公开(公告)号：US10790215B1

公开(公告)日：2020-09-29

申请号：US16591452

申请日：2019-10-02

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei ,  Di Han Wu

IPC: H01L23/40 ,  H05K7/20 ,  H01L23/427 ,  F28D1/02 ,  F28D15/02

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source of a circuit board and including a main body part and an engagement assembly. The main body part includes a thermally conductive component and at least one fin assembly. The thermally conductive component is configured to be in thermal contact with the heat source, and the at least one fin assembly is thermally coupled to the thermally conductive component. The engagement assembly includes at least one first cover and at least one fastener. The at least one first cover presses against a side of the at least one fin assembly that is located away from the heat source. The at least one fastener is disposed through the at least one first cover and the at least one fin assembly and is configured to be fixed to the circuit board.