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    MICRO-DEVICE ON GLASS
    63.
    发明申请
    MICRO-DEVICE ON GLASS 有权
    玻璃上的MICRO-DEVICE

    公开(公告)号：US20140054261A1

    公开(公告)日：2014-02-27

    申请号：US14040698

    申请日：2013-09-29

    Applicant: Viswanadam Gautham

    Inventor： Viswanadam Gautham

    IPC: B81C1/00

    CPC classification number: B81C1/00341 ,  B81B2201/051 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81C1/00476 ,  B81C2201/0107 ,  B81C2203/036 ,  H01L21/00

    Abstract: A method of fabricating a micro-device having micro-features on glass is presented. The method includes the steps of preparing a first glass substrate, fabricating a metallic pattern on the first glass substrate, preparing a second glass substrate and providing one or more apertures on the second glass substrate, heating the first glass substrate and the second glass substrate with a controlled temperature raise, bonding the first glass substrate and the second glass substrate by applying pressure to form a bonded substrate, wherein the metallic pattern is embedded within the bonded substrate, cooling the bonded substrate with a controlled temperature drop and thereafter maintaining the bonded substrate at a temperature suitable for etching, etching the metallic pattern within the bonded substrate, wherein an etchant has access to the metallic pattern via the apertures, forming a void within the bonded substrate, wherein the void comprises micro-features.

    Abstract translation: 提出了一种在玻璃上制造具有微特征的微器件的方法。 该方法包括以下步骤：制备第一玻璃基板，在第一玻璃基板上制造金属图案，制备第二玻璃基板并在第二玻璃基板上提供一个或多个孔，加热第一玻璃基板和第二玻璃基板， 控制温度升高，通过施加压力来接合第一玻璃基板和第二玻璃基板以形成接合基板，其中金属图案嵌入在接合基板内，以受控的温度下降冷却接合基板，然后保持接合基板 在适于蚀刻的温度下蚀刻所述键合衬底内的所述金属图案，其中所述蚀刻剂经由所述孔进入所述金属图案，在所述键合衬底内形成空隙，其中所述空隙包括微特征。

    MICROFLUIDIC COMPONENT, REACTOR COMPRISING A PLURALITY OF SUCH COMPONENTS, AND METHOD FOR PRODUCING SAME
    64.
    发明申请
    MICROFLUIDIC COMPONENT, REACTOR COMPRISING A PLURALITY OF SUCH COMPONENTS, AND METHOD FOR PRODUCING SAME 审中-公开
    微流控组件，包含这些组分的多样性的反应器及其生产方法

    公开(公告)号：US20130255822A1

    公开(公告)日：2013-10-03

    申请号：US13992938

    申请日：2011-12-14

    Applicant: Martin Wichert ,  Silvio Kraus

    Inventor： Martin Wichert ,  Silvio Kraus

    IPC: F16L9/02

    CPC classification number: F16L9/02 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00806 ,  B01J2219/00822 ,  B01J2219/00835 ,  B01J2219/00855 ,  B01J2219/0086 ,  B01J2219/00869 ,  B01J2219/00873 ,  B01J2219/00889 ,  B01J2219/00898 ,  B81B2201/051 ,  B81C1/00119 ,  F28D9/0037 ,  F28F3/046 ,  F28F2260/00

    Abstract: A microfluidic component made of a metal sheet having a structure which includes a closed fluid line and which is formed of a structured surface of a first section of the metal sheet and an adjoining structured or unstructured surface of a second section of the metal sheet, wherein the metal sheet is folded such that the sections integrally connected to each other are located on top of each other in a surface-parallel manner. The metal sheet further includes at least one third section having a contoured edge and is moreover folded such that the third section is also supported in a surface-parallel manner and the contoured edge forms a first wall section and the adjoining structured or unstructured surface of the first or second section forms a second wall section of an open fluid line. A microfluidic reactor comprising a plurality of such microfluidic components and a method for producing such components.

    Abstract translation: 由金属片制成的微流体部件，其具有包括封闭流体管线的结构，并且由金属片材的第一部分的结构化表面和金属片材的第二部分的相邻的结构化或非结构化表面形成，其中 金属片被折叠成使得彼此一体地连接的部分以表面平行的方式位于彼此的顶部。 金属片还包括具有轮廓边缘的至少一个第三部分，并且还被折叠，使得第三部分也以表面平行的方式支撑，并且成形边缘形成第一壁部分，并且邻接的结构化或非结构化的表面 第一或第二部分形成开放流体管线的第二壁部分。 包含多个这种微流体组分的微流体反应器和用于生产这些组分的方法。

    DEVICE AND METHOD FOR MANUFACTURING THE SAME
    66.
    发明申请
    DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    用于制造它们的装置和方法

    公开(公告)号：US20130156657A1

    公开(公告)日：2013-06-20

    申请号：US13693349

    申请日：2012-12-04

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： Tomohiro Saito

    IPC: B01L3/00 ,  B23P15/00

    CPC classification number: B01L3/502707 ,  B01L3/502715 ,  B01L7/52 ,  B01L2300/0645 ,  B01L2300/0887 ,  B01L2300/12 ,  B01L2300/1805 ,  B01L2300/1827 ,  B23P15/00 ,  B81B2201/051 ,  B81C1/00817 ,  G01N27/44791 ,  H01L21/28 ,  H01L41/313 ,  Y10T29/494

    Abstract: It is an object of this invention to prevent a resistor material and an electrode material from diffusing and suppress variation in electric resistance. In a device including a plurality of metal layers of different compositions on a substrate and a second structure made of a material, such as glass paste, requiring a firing process at the time of formation, an intermediate layer is formed between a first metal layer and a second metal layer forming the first structure. The intermediate layer is of an intermetallic compound including one or more metallic elements in the first metal layer and one or more metallic elements in the second metal layer. The melting point of the intermetallic compound is higher than a firing temperature when the second structure is formed, and the intermetallic compound is produced at a temperature higher than the firing temperature for forming the second structure.

    Abstract translation: 本发明的目的是防止电阻材料和电极材料扩散并抑制电阻的变化。 在包括在基板上具有不同组成的多个金属层的装置和由形成材料的诸如玻璃浆料的第二结构之间需要在形成时进行烧制的装置中，在第一金属层和 形成第一结构的第二金属层。 中间层是包含第一金属层中的一种或多种金属元素和第二金属层中的一种或多种金属元素的金属间化合物。 当形成第二结构时，金属间化合物的熔点高于烧制温度，并且在高于用于形成第二结构的烧成温度的温度下制备金属间化合物。

    Microchip and process for producing microchip
    67.
    发明授权
    Microchip and process for producing microchip 有权
    Microchip和微芯片生产工艺

    公开(公告)号：US08404193B2

    公开(公告)日：2013-03-26

    申请号：US13057466

    申请日：2009-07-13

    Applicant: Kanji Sekihara ,  Takehiko Goshima

    Inventor： Kanji Sekihara ,  Takehiko Goshima

    IPC: G01N33/48 ,  B29C45/14

    CPC classification number: B81C99/009 ,  B01J2219/00891 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/141 ,  B01L2300/0816 ,  B29C45/2628 ,  B29C45/40 ,  B29C65/02 ,  B29C66/54 ,  B29L2031/756 ,  B81B2201/051 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C2201/034

    Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

    Abstract translation: 一种微芯片，包括：具有形成在其一侧上的多个细通道的树脂基底，一个或多个从另一侧突出设置的圆柱形部分，以及沿着其轴线刺穿每个圆柱形部分的通孔， 与细通道连通，使得通孔的内壁的直径从圆筒部的前端朝向第一倾斜角的细通道逐渐减小; 以及与形成有微细通道的树脂基底的该侧接合的树脂覆盖部件。 微芯片已经被构造成使得液体样品可以通过通孔从每个圆柱形部分的末端引入。 通过在它们之间形成一个台阶，使得待引入液体样品的端侧的圆筒部分的壁厚比通过形成圆柱形部分的基底侧的壁厚小。

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