公开(公告)号：US20170342178A1

公开(公告)日：2017-11-30

申请号：US15353154

申请日：2016-11-16

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH

IPC: C08F216/16 ,  C08J5/24 ,  C08K3/36 ,  C08L29/10

CPC classification number: C08F216/165 ,  C08J5/24 ,  C08J2329/10 ,  C08K3/36 ,  C08L29/10 ,  H05K1/00

Abstract: Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.

公开(公告)号：US20170079134A1

公开(公告)日：2017-03-16

申请号：US15363556

申请日：2016-11-29

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Ya-Wen KUO ,  Li-Chih YU ,  Ching-Hsin HO

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

Abstract translation: 多层印刷电路板包括：芯，其包括芯绝缘层和形成在芯绝缘层的两侧上的迹线; 在芯的两侧依次形成多个绝缘层; 以及分别形成在两个绝缘层之间和最外层绝缘层上的多个迹线层; 所述芯绝缘层含有不同于所述绝缘层的树脂材料，使得所述芯绝缘层的尺寸稳定性优于所述绝缘层的尺寸稳定性。

公开(公告)号：US09545018B2

公开(公告)日：2017-01-10

申请号：US14558193

申请日：2014-12-02

Applicant: Elite Material Co., Ltd.

Inventor： Ya-Wen Kuo ,  Li-Chih Yu ,  Ching-Hsin Ho

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

Abstract translation: 多层印刷电路板包括：芯，其包括芯绝缘层和形成在芯绝缘层的两侧上的迹线; 在芯的两侧依次形成多个绝缘层; 以及分别形成在两个绝缘层之间和最外层绝缘层上的多个迹线层; 所述芯绝缘层含有不同于所述绝缘层的树脂材料，使得所述芯绝缘层的尺寸稳定性优于所述绝缘层的尺寸稳定性。

公开(公告)号：US09394438B2

公开(公告)日：2016-07-19

申请号：US13759800

申请日：2013-02-05

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Li-Chih Yu ,  Tse-An Lee

IPC: B32B27/38 ,  C08L63/00

CPC classification number: C08L63/00 ,  Y10T428/31529 ,  C08L25/18 ,  C08L67/00 ,  C08L79/02 ,  C08L79/04

Abstract: A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

Abstract translation: 树脂组合物包含（A）环氧树脂; （B）苯并恶嗪（BZ）树脂; （C）苯乙烯马来酸酐（SMA）共聚物; 和（D）聚酯。 树脂组合物包括聚酯的特定成分，其特征在于其特定比例，以便实现根据树脂组合物制造的覆铜层压板的低ΔTg值，并获得低介电常数，低介电损耗因子，高 根据树脂组合物制造的覆铜层压板和印刷电路板的耐热性，高阻燃性。

公开(公告)号：US20160128180A1

公开(公告)日：2016-05-05

申请号：US14558193

申请日：2014-12-02

Applicant: Elite Material Co., Ltd.

Inventor： Ya-Wen KUO ,  Li-Chih YU ,  Ching-Hsin HO

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/46 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

Abstract translation: 多层印刷电路板包括：芯，其包括芯绝缘层和形成在芯绝缘层的两侧上的迹线; 在芯的两侧依次形成多个绝缘层; 以及分别形成在两个绝缘层之间和最外层绝缘层上的多个迹线层; 所述芯绝缘层含有不同于所述绝缘层的树脂材料，使得所述芯绝缘层的尺寸稳定性优于所述绝缘层的尺寸稳定性。

公开(公告)号：US09000077B2

公开(公告)日：2015-04-07

申请号：US13921447

申请日：2013-06-19

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh

IPC: C08L71/12 ,  C08L79/00 ,  C08G79/02 ,  C08L85/02 ,  B32B15/20 ,  B32B27/28 ,  C08L79/04

CPC classification number: C08L79/00 ,  B32B5/022 ,  B32B5/024 ,  B32B15/14 ,  B32B15/20 ,  B32B27/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G79/025 ,  C08K3/36 ,  C08L79/04 ,  C08L79/085 ,  C08L85/02

Abstract: A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.

Abstract translation: 具有乙烯基的磷腈化合物通过乙烯基化合物和具有羟基的磷腈化合物之间的反应制备，并加入到用于制备预浸料或树脂膜的树脂组合物中，以适用于覆铜层压板和印刷 从而实现满意的电路层叠性能，即低热膨胀系数，低介电性能，耐热性，耐火性和无卤素性。

公开(公告)号：US20140349090A1

公开(公告)日：2014-11-27

申请号：US13948399

申请日：2013-07-23

Applicant: ELITE MATERIAL CO., LTD.

Inventor： CHEN-YU HSIEH

IPC: H05K1/05 ,  C08L71/02

CPC classification number: C08L71/02 ,  C08K5/5399 ,  C08L21/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

Abstract translation: 无卤素树脂组合物包含（A）100重量份聚苯醚树脂; （B）10〜50重量份马来酰亚胺树脂; （C）5〜100重量份的聚丁二烯共聚物; （D）5〜30重量份的氰酸酯树脂; 和（E）15〜150重量份的磷腈。 无卤素树脂组合物的特征在于其特定成分和比例，以实现电路板层压性能，例如高玻璃化转变温度，低热膨胀系数，低介电性能，耐热性，阻燃性和无卤素 ，因此可以应用于预浸料或树脂膜的制造，从而适用于金属层叠体和印刷电路板的制造。

公开(公告)号：US20130115472A1

公开(公告)日：2013-05-09

申请号：US13680568

申请日：2012-11-19

Applicant: Elite Material Co., Ltd.

Inventor： Li-Chih YU ,  Tse-An LEE

IPC: C08L65/00 ,  B32B15/08

CPC classification number: C08L65/00 ,  B32B15/08 ,  C08G73/0655 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  C08L35/06 ,  C08L71/12 ,  C08L79/04 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/012 ,  Y10T428/31699 ,  C08K3/0033

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract translation: 无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）10〜150重量份的磷腈; 和（E）10〜1000重量份的无机填料。 通过使用特定比例的特定成分，无卤树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特点，可制成预浸料或树脂膜，从而用于铜包覆 层压板或印刷电路板。

公开(公告)号：US20250051566A1

公开(公告)日：2025-02-13

申请号：US18137026

申请日：2023-04-20

Applicant: Elite Material Co., Ltd.

Inventor： Tsung-Ju HSU ,  Shu-Hao CHANG

IPC: C08L71/12 ,  C08J5/24

Abstract: A resin composition is provided, which comprises: 1 part by weight to 20 parts by weight of a first resin represented by the following formula (1); and 70 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein m is an integer ranging from 10 to 250. The present invention also provides an article manufactured using the aforesaid resin composition.

公开(公告)号：US20240294745A1

公开(公告)日：2024-09-05

申请号：US18193854

申请日：2023-03-31

Applicant: Elite Material Co., Ltd.

Inventor： Yi-Fei YU ,  Ching-Huan LEE ,  Chen-Yu HSIEH

IPC: C08L51/00 ,  C08J5/24

CPC classification number: C08L51/003 ,  C08J5/244 ,  C08J2351/00 ,  C08J2471/12

Abstract: A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.