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公开(公告)号：US20200075535A1
公开(公告)日：2020-03-05
申请号：US16555060
申请日：2019-08-29
Inventor： Kwang-Seong CHOI , Yong Sung EOM , KeonSoo JANG , Seok-Hwan MOON , Hyun-cheol BAE
IPC: H01L23/00
Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
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公开(公告)号：US20140287556A1
公开(公告)日：2014-09-25
申请号：US13904572
申请日：2013-05-29
Inventor： Kwang-Seong CHOI , Yong Sung EOM , Hyun-cheol BAE , Haksun LEE
IPC: H01L23/00
CPC classification number: H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/1152 , H01L2224/1181 , H01L2224/13022 , H01L2224/13109 , H01L2224/13111 , H01L2224/16237 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/81815 , H01L2924/07802 , H01L2924/15788 , H01L2924/3841 , H05K3/3484 , H05K2201/0367 , H05K2203/043 , H01L2924/00 , H01L2924/00014 , H01L2924/0105 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029
Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.
Abstract translation: 提供了形成凸块的方法和具有该凸块的半导体器件。 该方法可以包括提供具有衬垫的衬底，形成覆盖焊盘的凸块制作器层并且包括树脂和焊料颗粒，热处理凸块制造器层以将焊料颗粒聚集到焊盘上，去除树脂以暴露聚集的焊料 颗粒，形成树脂层以覆盖聚集的焊料颗粒，并且回流聚集的焊料颗粒以在焊盘上形成凸块。
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公开(公告)号：US20150228640A1
公开(公告)日：2015-08-13
申请号：US14449028
申请日：2014-07-31
Inventor： JIN-GUN KOO , Jong II WON , Hyun-cheol BAE , Sang Gi KIM , Yil Suk YANG
CPC classification number: H01L29/0634 , H01L21/76224 , H01L21/8249 , H01L27/0623 , H01L27/0922 , H01L29/0657 , H01L29/1095 , H01L29/41741 , H01L29/6625 , H01L29/735 , H01L29/7813 , H01L29/7835
Abstract: Provided is a semiconductor device. The semiconductor device includes: a first semiconductor layer having a first region with a first device and a second region with a second device; a device isolation pattern provided in the first semiconductor layer and electrically separating the first device and the second device from each other; a drain provided on a lower surface of the first region of the first semiconductor layer; and a second semiconductor layer provided on a lower surface of the second region of the first semiconductor layer.
Abstract translation: 提供一种半导体器件。 该半导体器件包括：第一半导体层，其具有带有第一器件的第一区域和具有第二器件的第二区域; 设置在所述第一半导体层中并将所述第一装置和所述第二装置彼此电分离的装置隔离图案; 设置在所述第一半导体层的所述第一区域的下表面上的漏极; 以及设置在所述第一半导体层的所述第二区域的下表面上的第二半导体层。
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公开(公告)号：US20140367375A1
公开(公告)日：2014-12-18
申请号：US14089442
申请日：2013-11-25
Inventor： Hyun-cheol BAE , Yong Sung EOM , KWANG-SEONG CHOI , Haksun LEE
IPC: H05B6/00
CPC classification number: B23K35/0244 , B23K35/0222 , B23K35/3613 , H01L24/11 , H01L2224/111 , H01L2224/1132 , H01L2224/13109 , H01L2924/00014 , H01L2924/013 , H01L2924/0105
Abstract: Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.
Abstract translation: 提供一种制造焊料颗粒的方法，包括在第一容器中加入第一磁条，该第一容器包括通过混合过程形成的包含第一焊料颗粒的混合物，将第一容器设置在包括第二磁条的第二容器中， 棒和第二磁棒，并且向第一容器施加热量以熔化第一焊料颗粒。
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5.发明申请公开(公告)号：US20190211231A1
公开(公告)日：2019-07-11
申请号：US16221206
申请日：2018-12-14
Inventor： KeonSoo JANG , Yong Sung EOM , Kwang-Seong CHOI , Seok-Hwan MOON , Hyun-cheol BAE
IPC: C09J7/30 , C09J167/02 , H01L21/02
CPC classification number: C09J7/30 , C08G77/16 , C08K3/346 , C08K3/36 , C08K2003/0812 , C08K2003/2237 , C08K2003/2296 , C08K2003/3045 , C09J167/02 , H01L21/02304
Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.
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Patent Agency Ranking
公开(公告)号：US20170141071A1
公开(公告)日：2017-05-18
申请号：US14958341
申请日：2015-12-03
Inventor： Kwang-Seong CHOI , Hyun-cheol BAE , Yong Sung EOM , Jin Ho LEE , Haksun LEE
CPC classification number: H01L24/81 , H01L21/4853 , H01L21/563 , H01L25/50 , H01L2224/0401 , H01L2224/05568 , H01L2224/0557 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13144 , H01L2224/16145 , H01L2224/16237 , H01L2224/73104 , H01L2224/73204 , H01L2224/81001 , H01L2224/81002 , H01L2224/81091 , H01L2224/81143 , H01L2224/81208 , H01L2224/81224 , H01L2224/81444 , H01L2224/81447 , H01L2224/81815 , H01L2224/81911 , H01L2224/83224 , H01L2224/83862 , H01L2224/9211 , H01L2224/95 , H01L2924/00014 , H01L2924/014 , H01L2924/01083 , H01L2924/0105 , H01L2924/01049 , H01L2224/81 , H01L2224/83 , H01L2924/01047 , H01L2924/01029
Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.
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公开(公告)号：US20210162674A1
公开(公告)日：2021-06-03
申请号：US17109871
申请日：2020-12-02
Inventor： Kyung Hyun KIM , Hyun-cheol BAE
IPC: B29C64/321 , B33Y30/00 , B33Y10/00
Abstract: Provided is an apparatus for supplying a pellet, the apparatus including a supply chamber accommodating a pellet, a rotation unit connected to a driving unit, and a supply unit coupled to the supply chamber. Here, the rotation unit includes a rotation shaft extending in a first direction, a screw coupled to an outer surface of the rotation shaft and progressing in the first direction, and a scraper extending from the outer surface of the rotation shaft in a direction crossing the first direction. Also, the supply unit surrounds the screw, and the scraper is disposed in the supply chamber while being positioned higher than the screw.
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公开(公告)号：US20190287870A1
公开(公告)日：2019-09-19
申请号：US16356615
申请日：2019-03-18
Inventor： KeonSoo JANG , Yong Sung EOM , KWANG-SEONG CHOI , Seok-Hwan MOON , Hyun-cheol BAE
Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.
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公开(公告)号：US20160094258A1
公开(公告)日：2016-03-31
申请号：US14857818
申请日：2015-09-17
Inventor： Hyun-cheol BAE , Yong Sung EOM , Haksun LEE , KWANG-SEONG CHOI
CPC classification number: H05K1/0209 , H01L35/325 , H05K2201/10151 , H05K2201/10166 , H05K2201/10219
Abstract: Provided are a transceiver module and a communication apparatus including the same. The transceiver module includes a lower substrate, a thermoelectric device on the lower substrate, and an upper substrate which is disposed on the thermoelectric device and on which high frequency devices cooled by the thermoelectric device are mounted. The upper substrate includes a ceramic printed circuit board (PCB).
Abstract translation: 提供收发器模块和包括该模块的通信装置。 收发器模块包括下基板，下基板上的热电装置和设置在热电装置上的上基板，并且其上安装有由热电装置冷却的高频装置。 上基板包括陶瓷印刷电路板（PCB）。
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10.发明申请公开(公告)号：US20210358885A1
公开(公告)日：2021-11-18
申请号：US17387800
申请日：2021-07-28
Inventor： Kwang-Seong CHOI , Yong Sung EOM , KeonSoo JANG , Seok-Hwan MOON , Hyun-cheol BAE
IPC: H01L23/00
Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
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