Abstract:
A solid-state fingerprint sensor including an array of pixels, each pixel including an electrically isolated NVM structure, a security NVM cell and a normally-open MEMS switch. The electrically isolated NVM structure includes a polycrystalline silicon gate structure connected by a metal via structure to a fixed electrode that forms part of the MEMS switch. Initial charges stored on the electrically isolated NVM structures before each sensing operation are discharged to ground by the MEMS switch when a fingerprint ridge is aligned with the pixel and produces an applied actuating force on the MEMs switch. Final pixel charge values (i.e., either the initial charge or no charge) stored on each electrically isolated NVM structure after each sensing operation are encrypted using security bits stored on the security NVM cells such that only encrypted image data is transmitted from the pixels to external circuitry.
Abstract:
A CMOS gas sensor that uses MTJ elements to capture/store gas concentration level data at high temperatures for later readout at low temperatures. Each MTJ element includes a storage layer whose magnetic orientation is switchable between parallel and anti-parallel directions relative to a fixed reference when heated above the storage layer's blocking temperature, whereby the MTJ element is switchable between low and high resistance states. During operation, reaction heat generated by a gas sensing element raises the MTJ element's temperature above the blocking temperature when ambient target gas exceeds a minimum concentration level, whereby an applied magnetic biasing force causes the storage layer's magnetic orientation to switch relative to the fixed reference, whereby the MTJ element captures measured concentration level data for later readout. In one embodiment, multiple MTJ elements connected in a NAND-type string switch at different concentration levels to provide highly accurate quantitative measurement data.
Abstract:
A global shutter image sensor formed on an n-type bulk substrate and including pixels having pinned n-type photodiodes and memory nodes formed in designated n-doped epitaxial layer regions that are separated from the bulk substrate by a p-type vertical (potential) barrier implant. Each memory node includes both a buried channel portion and a contiguous pinned diode portion having different doping levels such that an intrinsic lateral electrical field drives electrons from the buried channel portion into the pinned diode portion during global charge transfer from an adjacent photodiode. The p-type vertical (potential) barrier implant is coupled to ground, and the bulk substrate is switched between a low integration voltage level during integration periods, and a high reset voltage level, whereby the photodiodes are globally reset without requiring reset transistors. P-type sinker implant sections and p-type vertical barrier implants form box-like diffusions around each pixel's photodiode and memory node.
Abstract:
Gas sensing using MTJ elements to capture/store gas concentration level data for readout at room temperature. In one embodiment, during reset the MTJ elements are heated above blocking temperatures of their storage layers while applying a first magnetic biasing force to set initial magnetic orientations. During gas sensing, reaction heat from a gas sensing element combines with control heat to raise each MTJ element's temperature from a work point temperature above its blocking temperature only when the target gas exceeds an associated concentration level, whereby a second magnetic biasing force causes the magnetic orientation to switch directions. During readout, read currents are measured to determine the MTJ elements' final resistance states, which indicate their switched/non-switched states, and the resistance states are correlated with stored data to determine the measured gas concentration level. The MTJ elements are cooled after reset and gas sensing to facilitate accurate CDS readout data.
Abstract:
A global shutter (GS) image sensor pixel includes a pinned photodiode connected to a memory node by a first transfer gate transistor, and a floating diffusion connected to the memory node by a second transfer gate transistor. The memory node includes a buried channel portion disposed under the first transfer gate transistor and a contiguous pinned diode portion disposed between the first and second transfer gate transistors, where the two memory node portions have different doping levels such that an intrinsic lateral electrical field drives electrons from the buried channel portion into the pinned diode portion. The floating diffusion node similarly includes a buried channel portion disposed under the second transfer gate transistor and a contiguous pinned diode portion that generate a second intrinsic lateral electrical field that drives electrons into the pinned diode portion of the floating diffusion. A 6T CMOS pixel is disclosed that facilitates low-noise CDS readout.
Abstract:
A method for fabricating image sensors and other semiconductor ICs that controls the amount of hydrogen generated during back-end processing. The back-end processing includes forming multiple metallization layers after front-end processing is completed (i.e., after forming the pre-metal dielectric), where each metallization layer includes a patterned aluminum structure, an interlevel dielectric (ILD) layer including TEOS-based oxide formed over the patterned aluminum structure. A cap layer including a low-moisture content oxide such as silane oxide (i.e., SiO2 generated by way of a silane CVD process) is formed over at least one ILD layer. The cap layer serves as an etch-stop for the subsequently-formed metal layer of a next metallization layer by isolating the underlying ILD material from the plasma environment during aluminum over-etch, which significantly reduces the production and migration of hydrogen into front-end structures.
Abstract:
A match-in-place-type compare operation utilizes a string of Magnetic Tunnel Junction (MTJ) elements including storage layers and sense layers having different anti-ferromagnetic structures respectively having higher and lower blocking temperatures. Confidential data is written into the storage layers of the MTJ elements by heating the elements above the higher blocking temperature, and then orienting the storage and sense layers in first storage magnetization directions using field lines. The elements are then cooled to an intermediate temperature between the higher and lower blocking temperatures, and the field lines are turned off, setting the sense layers to preliminary storage magnetization directions opposite to the first directions. During a pre-compare phase, an input logic pattern is written into the sense layers by heating to the intermediate temperature. During a compare operation, with the field lines turned off, resistance of the MTJ string is detected by passing a read current through the string.
Abstract:
Solid state radiation sensors include a floating gate (FG) structure having a large control capacitor region disposed on thick dielectric portion over a control gate (CG) implemented by an isolated P-well region, and a tunneling capacitor region disposed on thin gate oxide dielectric over another tunneling gate (TG) isolated P-well region. Opposite voltages (e.g., +5V/−5V) are respectively applied to the CG and TG P-well regions to charge the FG structure by Fowler-Nordheim tunneling. During exposure, radiation striking the sensor discharges the FG structure by generating electron-hole pairs in the dielectric portion separating the CG P-well region and the control capacitor region. After exposure, the total ionizing dose (TID) is calculated, e.g., by measuring the threshold voltage shift of a CMOS readout inverter controlled by the residual charge stored on the FG structure. Sensor performance is enhanced by metal plates, utilizing two control capacitors, or modifying the FG electrode layout.
Abstract:
A method of fabricating a nanoshell is disclosed. The method comprises coating a nanometric core made of a first material by a second material, to form a core-shell nanostructure and applying non-chemical treatment to the core-shell nanostructure so as to at least partially remove the nanometric core, thereby fabricating a nanoshell. The disclosed nanoshell can be used in the fabrication of transistors, optical devices (such as CCD and CMOS sensors), memory devices and energy storage devices.
Abstract:
A photovoltaic device includes lateral P-I-N light-sensitive diodes disposed on a silicon island formed by a P− epitaxial layer and surrounded by trenches that provide lateral isolation, where the island is separated from the substrate by a porous silicon region that is grown under the island and isolates the lower portions of the photovoltaic device from the highly doped substrate. The trenches extend through the P− epitaxial material into the P+ substrate to facilitate self-limiting porous silicon formation at the bottom of the island, and also to suppress electron-hole recombination. A protective layer (e.g., SiN) is formed on the trench walls to further restrict porous silicon formation to the bottom of the island. Black silicon on the trench walls enhances light capture. The photovoltaic devices form low-cost embedded photovoltaic arrays on CMOS IC devices, or are separated to produce low-cost, HV solar arrays for solar energy sources, e.g. for solar concentrators.