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    Protection circuit module for secondary battery and battery pack having the same
    53.
    发明授权
    Protection circuit module for secondary battery and battery pack having the same 有权
    具有相同功能的二次电池和电池组的保护电路模块

    公开(公告)号：US08697265B2

    公开(公告)日：2014-04-15

    申请号：US12851450

    申请日：2010-08-05

    Applicant: Young-Cheol Jang

    Inventor： Young-Cheol Jang

    IPC: H01M2/22 ,  H01M2/34

    CPC classification number: H01M10/42 ,  H01M2/34 ,  H01M10/425 ,  H01M2200/00 ,  H05K3/32 ,  H05K2201/10037 ,  H05K2201/10393 ,  H05K2201/10962

    Abstract: There are provided a protection circuit module for a secondary battery and a battery pack having the same. In one embodiment, a protection circuit module includes a mounting substrate and at least one connecting member positioned at one side of the mounting substrate. The connecting member is provided with a first layer having a first surface, a second layer having a second surface opposite to the first surface, and at least one spacer that allows the first and second surfaces to be spaced apart from each other.

    Abstract translation: 提供了一种用于二次电池的保护电路模块和具有该保护电路模块的电池组。 在一个实施例中，保护电路模块包括安装基板和位于安装基板的一侧的至少一个连接构件。 连接构件设置有具有第一表面的第一层，具有与第一表面相对的第二表面的第二层和允许​​第一表面和第二表面彼此间隔开的至少一个间隔件。

    Modular interconnection system
    54.
    发明授权
    Modular interconnection system 失效
    模块化互连系统

    公开(公告)号：US08691422B2

    公开(公告)日：2014-04-08

    申请号：US13688089

    申请日：2012-11-28

    Applicant: Electronvault, Inc.

    Inventor： Robert R. Ferber, Jr.

    IPC: H01M2/24

    CPC classification number: H01R12/00 ,  H01L31/0504 ,  H01M2/202 ,  H01M2/348 ,  H01M8/0202 ,  H01M10/4235 ,  H01M2200/10 ,  H01R11/30 ,  H05K1/189 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10143 ,  Y02E10/50

    Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.

    Abstract translation: 提供了可释放模块化互连形式的模块化互连系统。 可释放的模块化互连可以包括具有多个可释放接触区域的基板，其中每个可释放的接触区域可以被定位成覆盖功率单元的相应端子。 可释放的模块化互连还可以包括固定到衬底的至少一个导电互连构件，其中导电互连构件包括设置在衬底的可释放接触区域内的至少一个导电可释放触点。 当向朝向动力单元的端子的方向向第一可释放接触区域施加力时，导电可释放接触件可被定位成与功率单元的端子形成可释放的电连接。 还提供了附加的和相关的方法和装置。

    IN VIVO SENSING DEVICE WITH A FLEXIBLE CIRCUIT BOARD
    56.
    发明申请
    IN VIVO SENSING DEVICE WITH A FLEXIBLE CIRCUIT BOARD 有权
    具有柔性电路板的血管感知装置

    公开(公告)号：US20130296650A1

    公开(公告)日：2013-11-07

    申请号：US13936265

    申请日：2013-07-08

    Applicant: GIVEN IMAGING LTD.

    Inventor： Zvika GILAD ,  Semion Khait ,  Chen Mann ,  Nathan Rubin

    IPC: A61B1/04

    CPC classification number: A61B1/041 ,  A61B1/051 ,  A61B5/6861 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10037 ,  H05K2201/10121 ,  H05K2201/2009 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/5313

    Abstract: A flexible circuit board for being inserted into an in-vivo imaging device is provided. The flexible circuit board may include a plurality of flexible installation units connected to one another through flexible connection units. The flexible installation units may be capable of having electrical components disposed thereon at a size suitable for being included in an in-vivo imaging device which may be inserted into a body lumen, e.g., a capsule endoscope. An in-vivo imaging device which may enclose such a full-flexible circuit board is also provided.

    Abstract translation: 提供了用于插入到体内成像装置中的柔性电路板。 柔性电路板可以包括通过柔性连接单元彼此连接的多个柔性安装单元。 灵活的安装单元可以能够以适于被包括在体内成像装置中的尺寸设置在其上的电气部件，该体内成像装置可插入体腔，例如胶囊型内窥镜。 还提供了可以包围这种全柔性电路板的体内成像装置。

    PCB with Both High and Low Current Traces for Energy Storage Modules
    57.
    发明申请
    PCB with Both High and Low Current Traces for Energy Storage Modules 审中-公开
    具有用于储能模块的高电流和低电流迹线的PCB

    公开(公告)号：US20130260182A1

    公开(公告)日：2013-10-03

    申请号：US13430824

    申请日：2012-03-27

    Applicant: Andrew A. Knitt ,  Wellington Ying-Wei Kwok

    Inventor： Andrew A. Knitt ,  Wellington Ying-Wei Kwok

    IPC: H01M2/00 ,  H05K1/11 ,  H01K3/10 ,  H05K7/06 ,  H01G9/00 ,  H05K1/00 ,  H01G9/155

    CPC classification number: H05K1/0265 ,  H01G11/76 ,  H01M2/1077 ,  H01M10/425 ,  H05K1/115 ,  H05K3/306 ,  H05K2201/10015 ,  H05K2201/10037 ,  Y10T29/49165

    Abstract: A printed circuit board (PCB) for an energy storage module is disclosed which includes a first side having a plurality of low current traces useful for monitoring and balancing applications and a second side coated with high current traces, useful for current or power transmission purposes. Vias connect the high current traces to the low current traces thereby electrically connecting both sides of the board together. The disclosed PCB is particularly useful for energy storage modules whereby monitoring and/or balancing of the modules is required in addition to the transmission of high current levels for power applications.

    Abstract translation: 公开了一种用于能量存储模块的印刷电路板（PCB），其包括具有用于监测和平衡应用的多个低电流迹线的第一侧和涂覆有高电流迹线的第二侧，其用于电流或电力传输目的。 通孔将高电流迹线连接到低电流迹线，从而将电路板的两侧电连接在一起。 所公开的PCB对于能量存储模块特别有用，除了为电力应用传输高电流水平之外，还需要模块的监控和/或平衡。

    Apparatus and Associated Methods
    59.
    发明申请
    Apparatus and Associated Methods 有权
    仪器和相关方法

    公开(公告)号：US20130107486A1

    公开(公告)日：2013-05-02

    申请号：US13590793

    申请日：2012-08-21

    Applicant: Pritesh HIRALAL

    Inventor： Pritesh HIRALAL

    IPC: H05K7/06 ,  H05K3/36

    CPC classification number: H01G11/84 ,  H01G11/08 ,  H01G11/14 ,  H01M10/04 ,  H05K1/145 ,  H05K1/162 ,  H05K3/0097 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/09909 ,  H05K2201/10037 ,  H05K2203/1147 ,  Y02E60/13 ,  Y10T29/49126

    Abstract: An apparatus comprising: first and second circuit boards with respective electrodes thereon, the first and second circuit boards in a bonded configuration; One or more first layers positioned to be proximal to the one or more of the electrodes; electrolyte proximal to the respective electrodes; one or more second layers configured to provide for the bonded configuration in which the first and second circuit boards are bonded together, under curing, such that the respective one or more first layers are positioned between the one or more second layers and the electrodes, the bonding defining a chamber therebetween with the electrodes therein and facing one another, the chamber comprising the electrolyte; and wherein the one or more first layers are configured to inhibit interaction of the electrolyte with the one or more second layers during curing.

    Abstract translation: 一种装置，包括：第一和第二电路板，其上具有各自的电极，所述第一和第二电路板处于接合构型; 定位成邻近所述一个或多个电极的一个或多个第一层; 靠近各个电极的电解质; 一个或多个第二层，被配置为提供其中第一和第二电路板结合在一起的接合构造，在固化下，使得相应的一个或多个第一层位于一个或多个第二层和电极之间， 接合，其间具有电极并且彼此面对的室，所述室包括电解质; 并且其中所述一个或多个第一层被配置为在固化期间抑制所述电解质与所述一个或多个第二层的相互作用。

    Modular interconnection system
    60.
    发明授权
    Modular interconnection system 失效
    模块化互连系统

    公开(公告)号：US08361646B2

    公开(公告)日：2013-01-29

    申请号：US12724388

    申请日：2010-03-15

    Applicant: Robert R. Ferber, Jr.

    Inventor： Robert R. Ferber, Jr.

    IPC: H01M2/24

    CPC classification number: H01R12/00 ,  H01L31/0504 ,  H01M2/202 ,  H01M2/348 ,  H01M8/0202 ,  H01M10/4235 ,  H01M2200/10 ,  H01R11/30 ,  H05K1/189 ,  H05K3/325 ,  H05K3/326 ,  H05K2201/083 ,  H05K2201/10037 ,  H05K2201/10143 ,  Y02E10/50

    Abstract: A modular interconnection system in the form of a releasable modular interconnect is provided. The releasable modular interconnect may include a substrate with a plurality of releasable contact regions, where each releasable contact region may be positioned to overlay a respective terminal of a power cell. The releasable modular interconnect may also include at least one conductive interconnect member affixed to the substrate, where the conductive interconnect member includes at least a one conductive releasable contact disposed within a releasable contact region of the substrate. The conductive releasable contact may be positioned to form a releasable electrical connection with a terminal of a power cell when a force is applied to the first releasable contact region in a direction toward the terminal of the power cell. Additional and related methods and apparatuses are also provided.

    Abstract translation: 提供了可释放模块化互连形式的模块化互连系统。 可释放的模块化互连可以包括具有多个可释放接触区域的基板，其中每个可释放的接触区域可以被定位成覆盖功率单元的相应端子。 可释放的模块化互连还可以包括固定到衬底的至少一个导电互连构件，其中导电互连构件包括设置在衬底的可释放接触区域内的至少一个导电可释放触点。 当向朝向动力单元的端子的方向向第一可释放接触区域施加力时，导电可释放接触件可被定位成与功率单元的端子形成可释放的电连接。 还提供了附加的和相关的方法和装置。

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