Abstract:
The disclosure relates to method and apparatus for micro-contact printing of micro-electromechanical systems (“MEMS”) in a solvent-free environment. The disclosed embodiments enable forming a composite membrane over a parylene layer and transferring the composite structure to a receiving structure to form one or more microcavities covered by the composite membrane. The parylene film may have a thickness in the range of about 100 nm-2 microns; 100 nm-1 micron, 200-300 nm, 300-500 nm, 500 nm to 1 micron and 1-30 microns. Next, one or more secondary layers are formed over the parylene to create a composite membrane. The composite membrane may have a thickness of about 100 nm to 700 nm to several microns. The composite membrane's deflection in response to external forces can be measured to provide a contact-less detector. Conversely, the composite membrane may be actuated using an external bias to cause deflection commensurate with the applied bias. Applications of the disclosed embodiments include tunable lasers, microphones, microspeakers, remotely-activated contact-less pressure sensors and the like.
Abstract:
Embodiments of the present disclosure are directed toward an apparatus comprising a frameless MEMS device with a two-dimensional (2D) mirror, in accordance with some embodiments. The apparatus may include a base and a MEMS device disposed on the base. The MEMS device may comprise a rotor having a driving coil disposed around the rotor that is partially rotatable around a first axis, in response to interaction of a first magnetic field provided parallel to the first axis, with electric current to pass through the driving coil. The MEMS device may include a mirror disposed about a middle of the rotor. The mirror may be partially rotatable around a second axis coupled with the rotor and orthogonal to the first axis, in response to interaction of a second magnetic field provided parallel to the second axis, with electric current to pass through the coil. Other embodiments may be described and/or claimed.
Abstract:
The invention provides a driving calibration apparatus of an electrostatic MEMS scanning mirror and a driving calibration method thereof The driving calibration method includes the following steps. Different reference voltages are sequentially set to drive a plane mirror of the electrostatic MEMS scanning mirror to swing. Projection positions on a projected surface corresponding to the reference voltages that the laser beam projects to are determined. A driving lookup table is established according to the reference voltages and the corresponding projection positions. Calibrated driving voltages corresponding to ideal projection positions are determined according to the driving lookup table. The pane mirror is driven to swing according to the calibrated driving voltages.
Abstract:
A portion of an SiO2 layer 240 on a peripheral portion 255 of an actuator body portion 251 is left on the surface of the actuator body portion 251 when it is etched so as to extend over the outside of the piezoelectric element 4. When the third resist mask 330 covering the actuator body portion 251 and the mirror portion 252 is formed and etching is performed, the third resist mask 330 has a first slit 331 and a second slit 332, the second slit 332 exposing a peripheral portion 256 of a mirror portion 252, and the first slits 331 exposing a peripheral portion 256 of the actuator body portion 251 and a portion of the SiO2 layer 240 on the actuator body portion 251, and having a width wider than the second slit 332.
Abstract:
The present disclosure provides a micro-machined switchable optical mirror device with a fast response speed. The mirror device includes a substrate defining a gap space, and a mirror assembly disposed on the substrate and deflectable in the gap space, the mirror assembly including a free end cantilever and a reflector on the cantilever, wherein the cantilever is anchored on the substrate adjacent a side of the gap space through an elastic member. In one aspect, the mirror device further includes a stop spring at an end of the cantilever opposing the elastic member.
Abstract:
A method for fabrication of a device (206) from a wafer (170) of semiconductor material includes locally thinning the wafer in an area of the device to a predefined thickness by removing the semiconductor material from at least a first side of the wafer using a wet etching process, and etching through the thinned wafer in the area of the device so as to release a moving part (202) of the device. Other methods and systems for fabrication are also described.
Abstract:
A micromechanical structure, comprising a substrate having a through hole; a residual portion of a sacrificial oxide layer peripheral to the hole; and a polysilicon layer overlying the hole, patterned to have a planar portion; a supporting portion connecting the planar portion to polysilicon on the residual portion; polysilicon stiffeners formed extending beneath the planar portion overlying the hole; and polysilicon ribs surrounding the supporting portion, attached near a periphery of the planar portion. The polysilicon ribs extend to a depth beyond the stiffeners, and extend laterally beyond an edge of the planar portion. The polysilicon ribs are released from the substrate during manufacturing after the planar region, and reduce stress on the supporting portion.
Abstract:
A vapor deposition system includes a filter-diffuser device connected to a vapor inlet within a vacuum chamber for simultaneously filtering inflowing vapor to remove particulate matter while injecting vapor containing perfluordecanoic acid (PFDA) into the chamber through radially arranged porous metal filters to enable the deposition of a uniform monolayer of PFDA molecules onto the surfaces of a micromechanical device, such as a digital micromirror device.
Abstract:
The MEMS device includes MEMS units and a circuit board. Each MEMS unit includes a substrate, a movable part with a movable electrode, a driving electrode, a diagnosis electrode, a plurality of through electrodes, and a plurality of MEMS side electrical contacts. The circuit board includes a plurality of circuit side electrical contacts, a drive circuit that is connected electrically with the driving electrode and the movable electrode through the circuit side electrical contact, the MEMS side electrical contact, and the through electrode, and a diagnosis circuit that is connected electrically with the diagnosis electrode and the movable electrode through the circuit side electrical contact, the MEMS side electrical contact, and the through electrode. The diagnosis electrodes of at least two MEMS units are connected electrically with each other, and are connected to a same MEMS side electrical contact through a same through electrode.
Abstract:
A system and method for manufacturing a display device having an electrically connected front plate and back plate are disclosed. In one embodiment, the method comprises printing conductive raised contours onto a non-conductive back plate, aligning the back plate with a non-conductive front plate such that the raised contours align with conductive routings on the front plate to electrically connect the raised contours and the routings, and sealing the back plate and the front plate.