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公开(公告)号：US09894772B2
公开(公告)日：2018-02-13
申请号：US15460221
申请日：2017-03-15
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Takehiko Tanaka , Nan Guo , Zhen Huang , Duanliang Cheng , Liang Ding , Feifan Chen , Heng Jiang
CPC classification number: H05K3/0011 , B29C45/14418 , B29C45/14639 , B29C45/14655 , B29C2045/14663 , B29L2031/3481 , G02B7/006 , G02B7/021 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/2258 , H05K3/284 , H05K2201/10121 , H05K2203/1316 , H05K2203/1327
Abstract: A manufacturing method of a molded photosensitive assembly of an array imaging module includes the steps of providing an enclosing element at a mold engaging surface of a first mold body of a mold; receiving the circuit board in the mold and positioning between the first mold body and a second mold body; introducing a fluid state mold material into the closed mold to fill the mold cavity and enclose the electronic elements; solidifying the mold material in the mold cavity and forming a molded base integrated with the circuit board and the electronic elements; and separating the first mold body and the second mold body and obtaining a molded photosensitive assembly which is an integrated body of the circuit board, the electronic elements.
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公开(公告)号：US09876948B2
公开(公告)日：2018-01-23
申请号：US15460231
申请日：2017-03-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N5/225 , H01L27/146
CPC classification number: H04N5/2257 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/1469 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H04N13/239 , H04N2213/001
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US09781325B1
公开(公告)日：2017-10-03
申请号：US15473573
申请日：2017-03-29
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
CPC classification number: H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US09781324B2
公开(公告)日：2017-10-03
申请号：US15460216
申请日：2017-03-15
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Zhenyu Chen , Takehiko Tanaka , Nan Guo , Zhen Huang , Duanliang Cheng , Liang Ding , Feifan Chen , Heng Jiang
CPC classification number: H04N5/2257 , G02B7/021 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0274 , H05K2201/10121
Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
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65.发明授权公开(公告)号：US12119361B2
公开(公告)日：2024-10-15
申请号：US18207357
申请日：2023-06-08
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
CPC classification number: H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H04N23/51 , H04N23/54 , H04N23/57 , H05K1/181 , H05K2201/10121
Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.
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Patent Agency Ranking
66.发明授权公开(公告)号：US12101877B2
公开(公告)日：2024-09-24
申请号：US17182353
申请日：2021-02-23
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Zhen Huang , Junjie Zeng , Chenxiang Xu , Feifan Chen
IPC: G01S17/894 , G03B30/00 , H04N23/56 , H04N23/57 , H05K1/02
CPC classification number: H05K1/0296 , G01S17/894 , G03B30/00 , H04N23/56 , H04N23/57 , H05K1/0274 , H05K2201/10113 , H05K2201/10121
Abstract: The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.
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公开(公告)号：US11835784B2
公开(公告)日：2023-12-05
申请号：US16926786
申请日：2020-07-13
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Liang Ding , Chunmei Liu , Feifan Chen , Nan Guo
CPC classification number: G02B7/003 , G02B7/021 , G02B7/025 , G02B27/62 , H01L27/14618 , H04N23/55 , H04N23/57 , G02B7/00 , G02B7/023
Abstract: An adjustable optical lens, a camera module and an aligning method thereof are disclosed. The adjustable optical lens includes at least one lens element and an optical structure element. Each of the lens elements is successively and overlappingly arranged in an photosensitive apparatus of the optical structure element, wherein at least one of the lens elements is configured as an adjustable lens element whose assemble position is adjustable. The optical structure element has at least one adjusting channel and at least one fixing channel for adjusting and fixing the adjustable lens element respectively.
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68.发明授权公开(公告)号：US11721709B2
公开(公告)日：2023-08-08
申请号：US17550733
申请日：2021-12-14
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Nan Guo , Zhenyu Chen , Takehiko Tanaka , Jingfei He , Zhen Huang , Zhongyu Luan , Feifan Chen
CPC classification number: H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H04N23/51 , H04N23/54 , H04N23/57 , H05K1/181 , H05K2201/10121
Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board. The circuit board comprises at least one substrate and at least one electronic component that is conductively connected to the substrate; a part of the non-photosensitive area of the photosensitive element is attached to the substrate back surface of the substrate, and the photosensitive area and another part of the non-photosensitive area of the photosensitive element correspond to a substrate channel of the substrate; the back surface molded portion is integrally bonded to at least one part of the area of the substrate back surface of the substrate; and the optical lens is held in the photosensitive path of the photosensitive element.
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公开(公告)号：US11579341B2
公开(公告)日：2023-02-14
申请号：US16479403
申请日：2018-01-26
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Chunmei Liu , Feifan Chen , Zhenyu Chen
Abstract: A lens (10) and a camera module (100) and a manufacturing method thereof, wherein the lens (10) comprises an edge-cut lens sheet (114), wherein the edge-cut lens sheet (14) includes at least one chord edge (1141) and at least one circular edge (1142), wherein the chord edge (1141) and the circular edge (1142) are adjacently connected to each other, and wherein the chord edge (1141) and the circular edge (1142) have different curvatures, so that the lens sheet (114) becomes narrow and the width of the lens (10) become narrow, to form an ultra-narrow camera module (100).
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公开(公告)号：US11493605B2
公开(公告)日：2022-11-08
申请号：US16429309
申请日：2019-06-03
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Feifan Chen , Zhongwei Wang , Qi Rong , Junjie Zeng , Hangang Wei , Beibei Dai , Minjie Pan
Abstract: Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.
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