公开(公告)号：US20100225708A1

公开(公告)日：2010-09-09

申请号：US12683550

申请日：2010-01-07

Applicant: Jung-Huei Peng ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Ting-Hau Wu

Inventor： Jung-Huei Peng ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Ting-Hau Wu

IPC: B41J2/05

CPC classification number: B41J2/14088 ,  B41J2/14016 ,  B41J2/16 ,  B41J2/1626 ,  B41J2/1639 ,  B41J2/1642 ,  B41J2/1646

Abstract: MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.

Abstract translation: 描述了MEMS器件及其制造方法。 在一个实施例中，MEMS器件包括设置在衬底上的底部合金层。 内层材料层设置在底层合金层上，顶层合金层设置在内层材料层上，顶层合金层和底层合金层均含有至少两种金属的合金，其中内层含有合金和氮 。 顶部合金层，内部材料层和底部合金层形成MEMS特征。

公开(公告)号：US20100178732A1

公开(公告)日：2010-07-15

申请号：US12618477

申请日：2009-11-13

Applicant: Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Jung-Huei Peng

Inventor： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Shang-Ying Tsai ,  Jung-Huei Peng

IPC: H01L21/98

CPC classification number: B23K26/24 ,  H01L24/03 ,  H01L24/48 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/85 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: Methods and structures using laser bonding for stacking semiconductor substrates are described. In one embodiment, a method of forming a semiconductor device includes forming a trench in a first substrate, and a bond pad on a second substrate comprising active circuitry. A top surface of the bond pad includes a first material. The first substrate is aligned over the second substrate to align the trench over the bond pad. An electromagnetic beam is directed into the trench to form a bond between the first material on the bond pad and a second material at a bottom surface of the first substrate.

Abstract translation: 描述了使用激光键合堆叠半导体衬底的方法和结构。 在一个实施例中，形成半导体器件的方法包括在第一衬底中形成沟槽，以及在包括有源电路的第二衬底上的接合焊盘。 接合焊盘的顶表面包括第一材料。 第一衬底在第二衬底上对准以使沟槽在结合焊盘上对准。 电磁波束被引导到沟槽中以在接合焊盘上的第一材料和第一衬底的底表面处的第二材料之间形成结合。

公开(公告)号：US20100175479A1

公开(公告)日：2010-07-15

申请号：US12352449

申请日：2009-01-12

Applicant: Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai

Inventor： Ting-Hau Wu ,  Chun-Ren Cheng ,  Jiou-Kang Lee ,  Jung-Huei Peng ,  Shang-Ying Tsai

IPC: G01H9/00

CPC classification number: G01C19/56 ,  Y10T29/49002

Abstract: A gyroscope sensor includes a gyro disk. A first light source is configured to provide a first light beam adjacent to a first edge of the gyro disk. A first light receiver is configured to receive the first light beam for sensing a vibration at a first direction of the gyro disk.

Abstract translation: 陀螺传感器包括陀螺盘。 第一光源被配置为提供与陀螺盘的第一边缘相邻的第一光束。 第一光接收器被配置为接收用于感测陀螺盘的第一方向上的振动的第一光束。

公开(公告)号：US20100120260A1

公开(公告)日：2010-05-13

申请号：US12347250

申请日：2008-12-31

Applicant: Jiou-Kang Lee ,  Ting-Hau Wu ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Chun-Ren Cheng

Inventor： Jiou-Kang Lee ,  Ting-Hau Wu ,  Shang-Ying Tsai ,  Jung-Huei Peng ,  Chun-Ren Cheng

IPC: H01L21/30

CPC classification number: B81C1/00071 ,  B81B2201/052 ,  B81B2201/058 ,  H01L21/76898

Abstract: A method of forming an integrated circuit structure includes forming an opening in a substrate, with the opening extending from a top surface of the substrate into the substrate. The opening is filled with a filling material until a top surface of the filling material is substantially level with the top surface of the substrate. A device is formed over the top surface of the substrate, wherein the device includes a storage opening adjoining the filling material. A backside of the substrate is grinded until the filling material is exposed. The filling material is removed from the channel until the storage opening of the device is exposed.

Abstract translation: 形成集成电路结构的方法包括在衬底中形成开口，其中开口从衬底的顶表面延伸到衬底中。 开口填充有填充材料，直到填充材料的顶表面基本上与基板的顶表面平齐。 在衬底的顶表面上形成器件，其中该器件包括与填充材料相邻的存储开口。 研磨衬底的背面，直到填充材料暴露。 将填充材料从通道中取出直到设备的存储开口露出。

公开(公告)号：US20090127708A1

公开(公告)日：2009-05-21

申请号：US12271737

申请日：2008-11-14

Applicant: Kang LEE ,  Sang Jeen HONG

Inventor： Kang LEE ,  Sang Jeen HONG

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/11825 ,  H01L2224/11831 ,  H01L2224/119 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/00014

Abstract: Copper pillar tin bump on semiconductor chip comprises a copper layer composed on chip and a tin layer entirely wrapping whole outer surface of said copper layer. A method for forming of the copper pillar tin bump on semiconductor chip comprises: composing the first copper layer on said chip; applying photoresist to said first copper layer, exposing and developing a part of said photoresist, composing the copper pillar layer at the developed part of photoresist, composing the upper tin layer, removing said photoresist, removing said the first copper layer except disposing place of copper pillar layer, composing side tin layer. The minute pattern makes it possible to form a high density packaging by reducing a pitch of copper pillar tin bump. Signal delay can be reduced by low electric resistance, and underfill can be easily soaked.

Abstract translation: 半导体芯片上的铜柱锡凸块包括由芯片构成的铜层和完全包裹所述铜层整个外表面的锡层。 在半导体芯片上形成铜柱锡凸块的方法包括：在所述芯片上形成第一铜层; 对所述第一铜层施加光致抗蚀剂，曝光和显影所述光致抗蚀剂的一部分，构成光致抗蚀剂显影部分处的铜柱层，构成上锡层，去除所述光致抗蚀剂，除去所述第一铜层，除了铜的放置位置 柱层，组成侧锡层。 微型图案使得可以通过减小铜柱锡凸块的间距来形成高密度封装。 信号延迟可以通过低电阻降低，底部填充可以容易地浸泡。

公开(公告)号：US20080189320A1

公开(公告)日：2008-08-07

申请号：US12016200

申请日：2008-01-17

Applicant: Ching-Kang Lee

Inventor： Ching-Kang Lee

IPC: G06F17/30

CPC classification number: G06F16/958

Abstract: To eliminate inconvenience of creating dynamic web pages on line, the present invention provides a website generator capable of creating a dynamic website at an off-line status. The website generator disconnects with a web server, which is used for publishing the dynamic website on Internet, during the off-line status. The website generator includes a database and a webpage generator. The database is used for classifying a data source according to predetermined serial numbers and categories. The webpage generator includes a plurality of templates, and is used for importing the database and generating web pages of the dynamic website according to the database and the plurality of templates.

Abstract translation: 为了消除在线创建动态网页的不便，本发明提供一种能够在离线状态下创建动态网站的网站生成器。 在离线状态下，网站生成器与用于在互联网上发布动态网站的Web服务器断开连接。 网站生成器包括数据库和网页生成器。 该数据库用于根据预定的序列号和类别对数据源进行分类。 网页生成器包括多个模板，用于根据数据库和多个模板导入数据库和生成动态网站的网页。

公开(公告)号：US20080102832A1

公开(公告)日：2008-05-01

申请号：US11929376

申请日：2007-10-30

Applicant: Chaitali Sengupta ,  Yuan Kang Lee

Inventor： Chaitali Sengupta ,  Yuan Kang Lee

IPC: H04Q7/20 ,  H04B1/38

CPC classification number: H04W88/06 ,  H04L65/1016 ,  H04L65/1073 ,  H04L65/80 ,  H04W36/14 ,  H04W48/16 ,  H04W60/00 ,  H04W80/10 ,  Y02D70/1222 ,  Y02D70/1224 ,  Y02D70/1242 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/146 ,  Y02D70/23 ,  Y02D70/24

Abstract: A system, method, and computer-readable medium for a communications system to manage multiple radios and protocol stacks in a network and in a user equipment are provided. When active communications takes place over one radio system, an alternate radio system is managed in such a way that promotes both low-power operations and quick handovers. When communications are idle over all of the networks, one radio network may be assigned to be a primary radio network, and the alternate radio network may be switched off provided all incoming calls are routed to the primary radio network.

Abstract translation: 提供了一种用于通信系统管理网络和用户设备中的多个无线电和协议栈的系统，方法和计算机可读介质。 当通过一个无线电系统进行主动通信时，替代无线电系统以促进低功率操作和快速切换的方式进行管理。 当通信在所有网络上空闲时，可以将一个无线电网络分配为主要无线电网络，并且如果所有传入呼叫被路由到主要无线电网络，则替代无线电网络可以被关闭。

公开(公告)号：US20070268763A1

公开(公告)日：2007-11-22

申请号：US11834136

申请日：2007-08-06

Applicant: Jae IM ,  Kang LEE

Inventor： Jae IM ,  Kang LEE

IPC: G11C7/12

CPC classification number: G11C11/406 ,  G11C11/4094 ,  G11C2211/4065

Abstract: A method for controlling a precharge timing of a memory device is disclosed. The method includes making timing of generation of a signal for determining a precharge timing in a normal operation and a signal for determining a precharge timing in a refresh operation different from each other by making timing of generation of a signal for controlling the normal operation and a signal for controlling the refresh operation different from each other.

Abstract translation: 公开了一种用于控制存储器件的预充电定时的方法。 该方法包括：通过产生用于控制正常操作的信号的定时，产生用于确定正常操作中的预充电定时的信号的定时和用于确定彼此不同的刷新操作中的预充电定时的信号，以及 用于控制刷新操作的信号彼此不同。

公开(公告)号：US07231017B2

公开(公告)日：2007-06-12

申请号：US11191095

申请日：2005-07-27

Applicant: Michael Gertsenshteyn ,  Thomas Forrester ,  Tomasz Jannson ,  Kang Lee ,  Gajendra Savant

Inventor： Michael Gertsenshteyn ,  Thomas Forrester ,  Tomasz Jannson ,  Kang Lee ,  Gajendra Savant

IPC: G01N23/203 ,  G21K1/06

CPC classification number: G01N23/203 ,  G21K1/06

Abstract: A Lobster Eye X-ray Imaging System based on a unique Lobster Eye (LE) structure, X-ray generator, scintillator-based detector and cooled CCD (or Intensified CCD) for real-time, safe, staring Compton backscatter X-ray detection of objects hidden under ground, in containers, behind walls, bulkheads etc. In contrast to existing scanning pencil beam systems, Lobster Eye X-Ray Imaging System's true focusing X-ray optics simultaneously acquire ballistic Compton backscattering photons (CBPs) from an entire scene irradiated by a wide-open cone beam from one or more X-ray generators. The Lobster Eye X-ray Imaging System collects (focuses) thousands of times more backscattered hard X-rays in the range from 40 to 120 keV (or wavelength λ=0.31 to 0.1 Å) than current backscatter imaging sensors (BISs), giving high sensitivity and signal-to-noise ratio (SNR) and penetration through ground, metal walls etc. The collection efficiency of Lobster Eye X-ray Imaging System is optimized to reduce emitted X-ray power and miniaturize the device. This device is especially advantageous for and satisfies requirements of X-ray-based inspection systems, namely, penetration of the X-rays through ground, metal and other material concealments; safety; and man-portability. The advanced technology disclosed herein is also applicable to medical diagnostics and military applications such as mine detection, security screening and a like.

公开(公告)号：US20070049039A1

公开(公告)日：2007-03-01

申请号：US11320977

申请日：2005-12-30

Applicant: Jeong Jang ,  Kang Lee

Inventor： Jeong Jang ,  Kang Lee

IPC: H01L21/461

CPC classification number: H01L21/32139 ,  H01L21/31116 ,  H01L21/31138

Abstract: Method for fabricating a semiconductor device in which a by-product of etching is deposited on a photoresist film for using as a mask. The method for fabricating a semiconductor device includes the steps of depositing a polysilicon, and a bottom anti-refection coating on an entire surface of a substrate in succession, forming a photoresist film pattern on a predetermined portion of the bottom anti-refection coating, etching the bottom anti-refection coating by using the photoresist film pattern to deposit by-product of the etching on sidewalls of the photoresist pattern to form spacers, and etching the polysilicon by using the photoresist film pattern and the spacers, to form a line.

Abstract translation: 制造半导体器件的方法，其中蚀刻副产物沉积在用作掩模的光致抗蚀剂膜上。 制造半导体器件的方法包括以下步骤：在基片的整个表面上依次沉积多晶硅和底部抗反射涂层，在底部抗反射涂层的预定部分上形成光致抗蚀剂膜图案，蚀刻 通过使用光致抗蚀剂膜图案沉积蚀刻的副产物的底部抗反射涂层以形成间隔物，并且通过使用光致抗蚀剂膜图案和间隔物蚀刻多晶硅以形成线。