Abstract translation: 本发明可以容易地提供一种制造具有优异导电性和优异透明度的图案电极的方法和根据该方法制造的图案电极。 制造图案电极的方法的特征在于它包括以下步骤：在衬底上形成含有金属纳米线的导电层，并使用金属纳米线去除溶液在导电层上进行图案印刷，然后用水洗涤。

公开(公告)号：US08049333B2

公开(公告)日：2011-11-01

申请号：US11504822

申请日：2006-08-14

Applicant: Jonathan S. Alden ,  Haixia Dai ,  Michael R. Knapp ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid ,  Adrian Winoto ,  Jeffrey Wolk

Inventor： Jonathan S. Alden ,  Haixia Dai ,  Michael R. Knapp ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid ,  Adrian Winoto ,  Jeffrey Wolk

IPC: H01L23/48

CPC classification number: H01B1/22 ,  B22F1/0025 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：US20110260115A1

公开(公告)日：2011-10-27

申请号：US13155367

申请日：2011-06-07

Applicant: Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

Inventor： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

IPC: H01B1/24 ,  H01B1/22 ,  B82Y99/00

CPC classification number: H01B1/22 ,  B82Y10/00 ,  C09D11/52 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

Abstract: A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.

Abstract translation: 提供含有银纳米颗粒的导电糊料和设置有导电电路板的导电电路板。 含有银纳米颗粒的导电糊料包含基于导电浆料的总重量的15至50重量％的银纳米颗粒，银纳米颗粒具有1至100nm的平均粒径; 0.1至2.5重量％的碳纳米管，基于导电浆料的总重量，碳纳米管的平均直径为2至40nm; 1〜15重量％的粘合剂，基于导电浆料的总重量; 和溶剂。

公开(公告)号：US20110253668A1

公开(公告)日：2011-10-20

申请号：US13069837

申请日：2011-03-23

Applicant: Adrian Winoto ,  Jeffrey Wolk

Inventor： Adrian Winoto ,  Jeffrey Wolk

IPC: H01B13/00 ,  C09K13/06 ,  C09K13/00 ,  B82Y99/00

CPC classification number: H05K3/06 ,  B82Y10/00 ,  C23F1/00 ,  C23F1/02 ,  C23F1/30 ,  H01B1/22 ,  H01L31/022466 ,  H05K1/097 ,  H05K2201/026

Abstract: A patterned transparent conductor including a conductive layer coated on a substrate is described. More specifically, the transparent conductor can be patterned by screen-printing an acidic etchant formulation on the conductive layer. A screen-printable etchant formulation is also disclosed.

Abstract translation: 描述了包括涂覆在基底上的导电层的图案化透明导体。 更具体地，可以通过在导电层上丝网印刷酸性蚀刻剂配方来对透明导体进行图案化。 还公开了可印版蚀刻剂的配方。

公开(公告)号：US08025766B2

公开(公告)日：2011-09-27

申请号：US12529845

申请日：2008-03-04

Applicant: Hiroaki Kuwahara ,  Yoshio Bando ,  Chunyi Zhi ,  Chengchun Tang ,  Dmitri Golberg

Inventor： Hiroaki Kuwahara ,  Yoshio Bando ,  Chunyi Zhi ,  Chengchun Tang ,  Dmitri Golberg

IPC: D21F11/00

CPC classification number: D21H13/46 ,  B82Y10/00 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0386 ,  H05K2201/026 ,  H05K2201/0284

Abstract: A boron nitride fiber paper having a very small fiber diameter and exhibiting excellent heat resistance, mechanical properties and heat conductivity. The fiber paper is composed of a fiber assembly which contains boron nitride fibers having a fiber diameter of not more than 1 μm in an amount of not less than 40 wt %.

Abstract translation: 具有非常小的纤维直径且显示出优异的耐热性，机械性能和导热性的氮化硼纤维纸。 纤维纸由含有不小于40重量％的纤维直径不大于1μm的氮化硼纤维的纤维集合体组成。

公开(公告)号：US08018568B2

公开(公告)日：2011-09-13

申请号：US12712096

申请日：2010-02-24

Applicant: Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

Inventor： Pierre-Marc Allemand ,  Haixia Dai ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Jelena Sepa ,  Michael A. Spaid ,  Jeffrey Wolk

IPC: G02F1/13

CPC classification number: H01L31/022466 ,  B82Y10/00 ,  G02F1/13439 ,  H01B1/22 ,  H01L31/1884 ,  H01L51/0021 ,  H01L51/102 ,  H01L51/5206 ,  H01L51/5253 ,  H01L2251/5369 ,  H05K1/095 ,  H05K3/06 ,  H05K9/009 ,  H05K9/0092 ,  H05K2201/0108 ,  H05K2201/0248 ,  H05K2201/026 ,  Y02E10/50

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires that may be embedded in a matrix. The conductive layer is optically clear, patternable and is suitable as a transparent electrode in visual display devices such as touch screens, liquid crystal displays, plasma display panels and the like.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是透明的，可图案化的，并且适合作为诸如触摸屏，液晶显示器，等离子显示面板等的视觉显示装置中的透明电极。

公开(公告)号：US20110086192A1

公开(公告)日：2011-04-14

申请号：US12841535

申请日：2010-07-22

Applicant: Chih-Ming Lin ,  Shou-Jui Hsiang ,  Chien-Hui Lee

Inventor： Chih-Ming Lin ,  Shou-Jui Hsiang ,  Chien-Hui Lee

IPC: C09J7/02 ,  B32B5/00

CPC classification number: H05K3/281 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/1476 ,  Y10T428/24975 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852

Abstract: The present invention provides a cover film for a printed circuit board. The cover film includes an adhesive layer; a core layer made of a polymer; and a composite material layer formed on the core layer, comprising epoxy resin, a black material selected from the group consisting of a black pigment, carbon powder, nano carbon tube and a combination thereof, and an additive selected from the group consisting of titanium dioxide, boron nitride, barium sulfate and a combination thereof, wherein the core layer is disposed between the adhesive layer and the composite material layer, and the adhesive layer and the composite material layer have the same thickness or have a thickness difference being no more than 15 micro meters. The cover film of the preset invention is capable of shielding circuit patterns and has great folding endurance, and is thus applicable to flexible printed circuit boards.

Abstract translation: 本发明提供一种印刷电路板用覆盖膜。 覆盖膜包括粘合剂层; 由聚合物制成的芯层; 以及形成在芯层上的复合材料层，包括环氧树脂，选自黑色颜料，碳粉末，纳米碳管及其组合的黑色材料，以及选自二氧化钛 ，氮化硼，硫酸钡及其组合，其中芯层设置在粘合剂层和复合材料层之间，粘合剂层和复合材料层具有相同的厚度或厚度差不超过15 微米。 本发明的覆盖膜能够屏蔽电路图案并且具有很大的折叠耐久性，因此可应用于柔性印刷电路板。