公开(公告)号：US20240105672A1

公开(公告)日：2024-03-28

申请号：US17921618

申请日：2021-07-06

Applicant: SHINKAWA LTD.

Inventor： Shigeru HAYATA ,  Osamu KAKUTANI

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L24/85 ,  H01L2224/78001 ,  H01L2224/78304 ,  H01L2224/78353 ,  H01L2224/78702 ,  H01L2224/78753 ,  H01L2224/85123 ,  H01L2224/8518 ,  H01L2224/859 ,  H01L2924/40

Abstract: A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.

公开(公告)号：US11908827B2

公开(公告)日：2024-02-20

申请号：US17435041

申请日：2020-03-04

Applicant: SHINKAWA LTD.

Inventor： Naoki Sekine ,  Yasuo Nagashima

IPC: B23K20/00 ,  H01L23/00 ,  B23K101/40

CPC classification number: H01L24/78 ,  B23K20/005 ,  B23K2101/40 ,  H01L2224/7855 ,  H01L2224/78611 ,  H01L2224/78824 ,  H01L2224/78901

Abstract: A wire bonding apparatus connecting a lead of a mounted member with an electrode of a semiconductor die through a wire comprises a capillary through which the wire is inserted, a shape acquisition part which acquires the shape of the lead to which the wire is connected, a calculating part which calculates an extending direction of a wire tail extending from the end of the capillary based on the shape of a lead to which the wire is connected next, and a cutting part which moves the capillary in the extending direction and cuts the wire to form the wire tail after the lead is connected with the electrode through the wire. Thus, in the wire bonding using wedge bonding, joining part tails (183a, 283a, 383a) formed in continuation to a first bonding point can be prevented from coming into contact with each other.

公开(公告)号：US11769749B2

公开(公告)日：2023-09-26

申请号：US17427098

申请日：2020-04-08

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama ,  Tetsuya Utano

IPC: H01L23/00 ,  H05K13/04

CPC classification number: H01L24/75 ,  H05K13/046 ,  H05K13/0409 ,  H01L24/73 ,  H01L2224/73204 ,  H01L2224/7555 ,  H01L2224/7598 ,  H01L2224/75745

Abstract: A mounting apparatus for mounting a semiconductor chip on a mounting body includes a stage on which the mounting body is placed, a mounting head provided to be movable up and down above the stage and pressing the semiconductor chip against the mounting body, and a film disposition mechanism which interposes a belt-like cover film between the mounting head and the stage, and the film disposition mechanism includes a film feeding part having a feeding reel around which at least the cover film has been wound, a film recovery part having a recovery reel also winding up at least the fed cover film, and one or more relay shafts provided in the course of a path of the cover film from the feeding reel to the recovery reel and by which the cover film is folded back in order to bend a moving direction of the cover film.

公开(公告)号：US11749541B2

公开(公告)日：2023-09-05

申请号：US17602279

申请日：2020-04-07

Applicant: SHINKAWA LTD.

Inventor： Shigeyuki Sekiguchi ,  Yuji Eguchi ,  Kohei Seyama

IPC: H01L21/67 ,  H05K13/04 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L21/67144 ,  H01L21/67132 ,  H01L24/75 ,  H05K13/0419 ,  H01L21/6838 ,  H01L2224/7565 ,  H05K13/0409

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

公开(公告)号：US11717912B2

公开(公告)日：2023-08-08

申请号：US17431718

申请日：2020-03-16

Applicant: SHINKAWA LTD.

Inventor： Yohei Uchida

IPC: B23K20/00 ,  B23K20/10 ,  B23K20/26 ,  H01L23/00 ,  B23K101/40 ,  B23K101/42

CPC classification number: B23K20/005 ,  B23K20/10 ,  B23K20/26 ,  H01L24/78 ,  B23K2101/40 ,  B23K2101/42 ,  H01L2224/789 ,  H01L2224/78301 ,  H01L2224/78349

Abstract: A capillary guide device (40) includes: a guide body portion (41) capable of being in contact with a capillary (8) held in a hole (7h); and a drive portion (42) which arranges the guide body portion (41) at a position capable of being in contact with the capillary (8) by moving the guide body portion (41) along an X-axis direction. The drive portion (42) includes: a table (46) connected to the guide body portion (41); a drive shaft (47b) extending in the X-axis direction and exhibiting a frictional resistance force with the table (46); and an ultrasonic element (47a) fixed to an end of the drive shaft (47b) and supplying an ultrasonic wave to the drive shaft (47b).

公开(公告)号：US20230163097A1

公开(公告)日：2023-05-25

申请号：US17912527

申请日：2020-12-18

Applicant: SHINKAWA LTD.

Inventor： Hiroaki YOSHINO ,  Shinsuke TEI

IPC: H01L23/00 ,  B23K20/10

CPC classification number: H01L24/78 ,  H01L24/85 ,  B23K20/10 ,  H01L2224/7855 ,  H01L2224/85181 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2224/78353 ,  H01L2224/789 ,  H01L2224/85205 ,  H01L2224/85947 ,  B23K2101/40

Abstract: A wire bonding device for performing a wire bonding process includes: a bonding tool for inserting a wire; an ultrasonic vibrator; a drive mechanism for moving the bonding tool; and a control part. The control part performs: a bonding step of bonding the wire to a bonding point; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps including the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire.

公开(公告)号：US20230129417A1

公开(公告)日：2023-04-27

申请号：US17908541

申请日：2021-02-17

Applicant: SHINKAWA LTD.

Inventor： Toru MAEDA ,  Hiroshi OMATA

IPC: H01L21/67 ,  H01L21/683

Abstract: In a pickup apparatus of a semiconductor die, a suction surface sucking a wafer sheet is a curved surface which is curved convexly upward, and after raising a stage to push up the wafer sheet, a control part creates a vacuum inside the stage to suck the wafer sheet to the suction surface, and after sucking the wafer sheet to the suction surface, the control part protrudes a moving element from the suction surface, and picks up a semiconductor die from the wafer sheet by a collet.

公开(公告)号：US20220406747A1

公开(公告)日：2022-12-22

申请号：US17436621

申请日：2020-12-21

Applicant: SHINKAWA LTD.

Inventor： Hideharu NIHEI

IPC: H01L23/00 ,  H01L25/065

Abstract: The present invention includes: a position detection unit (55) detecting positions of semiconductor chips and storing each detected position in a position database (56); a position correction unit (57) outputting a corrected bonding position; and a bonding control unit (58) performing bonding of the semiconductor chips based on the corrected bonding position input from the position correction unit (57). The position correction unit (57) calculates position shift amounts between the semiconductor chips of respective stages and an accumulated position shift amount, and when the accumulated position shift amount is greater than or equal to a predetermined threshold value, corrects the position of the semiconductor chip by the accumulated position shift amount and outputs it as the corrected bonding position, and the bonding control unit (58) performs bonding of the semiconductor chip of the next stage at the corrected bonding position input from the position correction unit.

公开(公告)号：US11508688B2

公开(公告)日：2022-11-22

申请号：US16087087

申请日：2017-03-24

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama ,  Yuji Eguchi ,  Shoji Wada

IPC: H01L23/00 ,  H01L21/52 ,  H01L25/065 ,  H01L25/10

Abstract: The present invention has: a heater; and a bonding tool having a lower surface on which a memory chip is adsorbed; and an upper surface attached to the heater, and is provided with a bonding tool which presses the peripheral edge of the memory chip to a solder ball in a first peripheral area of the lower surface and which presses the center of the memory chip (60) to a DAF having a heat resistance temperature lower than that of the solder ball in a first center area. The amount of heat transmitted from the first center area to the center of the memory chip is smaller than that transmitted from the first peripheral area (A) to the peripheral edge of the memory chip. Thus, the bonding apparatus in which the center of a bonding member can be heated to a temperature lower than that at the peripheral edge can be provided.

公开(公告)号：US11469125B2

公开(公告)日：2022-10-11

申请号：US16650871

申请日：2018-08-28

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama ,  Tetsuya Utano ,  Yuichiro Noguchi

IPC: H01L21/677 ,  H01L21/52 ,  H02K41/02 ,  G05B19/19

Abstract: A device for linearly moving bases with respect to an object, includes first and second bases, a linear scale provided with graduations at pitches in the moving direction, first and second encoder heads attached to the first and second bases, and a control unit. The control unit maintains an interval between the first and second encoder heads to be constant, and moves the first and second bases while sequentially detects a first and second graduation numbers, and calculates a distance on the scale between the first and second encoder heads by multiplying a difference between the first and second graduation numbers by the pitch, and calculates a position correction coefficient of the scale as a ratio of the interval with respect to the calculated distance, and controls the movement amount of the first movable body and the second movable body based on the position correction coefficient.