公开(公告)号：US20150289372A1

公开(公告)日：2015-10-08

申请号：US14244142

申请日：2014-04-03

Applicant: Yikang Deng

Inventor： Yikang Deng

IPC: H05K1/11 ,  G01N21/95 ,  G01N21/64 ,  H05K3/42 ,  H01B1/12

CPC classification number: H05K3/42 ,  G01N21/64 ,  G01N21/643 ,  G01N21/6456 ,  G01N21/95 ,  G01N21/95684 ,  G01N2021/6439 ,  G01N2021/646 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0302 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2203/163 ,  Y10T29/49165

Abstract: A microelectronic substrate having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material. In one embodiment, the plated through hole may comprise a hole defined to extend from a first surface to an opposing second surface of the substrate core, wherein a conductive material layer is formed on a sidewall(s) of the substrate core hole and a conductive fill material, having a fluorescent component, is disposed to fill the remaining substrate core hole after forming the conductive material layer. In another embodiment of the present description, the fluorescent conductive fill material is used for the detection of defects.

Abstract translation: 一种微电子衬底，其具有具有延伸穿过其中的至少一个电镀通孔的衬底芯，其中所述电镀通孔包括荧光导电填充材料。 在一个实施例中，电镀通孔可以包括限定为从衬底芯的第一表面延伸到相对的第二表面的孔，其中导电材料层形成在衬底芯孔的侧壁上，并且导电 具有荧光成分的填充材料被设置成在形成导电材料层之后填充剩余的基底芯孔。 在本说明书的另一实施例中，荧光导电填充材料用于检测缺陷。

公开(公告)号：US20150237739A1

公开(公告)日：2015-08-20

申请号：US14704597

申请日：2015-05-05

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Sung EOM ,  Kwang-Seong CHOI ,  Hyun-cheol BAE ,  Jung Hyun NOH ,  Jong Tae MOON

IPC: H05K3/12 ,  H05K3/10 ,  H05K3/18 ,  H05K1/09

CPC classification number: H05K3/1216 ,  C25D5/02 ,  H01B1/02 ,  H01B1/22 ,  H05K1/09 ,  H05K1/095 ,  H05K3/102 ,  H05K3/188 ,  H05K3/246 ,  H05K2201/0245 ,  H05K2201/0302 ,  H05K2203/0425

Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

Abstract translation: 本发明涉及用于形成导电电路图案的图案形成组合物。 图案形成组合物包括Cu粉末，用于电耦合Cu粉末的焊料，聚合物树脂，固化剂和还原剂。 根据本发明，可以以低成本形成具有优良导电性的电路图案。

公开(公告)号：US20150014025A1

公开(公告)日：2015-01-15

申请号：US14360876

申请日：2014-01-22

Applicant: Nuovo Film Inc.

Inventor： Hakfei Poon

IPC: H05K1/02 ,  H05K1/09

CPC classification number: H01B1/02 ,  B22F9/16 ,  C23C22/58 ,  C23C22/73 ,  C23C22/78 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/22 ,  H01B13/30 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/0302 ,  H05K2201/032 ,  Y10T428/249921

Abstract: Discloses herein is a patterned transparent conductive electrode, comprises a substrate and a substantial single conductive layer on top of the substrate. The single conductive layer comprises a first region having a network of metal nanowires; and a second region, having a metal/metal oxide nanowire in a core shell structure.

Abstract translation: 本发明公开了一种图案化的透明导电电极，其包含衬底和在衬底顶部上的基本单个导电层。 单个导电层包括具有金属纳米线网络的第一区域; 以及具有芯壳结构中的金属/金属氧化物纳米线的第二区域。

公开(公告)号：US20140299365A1

公开(公告)日：2014-10-09

申请号：US14240815

申请日：2012-09-27

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Muthu Sebastian ,  Dominic M. Travasso ,  Nancy S. Lennhoff ,  Steven T. Swartz

IPC: H05K1/02 ,  H05K3/06

CPC classification number: H05K1/0274 ,  G06F3/044 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0302 ,  H05K2201/032

Abstract: An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer.

Abstract translation: 一种物品包括多层结构，例如触摸传感器，具有两个相对的侧面并且包括中心聚合物UV透明基板，在聚合物基板的两个主要相对表面的每一个上的透明导电层，金属导电层 在每个透明导电层上，以及每个金属导电层上的图案化成像掩模。