公开(公告)号：US20210010480A1

公开(公告)日：2021-01-14

申请号：US17035246

申请日：2020-09-28

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chen-Wei CHEN

IPC: F04D25/06 ,  F04D25/08 ,  F04D29/38

Abstract: An illumination fan includes a first frame, a second frame, a fan blade, a light guide and a light source. The first frame includes an accommodation space. The second frame is assembled with the first frame, and an inner surface of the second frame is substantially flat. The fan blade is rotatably disposed in the accommodation space. The light source is disposed on either the first frame or the second frame. The light guide is disposed on the first frame and surrounds the fan blade.

公开(公告)号：US10790215B1

公开(公告)日：2020-09-29

申请号：US16591452

申请日：2019-10-02

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei ,  Di Han Wu

IPC: H01L23/40 ,  H05K7/20 ,  H01L23/427 ,  F28D1/02 ,  F28D15/02

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source of a circuit board and including a main body part and an engagement assembly. The main body part includes a thermally conductive component and at least one fin assembly. The thermally conductive component is configured to be in thermal contact with the heat source, and the at least one fin assembly is thermally coupled to the thermally conductive component. The engagement assembly includes at least one first cover and at least one fastener. The at least one first cover presses against a side of the at least one fin assembly that is located away from the heat source. The at least one fastener is disposed through the at least one first cover and the at least one fin assembly and is configured to be fixed to the circuit board.

公开(公告)号：US10260781B2

公开(公告)日：2019-04-16

申请号：US14474260

申请日：2014-09-01

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chun-Hung Lin ,  Shui-Fa Tsai

IPC: F25B21/02 ,  F25B21/04 ,  F28D1/03 ,  H05K7/00 ,  F28F3/04 ,  F28F3/08 ,  F28D15/00 ,  F28F3/12

Abstract: A liquid cooling device having a diversion mechanism, connected with a heat source, includes a thermoelectric cooler, a first water block, a second water block and a pump. The thermoelectric cooler has a cold end and a hot end. The first water block is disposed between the heat source and the cold end of the thermoelectric cooler. The second water block is disposed on one side of the hot end of the thermoelectric cooler. The pump connects the first water block and the second water block via a water pipe. Thereby, the temperature of an inner fluid is reduced and the overall heat dissipation effect of the device is improved.

公开(公告)号：US20180341296A1

公开(公告)日：2018-11-29

申请号：US15974206

申请日：2018-05-08

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chia-Hsiang CHI

IPC: G06F1/18

Abstract: A casing includes a frame and first, second, third and fourth positioning portions. The frame includes two first and two second frame components connected together at one side thereof. Each first frame component has a first and a second surface. Each second frame component has a third and a fourth surface. The first and the third surfaces form an outer side surface. The second and the fourth surfaces form an inner side surface surrounded by the outer side surface. The first through the fourth positioning portions are respectively on the first through the fourth surfaces. Every adjacent first positioning portions are spaced apart by a first distance. Every adjacent second positioning portions are spaced apart by a second distance being different from the first distance. Every adjacent third positioning portions are spaced apart by the first distance. Every adjacent fourth positioning portions are spaced apart by the second distance.

公开(公告)号：US09891676B2

公开(公告)日：2018-02-13

申请号：US15616172

申请日：2017-06-07

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chia-Hsiang Chi ,  Yu-Qing Lyu

IPC: H02G3/08 ,  G06F1/20 ,  G06F1/18

CPC classification number: G06F1/20 ,  G06F1/183

Abstract: A computer case includes a case body, a carrying structure and a cooler. The case body is with an opening formed thereon. The carrying structure is detachably connected to the case body from the outside and corresponds to the position of the opening. The cooler is fixed to the carrying structure. This way, computer peripherals can be installed without disassembling the case body.

公开(公告)号：US20170290189A1

公开(公告)日：2017-10-05

申请号：US15624810

申请日：2017-06-16

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Qing LYU

IPC: H05K7/14

CPC classification number: H05K7/1488

Abstract: A mainframe computer with a supporting rack includes: a rack chassis and a supporting rack. The rack chassis has a first rack, and the first rack has a plurality of first positioning members. The supporting rack is arranged on the rack chassis, and the supporting rack has at least one first corresponding positioning member positioned corresponding to any one of at least one first positioning member. Therefore, the rack chassis and the support rack allow various types of objects (such as: solid state disk, cooling liquid tanks for cooling, hard drive or optical drive and so on) to be easily and conveniently installed onto the mainframe computer.

公开(公告)号：US20170242493A1

公开(公告)日：2017-08-24

申请号：US15436099

申请日：2017-02-17

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chung-Wei YANG

IPC: G06F3/02 ,  F21V19/00 ,  F21V23/06

CPC classification number: G06F3/0202 ,  F21V19/0015 ,  F21V23/06 ,  F21Y2115/10 ,  H01H13/83 ,  H01H2219/062

Abstract: A keyboard includes a circuit board having an upper surface, a lower surface opposite to the upper surface, and a plurality of cut-out portions, a plurality of key modules positioned on the upper surface and over the plurality of cut-out portions, and a plurality of light sources installed on the lower surface of the circuit board, wherein at least a portion of at least one light source is positioned in a corresponding cut-out portion. Each light source includes a light emitting portion coupled to the second circuit layer. At least some of the light emitting portion is disposed in the cut-out portion beneath and bounded by the key module.

公开(公告)号：US20170235350A1

公开(公告)日：2017-08-17

申请号：US15433073

申请日：2017-02-15

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Shui Fa TSAI

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H01L23/473

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

公开(公告)号：US09727103B2

公开(公告)日：2017-08-08

申请号：US14795696

申请日：2015-07-09

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Chia-Hsiang Chi ,  Yu-Qing Lyu

IPC: H02G3/08 ,  G06F1/20 ,  G06F1/18

CPC classification number: G06F1/20 ,  G06F1/183

Abstract: A computer case includes a case body, a carrying structure and a cooler. The case body is with an opening formed thereon. The carrying structure is detachably connected to the case body from the outside and corresponds to the position of the opening. The cooler is fixed to the carrying structure. This way, computer peripherals can be installed without disassembling the case body.

公开(公告)号：US20170195780A1

公开(公告)日：2017-07-06

申请号：US15391161

申请日：2016-12-27

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Shih-Hsiung HSIAO ,  Shau-Jiun HUANG

IPC: H04R1/28 ,  H04R1/10

CPC classification number: H04R1/2803 ,  H04R1/1008 ,  H04R1/1041 ,  H04R1/1058

Abstract: An earphone device comprises a casing, an earphone body and a switching unit. The casing includes an opening and an accommodating space, and the opening communicates with the accommodating space and an outside of the casing. The earphone body is disposed in the accommodating space. The switching unit is disposed on the casing. The switching unit can selectively seal or expose the opening to correspondingly switch the earphone device to an open-type earphone device or a closed-type earphone device.