公开(公告)号：US06640432B1

公开(公告)日：2003-11-04

申请号：US09547560

申请日：2000-04-12

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H01R900

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US5334031A

公开(公告)日：1994-08-02

申请号：US001303

申请日：1993-01-06

Applicant: Juergen K. Schmidt

Inventor： Juergen K. Schmidt

IPC: H01R4/01 ,  H01R4/18 ,  H01R12/55 ,  H01R12/71 ,  H05K3/32 ,  H05K3/34 ,  H01R9/09

CPC classification number: H01R12/57 ,  H01R4/01 ,  H05K3/3426 ,  H05K2201/0308 ,  H05K2201/10909 ,  H05K2201/10962 ,  Y02P70/613

Abstract: A contact device for an electrical component, particularly a connector, comprising at least one contact element, said contact element having a first contact portion located within said component and second contact portion projecting downwardly beyond said component and adapted to be connected to a conductor, in particular a conductor of a printed circuit board, by soldering, wherein the first contact portion consists of a resilient metallic material and the second contact portion consists of a shape memory alloy, the alloy having a transformation temperature which is significantly higher than the operation temperature of the contact device, the contact device being located or oriented such that it deforms towards said conductor above said transformation temperature.

Abstract translation: 一种用于电气部件，特别是连接器的接触装置，包括至少一个接触元件，所述接触元件具有位于所述部件内的第一接触部分和向下突出超过所述部件的第二接触部分，并且适于连接到导体， 特别是印刷电路板的导体，通过焊接，其中第一接触部分由弹性金属材料组成，第二接触部分由形状记忆合金构成，该合金的转变温度明显高于 接触装置，接触装置定位或定向成使得其在所述转变温度以上朝着所述导体变形。

公开(公告)号：US4950173A

公开(公告)日：1990-08-21

申请号：US843004

申请日：1986-03-24

Applicant: Tetsuro Minemura ,  Hisashi Ando ,  Yoshiaki Kita ,  Isao Ikuta

Inventor： Tetsuro Minemura ,  Hisashi Ando ,  Yoshiaki Kita ,  Isao Ikuta

IPC: B32B15/01 ,  H01R4/58 ,  H01R12/34 ,  H05K3/30 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K3/326 ,  H01R12/82 ,  H01R12/52 ,  H01R4/58 ,  H05K2201/0308 ,  H05K2201/0397 ,  H05K2201/1059 ,  H05K3/306 ,  H05K3/4092

Abstract: The present invention discloses a connector comprising: an insulating substrate having a plurality of through-holes and having a desired first circuit pattern formed on the substrate; female contactors each being formed and fixed around the edge of the through-hole and having an opening, an edge of which extends inwardly of the through-hole, said female contactors being electrically connected to said first pattern; and a male contactor comprising an insulating substrate having a desired second circuit pattern thereon and a plurality of male contactor pins fixed to the substrate and electrically connected to said second pattern, said pins each being located in a position corresponding to each of the openings of said female contactors, wherein said female contactors are made of a thin film of a shape memory alloy and the edge of each of the female contactors is given, before inserting each of the male contactor pins, such a shape memory that the contactor is returned to a position to close the opening when said contactor is subjected to a temperature above the martensitic transition temperature.

Abstract translation: 本发明公开了一种连接器，包括：绝缘基板，具有多个通孔，并且具有形成在所述基板上的期望的第一电路图案; 每个都形成并固定在通孔的边缘周围的阴接触器，并且具有开口，其开口向内延伸通孔，所述阴接触器电连接到所述第一图案; 以及阳接触器，其包括其上具有期望的第二电路图案的绝缘基板和固定到所述基板并且电连接到所述第二图案的多个阳接触器销，所述引脚各自位于对应于所述第二图案的每个开口的位置 阴接触器，其中所述阴接触器由形状记忆合金的薄膜制成，并且在插入每个阳接触器销之前，给出每个阴接触器的边缘，接触器返回到形状记忆合金的形状记忆体 当所述接触器经受高于马氏体转变温度的温度时关闭开口的位置。