公开(公告)号：US20160346820A1

公开(公告)日：2016-12-01

申请号：US14917371

申请日：2014-12-12

Applicant: SANMINA CORPORATION

Inventor： Winfried Braun ,  Christian Klempel ,  Rene Baadjou ,  Rolf Kümmerling

IPC: B21B25/00

CPC classification number: B21B25/00

Abstract: A piercing mandrel for piercing heated round blocks of metal for the production of seamless pipes, having a piercing mandrel nose and a piercing mandrel main body which can be connected to a mandrel bar. The outer diameter of the piercing mandrel nose is formed in a conically tapering manner in the longitudinal direction towards the piercing mandrel main body in order to increase the durability of the piercing mandrel when used for piercing round blocks of metal, in particular higher-alloyed steel materials which are difficult to work, by means of skew rolling providing a qualitative improvement of the inner surface of the pierced round block and reducing tool costs.

Abstract translation: 一种用于刺穿加热的金属圆块的穿孔心轴，用于生产无缝管，具有穿刺心轴鼻和可连接到芯棒的穿刺心轴主体。 穿刺心轴鼻部的外径在朝向穿孔心轴主体的纵向方向上以锥形锥形形成，以便在用于刺穿圆形金属块，特别是较高合金钢的时候增加穿孔心轴的耐久性 通过倾斜轧制难以加工的材料提供穿孔圆块的内表面的定性改进并降低工具成本。

公开(公告)号：US09438347B2

公开(公告)日：2016-09-06

申请号：US14278004

申请日：2014-05-15

Applicant: Sanmina Corporation

Inventor： Robert Benjamin Conger ,  David R. Porter

IPC: H04B10/00 ,  H04B10/40 ,  H04B10/69 ,  H04L12/40

CPC classification number: H04B10/40 ,  H04B10/69 ,  H04B10/693 ,  H04L2012/4028

Abstract: In one aspect, an optical media converter is provided for use within aircraft data networks. In one example, the optical media converter converts electrical doublet signals to optical Manchester signals, and vice versa. In an illustrative example, the optical media converter includes a receiver circuit coupled to a fiber optic port for receiving a Manchester-encoded input signal using an edge-coupled filter that filters out signals not associated with edges within the time-varying input signal Manchester signal. The optical media converter also provides, for example, for high common mode rejection and includes logic to correct for bit-width skew. The optical media converter is well-suited for use in converting doublet signals generated by a serial interface module of a line replaceable unit of an ARINC 629-compatible system into optical Manchester signals for transmission over a fiber optic bus system interconnected by a star coupler.

Abstract translation: 在一个方面，提供一种用于飞行器数据网络的光学介质转换器。 在一个示例中，光学介质转换器将电双绞线信号转换为曼彻斯特信号，反之亦然。 在说明性示例中，光学介质转换器包括耦合到光纤端口的接收器电路，用于使用边缘耦合滤波器接收曼彻斯特编码的输入信号，该边沿耦合滤波器滤除与时变输入信号曼彻斯特信号内的边缘无关的信号 。 光学介质转换器还提供例如高共模抑制，并且包括校正位宽偏移的逻辑。 光学介质转换器非常适合用于将由ARINC 629兼容系统的线路可更换单元的串行接口模块生成的双重信号转换为光学曼彻斯特信号，以通过由星形耦合器互连的光纤总线系统进行传输。

公开(公告)号：US09287235B2

公开(公告)日：2016-03-15

申请号：US14696483

申请日：2015-04-27

Applicant: SANMINA CORPORATION

Inventor： Paul Sweere

IPC: B23K31/02 ,  H01L23/00 ,  H05K3/46 ,  B23K1/00 ,  H05K1/14 ,  H05K3/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H05K3/34 ,  H01L25/03

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K31/02 ,  B23K2101/42 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/93 ,  H01L2924/1436 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/4697 ,  H05K2201/10378 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83815

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

公开(公告)号：US20160011927A1

公开(公告)日：2016-01-14

申请号：US14794764

申请日：2015-07-08

Applicant: Sanmina Corporation

Inventor： Paul Sweere

IPC: G06F11/07 ,  G06F1/26

CPC classification number: G06F1/266 ,  G06F1/263 ,  G06F11/006

Abstract: The present disclosure is directed to visual field replacement unit (FRU) identification and retaining FRU status information of one or more field replaceable units in a host system device when one or more of the field replaceable units is removed from the host system device disconnecting host power to the removed field replaceable unit(s). The one or more field replaceable units may be located on a carrier printed circuit board assembly and the host system device may contain multiple field replaceable units and/or multiple carrier printed circuit board subassemblies. Once the host power is disconnected from the carrier, an alternate power source continues to provide power to keep the FRU indicator illuminated for repairs or replacement. The FRU indicator is illuminated long enough for a service technician to place the carrier on a bench or table top and recognize the failed FRU from the remaining FRUs.

Abstract translation: 本公开涉及当主机系统设备中的一个或多个现场可更换单元从主系统设备断开主机功率时，在主机系统设备中的视场替换单元（FRU）识别和保留一个或多个现场可更换单元的FRU状态信息 到已移除的现场可更换单元。 一个或多个现场可更换单元可以位于载体印刷电路板组件上，并且主机系统设备可以包含多个现场可更换单元和/或多个载体印刷电路板子组件。 一旦主机与运营商断开连接，备用电源将继续提供电源，以保持FRU指示灯亮起以进行维修或更换。 FRU指示灯被照亮足够长的时间，维修技术人员将承运人放置在工作台或桌面上，并从剩余的FRU识别故障FRU。

公开(公告)号：US20150228615A1

公开(公告)日：2015-08-13

申请号：US14696483

申请日：2015-04-27

Applicant: SANMINA CORPORATION

Inventor： Paul Sweere

IPC: H01L23/00 ,  B23K1/00 ,  B23K31/02 ,  H01L23/498

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K31/02 ,  B23K2101/42 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/93 ,  H01L2924/1436 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/4697 ,  H05K2201/10378 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83815

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract translation: 提供了形成堆叠插入件的方法，其形成更紧凑和/或可靠的插入器腔。 根据一种方法，使用分割过程，其将多单元，多层PCB面板部分地切割成沿着腔区域的内壁/边缘的受控深度，其中每个插入器单元位置限定在PCB面板内。 然后将空腔区域内的材料（通过路由）移除到受控的深度，以形成每个插入单元位置的内部空腔。 然后可以从PCB面板移除支柱。 作为腔区域的内壁的初始部分切割的结果，空腔的角部可以具有用于配合在BGA /存储器件（其具有非常方形拐角）的顶部上的正方形构造。

公开(公告)号：US09016552B2

公开(公告)日：2015-04-28

申请号：US14216517

申请日：2014-03-17

Applicant: Sanmina Corporation

Inventor： Paul Sweere

IPC: B23K31/02 ,  H01L23/00 ,  H05K3/46 ,  B23K1/00

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K31/02 ,  B23K2101/42 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/93 ,  H01L2924/1436 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/4697 ,  H05K2201/10378 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83815

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract translation: 提供了形成堆叠插入件的方法，其形成更紧凑和/或可靠的插入器腔。 根据一种方法，使用分割过程，其将多单元，多层PCB面板部分地切割成沿着腔区域的内壁/边缘的受控深度，其中每个插入器单元位置限定在PCB面板内。 然后将空腔区域内的材料（通过路由）移除到受控的深度，以形成每个插入单元位置的内部空腔。 然后可以从PCB面板移除支柱。 作为腔区域的内壁的初始部分切割的结果，空腔的角部可以具有用于配合在BGA /存储器件（其具有非常方形拐角）的顶部上的正方形构造。

公开(公告)号：US20140263585A1

公开(公告)日：2014-09-18

申请号：US14216517

申请日：2014-03-17

Applicant: SANMINA CORPORATION

Inventor： Paul Sweere

IPC: H01L23/00 ,  H05K3/46

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K31/02 ,  B23K2101/42 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/11822 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81205 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/93 ,  H01L2924/1436 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/3436 ,  H05K3/4697 ,  H05K2201/10378 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/83815

Abstract: Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).

Abstract translation: 提供了形成堆叠插入件的方法，其形成更紧凑和/或可靠的插入器腔。 根据一种方法，使用分割过程，其将多单元，多层PCB面板部分地切割成沿着腔区域的内壁/边缘的受控深度，其中每个插入器单元位置限定在PCB面板内。 然后将空腔区域内的材料（通过路由）移除到受控的深度，以形成每个插入单元位置的内部空腔。 然后可以从PCB面板移除支柱。 作为腔区域的内壁的初始部分切割的结果，空腔的角部可以具有用于配合在BGA /存储器件（其具有非常方形拐角）的顶部上的正方形构造。

公开(公告)号：US12256515B2

公开(公告)日：2025-03-18

申请号：US17981007

申请日：2022-11-04

Applicant: SANMINA CORPORATION

Inventor： Odie Banks Killen, Jr. ,  John Albert Bauer, Jr.

IPC: H05K7/14 ,  F16L3/06

Abstract: According to an aspect a perch is provided comprising a bracket configured to be attached to a rack-mount component, a bar having a width and an elongated surface, the bar having tabs configured to engage with the bracket, and an attachment screw to secure the bar to the bracket so that the bar extends horizontally across a portion of the component.

公开(公告)号：US20240155814A1

公开(公告)日：2024-05-09

申请号：US17980351

申请日：2022-11-03

Applicant: SANMINA CORPORATION

Inventor： Odie Banks Killen, JR. ,  John Albert Bauer, JR. ,  Daniel Joseph Gregory ,  Charles Christoper Hill ,  Xin Wang ,  Kenneth Dale Van Antwerp, JR.

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20727 ,  H05K7/1495 ,  H05K7/20136

Abstract: Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at least one fan relative to the first end of the chassis. A carrier including a frame may be coupled to the at least one storage media device, where the frame includes an elongated member extending away from the storage media device toward the first end of the chassis. Other aspects, embodiments, and features are also included.

公开(公告)号：US20240093702A1

公开(公告)日：2024-03-21

申请号：US18519695

申请日：2023-11-27

Applicant: Sanmina Corporation

Inventor： Odie Banks Killen, JR. ,  Bradley S. Holway ,  Matthew J. Babcock

IPC: F04D29/66 ,  F04D19/00 ,  F04D29/54 ,  G11B33/08 ,  H05K7/20

CPC classification number: F04D29/664 ,  F04D19/002 ,  F04D29/541 ,  G11B33/08 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20736 ,  F04D25/166

Abstract: One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.