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公开(公告)号:US10761354B2
公开(公告)日:2020-09-01
申请号:US16153861
申请日:2018-10-08
Applicant: Japan Display Inc.
Inventor: Akihiro Hanada , Isao Suzumura , Hajime Watakabe
IPC: G02F1/1333 , G02F1/1368 , G02F1/1335 , G02F1/1362 , H01L27/12 , G09F9/30 , H05K1/18 , G02F1/1339 , H01L27/32 , H01L51/00
Abstract: The purpose of the invention is to realize the flexible display device of high reliability; specifically in a structure that a bending area is in a terminal area, and in that disconnection of the wiring does not occur in the bending area. The concrete structure is that: a display device having a display area, a driving circuit area and a bending area comprising: a first thin film transistor and a first interlayer insulating film are formed in the display area, a second thin film transistor and a second interlayer insulating film are formed in the driving circuit area, terminal wirings to connects the display area and the driving circuit area are formed in the bending area.
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公开(公告)号:US10727254B2
公开(公告)日:2020-07-28
申请号:US16447000
申请日:2019-06-20
Applicant: Japan Display Inc.
Inventor: Toshinari Sasaki , Hajime Watakabe , Akihiro Hanada , Marina Shiokawa
IPC: H01L27/12 , H01L29/786 , H01L29/423 , H01L29/49
Abstract: A semiconductor device includes a oxide semiconductor layer, a gate electrode arranged above the oxide semiconductor layer, a gate insulation layer between the oxide semiconductor layer and the gate electrode, a first insulation layer arranged above the oxide semiconductor layer and arranged with a first aperture part, wiring including an aluminum layer arranged above the first insulation layer, the wiring being electrically connected to the oxide semiconductor layer via the first aperture part, a barrier layer including aluminum oxide above the first insulation layer, above the wiring and covering a side surface of the wiring, and an organic insulation layer arranged above the barrier layer.
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公开(公告)号:US10439010B2
公开(公告)日:2019-10-08
申请号:US15686781
申请日:2017-08-25
Applicant: Japan Display Inc.
Inventor: Akihiro Hanada
IPC: H01L27/32 , G02F1/1362 , G02F1/1368 , G09G3/3225 , G09G3/36 , H01L27/12 , H01L29/786
Abstract: The purpose of the present invention is to form both LTPS TFT and semiconductor TFT in a same substrate. The feature of the display device to realize the above purpose is that: a display device having a display area containing a pixel comprising: the pixel includes a first TFT having an oxide semiconductor, a gate insulating film is formed on the oxide semiconductor, a first gate electrode is formed on the gate insulating film, a first source/drain electrode formed by a metal or an alloy contacts a source or a drain of the semiconductor the first gate electrode and the first source/drain electrode are formed by the same material.
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公开(公告)号:US10373982B2
公开(公告)日:2019-08-06
申请号:US15619677
申请日:2017-06-12
Applicant: Japan Display Inc.
Inventor: Toshinari Sasaki , Hajime Watakabe , Akihiro Hanada , Marina Shiokawa
IPC: H01L27/12 , H01L29/786 , H01L29/423 , H01L29/49
Abstract: A semiconductor device includes a oxide semiconductor layer, a gate electrode arranged above the oxide semiconductor layer, a gate insulation layer between the oxide semiconductor layer and the gate electrode, a first insulation layer arranged above the oxide semiconductor layer and arranged with a first aperture part, wiring including an aluminum layer arranged above the first insulation layer, the wiring being electrically connected to the oxide semiconductor layer via the first aperture part, a barrier layer including aluminum oxide above the first insulation layer, above the wiring and covering a side surface of the wiring, and an organic insulation layer arranged above the barrier layer.
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公开(公告)号:US10317763B2
公开(公告)日:2019-06-11
申请号:US15723300
申请日:2017-10-03
Applicant: Japan Display Inc.
Inventor: Hajime Watakabe , Isao Suzumura , Hirokazu Watanabe , Akihiro Hanada
IPC: H01L29/10 , H01L29/12 , G02F1/1368 , H01L21/8234 , H01L21/473 , H01L23/522 , H01L23/532 , H01L21/768 , H01L29/786 , H01L27/12 , H01L51/50
Abstract: A display device comprising: a first TFT using silicon (Si) and a second TFT using oxide semiconductor are formed on a substrate, a distance between the silicon (Si) and the substrate is smaller than a distance between the oxide semiconductor and the substrate, a source/drain electrode of the first TFT connects with the silicon (Si) via a first through hole, a source/drain electrode of the second TFT connects with the oxide semiconductor via a second through hole, metal films are made on the oxide semiconductor sandwiching a channel of the oxide semiconductor in a plan view, the channel has a channel width, an AlO layer is formed on the metal films and the oxide semiconductor, the second source/drain electrode and the metal films are connected via the second through hole formed in the AlO layer.
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公开(公告)号:US20170365624A1
公开(公告)日:2017-12-21
申请号:US15619677
申请日:2017-06-12
Applicant: Japan Display Inc.
Inventor: Toshinari Sasaki , Hajime Watakabe , Akihiro Hanada , Marina Shiokawa
IPC: H01L27/12 , H01L29/423 , H01L29/49 , H01L29/786
CPC classification number: H01L27/1225 , H01L27/124 , H01L27/1248 , H01L29/7869
Abstract: A semiconductor device includes a oxide semiconductor layer, a gate electrode arranged above the oxide semiconductor layer, a gate insulation layer between the oxide semiconductor layer and the gate electrode, a first insulation layer arranged above the oxide semiconductor layer and arranged with a first aperture part, wiring including an aluminum layer arranged above the first insulation layer, the wiring being electrically connected to the oxide semiconductor layer via the first aperture part, a barrier layer including aluminum oxide above the first insulation layer, above the wiring and covering a side surface of the wiring, and an organic insulation layer arranged above the barrier layer.
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