公开(公告)号：US20170250133A1

公开(公告)日：2017-08-31

申请号：US15053747

申请日：2016-02-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/29 ,  C08K3/08 ,  H01L21/56 ,  H01L23/00 ,  C08K3/22 ,  H01L49/02 ,  H01L23/31

CPC classification number: H01L23/5227 ,  C08K3/08 ,  C08K3/22 ,  C08K2003/0843 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/2265 ,  C08K2003/2289 ,  C08K2003/2293 ,  H01F1/26 ,  H01F1/37 ,  H01F17/0013 ,  H01F41/0206 ,  H01F41/04 ,  H01F41/046 ,  H01F2003/106 ,  H01L21/321 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L28/10 ,  H01L2224/13022 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/831 ,  H01L2224/8312 ,  H01L2224/83855 ,  H01L2224/83909 ,  H01L2224/92125 ,  H01L2924/0665 ,  H01L2924/13067 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/2064 ,  H01L2924/2075 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.