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    Metallization and stringing for back-contact solar cells
    61.
    发明授权
    Metallization and stringing for back-contact solar cells 有权

    公开(公告)号：US11973157B2

    公开(公告)日：2024-04-30

    申请号：US17980440

    申请日：2022-11-03

    Applicant: Maxeon Solar Pte. Ltd.

    Inventor： Akira Terao

    IPC: H01L31/05 ,  H01L31/0224

    CPC classification number: H01L31/0504 ,  H01L31/022441 ,  Y02E10/50

    Abstract: Metallization and stringing methods for back-contact solar cells, and resulting solar cells, are described. In an example, in one embodiment, a method involves aligning conductive wires over the back sides of adjacent solar cells, wherein the wires are aligned substantially parallel to P-type and N-type doped diffusion regions of the solar cells. The method involves bonding the wires to the back side of each of the solar cells over the P-type and N-type doped diffusion regions. The method further includes cutting every other one of the wires between each adjacent pair of the solar cells.

    Solar cell wafer
    63.
    外观设计
    Solar cell wafer 有权

    公开(公告)号：USD1016733S1

    公开(公告)日：2024-03-05

    申请号：US29791212

    申请日：2022-01-05

    Applicant: MAXEON SOLAR PTE. LTD.

    Designer： Hai-Yue Han ,  Katherine Han

    Abstract: FIG. 1 is a front elevational view of a solar cell wafer;
    FIG. 2 is a rear elevational view thereof;
    FIG. 3 is a top plan view thereof, the bottom plan view being a mirror image of the top plan view;
    FIG. 4 is a right side elevational view thereof, the left side elevational view being a mirror image of the right side elevational view;
    FIG. 5 is an enlarged view of callout box 5 from FIG. 1; and,
    FIG. 6 is an enlarged view of callout box 6 from FIG. 2.
    The dot-dash broken lines form no part of the claimed design.

    PHOTOVOLTAIC MODULE INTERCONNECT JOINTS
    66.
    发明公开
    PHOTOVOLTAIC MODULE INTERCONNECT JOINTS 审中-公开

    公开(公告)号：US20240014338A1

    公开(公告)日：2024-01-11

    申请号：US18370784

    申请日：2023-09-20

    Applicant: Maxeon Solar Pte. Ltd.

    Inventor： SUNNY SETHI ,  MICHELE GUIDE ,  GABRIELA BUNEA ,  THIERRY NGUYEN

    IPC: H01L31/05

    CPC classification number: H01L31/0512 ,  H01L31/0504 ,  Y02E10/50

    Abstract: Photovoltaic (PV) cells that can be interconnected with improved interconnect joints to form PV cell strings and PV modules. The improved interconnect joints comprise at least two types of adhesive bonding regions to maximize both electrical conductivity and mechanical strength of interconnect joints coupling terminals of PV cells. The disclosed approaches to PV cell interconnection provide greater manufacturing rates and higher quality PV cell strings and PV modules.

    Solar panel
    67.
    外观设计
    Solar panel 有权

    公开(公告)号：USD1009775S1

    公开(公告)日：2024-01-02

    申请号：US29617566

    申请日：2017-09-14

    Applicant: Maxeon Solar Pte. Ltd.

    Designer： Ratson Morad ,  Gilad Almogy ,  Itai Suez ,  Jean Hummel ,  Nathan Beckett

    Abstract: FIG. 1 is a front, top, and right side perspective view of a first embodiment of a solar panel;
    FIG. 2 is a front elevational view thereof, the rear elevational view forms no part of the claimed design;
    FIG. 3 is a top plan view thereof, the bottom plan view being a mirror image of the top plan view shown;
    FIG. 4 is a left side elevational view thereof, the right side elevational view being a mirror image of the left side elevational view shown;
    FIG. 5 is an enlarged, cross sectional view taken along line 5-5 shown in FIG. 2;
    FIG. 6 is a front, top, and right side perspective view of a second embodiment of a solar panel;
    FIG. 7 is a front elevational view thereof, the rear elevational view forms no part of the claimed design;
    FIG. 8 is a top plan view thereof, the bottom plan view being a mirror image of the top plan view shown;
    FIG. 9 is a left side elevational view thereof, the right side elevational view being a mirror image of the left side elevational view shown;
    FIG. 10 is an enlarged, cross sectional view taken along line 10-10 shown in FIG. 7;
    FIG. 11 is a front, top, and right side perspective view of a third embodiment of a solar panel;
    FIG. 12 is a front elevational view thereof, the rear elevational view forms no part of the claimed design;
    FIG. 13 is a top plan view thereof, the bottom plan view being a mirror image of the top plan view shown;
    FIG. 14 is a left side elevational view thereof, the right side elevational view being a minor image of the left side elevational view shown; and,
    FIG. 15 is an enlarged, cross sectional view taken along line 15-15 shown in FIG. 12.
    The broken lines in the drawings illustrate subject matter that forms no part of the claimed design.

    ALIGNED METALLIZATION FOR SOLAR CELLS
    68.
    发明公开
    ALIGNED METALLIZATION FOR SOLAR CELLS 审中-公开

    公开(公告)号：US20230411538A1

    公开(公告)日：2023-12-21

    申请号：US18239636

    申请日：2023-08-29

    Applicant: Maxeon Solar Pte. Ltd.

    Inventor： Taeseok Kim ,  David Smith

    IPC: H01L31/02 ,  H01L31/18 ,  H01L31/0216

    CPC classification number: H01L31/02008 ,  H01L31/02168 ,  H01L31/186

    Abstract: Aligned metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor layer over a semiconductor substrate. A first plurality of discrete openings is in the semiconductor layer and exposes corresponding discrete portions of the semiconductor substrate. A plurality of doped regions is in the semiconductor substrate and corresponds to the first plurality of discrete openings. An insulating layer is over the semiconductor layer and is in the first plurality of discrete openings. A second plurality of discrete openings is in the insulating layer and exposes corresponding portions of the plurality of doped regions. Each one of the second plurality of discrete openings is entirely within a perimeter of a corresponding one of the first plurality of discrete openings. A plurality of conductive contacts is in the second plurality of discrete openings and is on the plurality of doped regions.

    Single-step metal bond and contact formation for solar cells
    70.
    发明授权
    Single-step metal bond and contact formation for solar cells 有权

    公开(公告)号：US11784264B2

    公开(公告)日：2023-10-10

    申请号：US17389149

    申请日：2021-07-29

    Applicant: Maxeon Solar Pte. Ltd.

    Inventor： Matthieu Moors ,  Taeseok Kim

    IPC: H01L31/0224 ,  H01L31/18 ,  H01L31/068

    CPC classification number: H01L31/022433 ,  H01L31/022441 ,  H01L31/0682 ,  H01L31/18 ,  H01L31/186 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/50

    Abstract: A method for fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a first metal layer on the dielectric region. The method can also include forming a second metal layer on the first metal layer and locally heating a particular region of the second metal layer, where heating includes forming a metal bond between the first and second metal layer and forming a contact between the first metal layer and the solar cell structure. The method can include forming an adhesive layer on the first metal layer and forming a second metal layer on the adhesive layer, where the adhesive layer mechanically couples the second metal layer to the first metal layer and allows for an electrical connection between the second metal layer to the first metal layer.

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