公开(公告)号：US07114361B2

公开(公告)日：2006-10-03

申请号：US10660926

申请日：2003-09-12

Applicant: Wen Jin Meng

Inventor： Wen Jin Meng

IPC: B21D22/00

CPC classification number: B81C99/009 ,  B81C1/00619 ,  B81C2201/034

Abstract: An inexpensive method of rapidly fabricating reactive metal (Zn, Al, Al-alloy, etc.) microscale structures including high-aspect-ratio microscale structures is disclosed. A high precision process uses conformal bond inhibitor coating and high temperature compression molding techniques to produce high quality, high aspect ratio metal structures. In one embodiment, following fabrication of an initial metallic microscale mold insert, an adhesion-promoting metal precursor layer and a ceramic bond inhibitor coating are conformally deposited onto the microscale mold insert. The microscale mold insert and a preselected reactive metal are then heated to an optimum temperature and compressed together. The mold insert is then extracted from the molded metal to produce a reverse image of the mold insert.

Abstract translation: 公开了一种快速制造包括高纵横比微结构的反应性金属（Zn，Al，Al-合金等）微结构的廉价方法。 高精度工艺使用保形键合抑制剂涂层和高温压缩成型技术来生产高质量，高纵横比的金属结构。 在一个实施例中，在制造初始金属微量模具插入件之后，将粘附促进金属前体层和陶瓷粘结抑制剂涂层共形沉积到微型模具插入件上。 然后将微型模具插件和预选的活性金属加热至最佳温度并压缩。 然后从模制金属中提取模具插件以产生模具插入件的反向图像。

公开(公告)号：US20060214330A1

公开(公告)日：2006-09-28

申请号：US11436833

申请日：2006-05-18

Applicant: Jarrett Dumond ,  Hong Low

Inventor： Jarrett Dumond ,  Hong Low

IPC: B29C59/02

CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

Abstract: An imprint lithographic method for making a polymeric structure comprising the steps of: (a) providing a mold having a shape forming a mold pattern; (b) providing a substrate having a higher surface energy relative to said mold; (c) providing a polymer film on said mold, said polymer film having a selected thickness, wherein the selected thickness of the polymer film on the mold pattern is capable of forming at least one frangible region in the polymer film having a thickness that is less than the remainder of the polymer film; (d) pressing the mold and the substrate relatively toward each other to form said frangible region; and (e) releasing at least one of said mold and said substrate from the other, wherein after said releasing, said frangible region remains substantially attached to said mold while the remainder of said polymer film forms the polymeric structure attached to said substrate.

Abstract translation: 一种用于制造聚合物结构的压印光刻方法，包括以下步骤：（a）提供具有形成模具图案的形状的模具; （b）提供相对于所述模具具有更高表面能的基底; （c）在所述模具上提供聚合物膜，所述聚合物膜具有选定的厚度，其中模具图案上的聚合物膜的选定厚度能够在聚合物膜中形成至少一个具有较小厚度的易碎区域 比其余的聚合物膜; （d）相对于彼此挤压模具和基板以形成所述易碎区域; 和（e）将所述模具和所述基材中的至少一个从另一个释放，其中在所述释放之后，所述易碎区保持基本上附着到所述模具，而所述聚合物膜的其余部分形成附着到所述基底的聚合物结构。

公开(公告)号：US20060130527A1

公开(公告)日：2006-06-22

申请号：US10557843

申请日：2004-03-22

Applicant: Shuji Tanaka ,  Masayoshi Esashi

Inventor： Shuji Tanaka ,  Masayoshi Esashi

IPC: C03B11/08 ,  B28B7/38 ,  B05D1/36

CPC classification number: B32B18/00 ,  B81C99/009 ,  B81C2201/034 ,  C03B11/082 ,  C03B11/086 ,  C03B2215/22 ,  C03B2215/32 ,  C03B2215/412 ,  C04B35/565 ,  C04B37/001 ,  C04B37/006 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/963 ,  C04B2237/083 ,  C04B2237/123 ,  C04B2237/365 ,  C04B2237/568 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/708

Abstract: A method of fabricating a mold for glass press, characterized in that silicon carbide is deposited on the surface of a silicon mold, subsequently the deposited silicon carbide is bonded to a silicon carbide substrate, and thereafter the silicon mold is removed by etching. In this method of fabricating a mold for glass press, the bonding between the silicon carbide deposited on the silicon mold surface and the silicon carbide substrate can be strengthened by interposing a metal thin film.

Abstract translation: 一种制造玻璃压制模具的方法，其特征在于，碳化硅沉积在硅模的表面上，随后将沉积的碳化硅结合到碳化硅衬底上，然后通过蚀刻去除硅模。 在这种制造玻璃压模的方法中，通过插入金属薄膜，可以加强沉积在硅模表面上的碳化硅与碳化硅衬底之间的结合。

公开(公告)号：US20050239228A1

公开(公告)日：2005-10-27

申请号：US11172892

申请日：2005-07-05

Applicant: Hans-Joachim Quenzer ,  Peter Merz ,  Arne Schulz

Inventor： Hans-Joachim Quenzer ,  Peter Merz ,  Arne Schulz

IPC: G02B3/00 ,  C03B11/00 ,  C03B11/08 ,  C03B23/02 ,  C03B23/025 ,  C03B23/203 ,  C03C19/00 ,  H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/018 ,  B81B2201/047 ,  B81C99/008 ,  B81C99/0085 ,  B81C2201/034 ,  C03B11/082 ,  C03B23/0252 ,  C03B23/203 ,  C03B2215/41 ,  C03B2215/412

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type surface in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract translation: 这里提出的是一种结构玻璃型材料的表面和该方法的变型的方法，包括以下步骤：提供半导体衬底，形成半导体衬底的至少一个表面的凹槽的形成 提供玻璃型材料的基板，将半导体基板与玻璃型基板接合，半导体基板的结构化表面以至少部分重叠的关系连接到玻璃类型表面的表面，并且加热 通过退火以使得玻璃类材料流入半导体衬底的结构化表面的凹槽中的方式被粘合的衬底。 该方法的变型特别适用于制造微光学透镜和微机械部件，例如微型继电器或微型阀。

公开(公告)号：US06951119B1

公开(公告)日：2005-10-04

申请号：US09889956

申请日：2000-11-23

Applicant: Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

Inventor： Hans-Joachim Quenzer ,  Peter Merz ,  Arne Veit Schulz

IPC: G02B3/00 ,  C03B11/00 ,  C03B11/08 ,  C03B23/02 ,  C03B23/025 ,  C03B23/203 ,  C03C19/00 ,  C03B23/00

CPC classification number: B81C1/00047 ,  B81B2201/018 ,  B81B2201/047 ,  B81C99/008 ,  B81C99/0085 ,  B81C2201/034 ,  C03B11/082 ,  C03B23/0252 ,  C03B23/203 ,  C03B2215/41 ,  C03B2215/412

Abstract: What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate, structuring, with the formation of recesses, of at least one surface of the semiconductor substrate, providing a substrate of glass-type material, joining the semiconductor substrate to the glass-type substrate, with a structured surface of the semiconductor substrate being joined to a surface of the glass-type substrate in an at least partly overlapping relationship, and heating the substrates so bonded by annealing in a way so as to induce an inflow of the glass-type material into the recesses of the structured surface of the semiconductor substrate. The variants of the method are particularly well suitable for the manufacture of micro-optical lenses and micro-mechanical components such as micro-relays or micro-valves.

Abstract translation: 这里提出的是一种结构玻璃型材料的表面和该方法的变型的方法，包括以下步骤：提供半导体衬底，形成半导体衬底的至少一个表面的凹槽的形成 提供玻璃型材料的基板，将所述半导体基板接合到所述玻璃型基板，所述半导体基板的结构化表面以至少部分重叠的关系与所述玻璃基板的表面接合，并且加热 通过退火以使得玻璃类材料流入半导体衬底的结构化表面的凹槽中的方式被粘合的衬底。 该方法的变型特别适用于制造微光学透镜和微机械部件，例如微型继电器或微型阀。

公开(公告)号：US06805809B2

公开(公告)日：2004-10-19

申请号：US10230882

申请日：2002-08-28

Applicant: Ralph G. Nuzzo ,  William Robert Childs

Inventor： Ralph G. Nuzzo ,  William Robert Childs

IPC: C03C2568

CPC classification number: B81C1/0046 ,  B81C2201/034 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24562 ,  Y10T428/24628

Abstract: A method of making a microstructure includes forming a pattern in a surface of a silicon-containing elastomer, oxidizing the pattern, contacting the pattern with a substrate; and bonding the oxidized pattern and the substrate such that the pattern and the substrate are irreversibly attached. The silicon-containing elastomer may be removably attached to a transfer pad.

Abstract translation: 制造微结构的方法包括在含硅弹性体的表面形成图案，氧化图案，使图案与基板接触; 并且结合氧化图案和基板，使得图案和基板不可逆地附着。 含硅弹性体可以可移除地附接到转移垫。

公开(公告)号：US20040028875A1

公开(公告)日：2004-02-12

申请号：US10433275

申请日：2003-09-29

Inventor： Cornelis Johannes Maria Van Rijn ,  Laura Vogelaar ,  Wietze Nijdam ,  Jonathan Nathaniel Barsema ,  Matthias Wessling

IPC: B29C039/00

CPC classification number: B01D67/0088 ,  A61F2/06 ,  A61F2002/044 ,  A61F2002/046 ,  A61L27/50 ,  A61L27/56 ,  B01D67/0009 ,  B01D67/0018 ,  B01D67/002 ,  B01D67/0069 ,  B01D67/0072 ,  B01D67/0093 ,  B01D69/00 ,  B01D69/02 ,  B01D69/08 ,  B01D69/12 ,  B01D71/02 ,  B01D71/64 ,  B01D71/68 ,  B01D2323/06 ,  B01D2323/08 ,  B01D2323/30 ,  B01D2325/022 ,  B01D2325/04 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00824 ,  B01J2219/00833 ,  B01J2219/00835 ,  B01J2219/00844 ,  B01J2219/0086 ,  B01J2219/00864 ,  B01J2219/00907 ,  B01L3/0241 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0819 ,  B29C33/0033 ,  B29C41/08 ,  B29C41/38 ,  B29C67/02 ,  B29K2105/0073 ,  B29L2031/737 ,  B81B2201/10 ,  B81C99/008 ,  B81C2201/0115 ,  B81C2201/034 ,  G01N27/44704 ,  H01L31/18 ,  Y10T428/24

Abstract: Using phase separation technique perforated as well as non-perforated polymeric structures can be made with high aspect ratios (>5). By varying the phase separation process the properties (e.g. porous, non-porous, dense, open skin) of the moulded product can be tuned. Applications are described in the field of micro fluidics (e.g. micro arrays, electrophoretic boards), optics, polymeric solar cells, ball grid arrays, and tissue engineering.

Abstract translation: 使用相分离技术穿孔以及非穿孔聚合物结构可以制成高纵横比（> 5）。 通过改变相分离方法，可以调节模制产品的性质（例如多孔，无孔，致密，开放的皮肤）。 应用在微流体学（例如微阵列，电泳板），光学，聚合太阳能电池，球栅阵列和组织工程领域中描述。

公开(公告)号：US20030122227A1

公开(公告)日：2003-07-03

申请号：US10129505

申请日：2002-05-06

Inventor： Kia Silverbrook

IPC: H01L023/02

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.

Abstract translation: 加速度计芯片（202）具有在一个表面上施加的模制的热塑性帽（210），以提供加速度计的悬臂式物体（204）能够移动的空腔。 在晶片分离之前，将一组盖子施加到加速度计芯片（202）的晶片上。

公开(公告)号：US20020133129A1

公开(公告)日：2002-09-19

申请号：US09808534

申请日：2001-03-14

Inventor： Francisco Arias ,  Faiz Feisal Sherman ,  Grover David Owens

IPC: A61B017/20 ,  B29C067/00

CPC classification number: A61B5/1411 ,  A61B5/14514 ,  A61B5/150022 ,  A61B5/150282 ,  A61B5/150419 ,  A61B5/150984 ,  A61M37/0015 ,  A61M2037/0038 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

Abstract: A method for manufacturing microneedle structures is disclosed using soft lithography and photolithography, in which micromold structures made of a photoresist material or PDMS are created. The micromold manufacturing occurs quite quickly, using inexpensive materials and processes. Once the molds are available, using moldable materials such as polymers, microneedle arrays can be molded or embossed in relatively fast procedures. In some cases a sacrificial layer is provided between the forming micromold and its substrate layer, for ease of separation. The microneedles themselves can be solid projections, hollow nullmicrotubes,null or shallow nullmicrocups.null Electrodes can be formed on the microneedle arrays, including individual electrodes per hollow microtube.

Abstract translation: 公开了使用软光刻和光刻技术制造微针结构的方法，其中制造由光致抗蚀剂材料或PDMS制成的微型结构。 使用廉价的材料和工艺，微型制造相当快速地发生。 一旦模具可用，使用可模塑材料如聚合物，微针阵列可以以相对较快的程序模制或压花。 在一些情况下，为了易于分离，在成形微胶体与其基底层之间提供牺牲层。 微针本身可以是固体突起，中空的“微管”或浅的“微型杯”。 电极可以形成在微针阵列上，包括每个中空微管的单个电极。

公开(公告)号：US20020094572A1

公开(公告)日：2002-07-18

申请号：US10032280

申请日：2001-12-21

Inventor： Rahul Singhvi ,  Amit Kumar ,  George M. Whitesides ,  Donald E. Ingber ,  Gabriel P. Lopez ,  Daniel I. C. Wang ,  Gregory N. Stephanopoulos

IPC: C12N005/02

CPC classification number: C12N1/00 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00385 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/0072 ,  B81B2201/0214 ,  B81C1/00206 ,  B81C2201/034 ,  B82Y5/00 ,  B82Y30/00 ,  C12N5/0068 ,  C12N5/067 ,  C12N2535/10 ,  C12Q1/02 ,  C40B60/14

Abstract: The invention provides a device for adhering cells in a specific and predetermined position, and associated methods. The device includes a plate defining a surface and a plurality of cytophilic islands that adhere cells, isolated by cytophobic regions to which cells do not adhere, contiguous with the cytophilic islands. The islands or the regions or both may be formed of a self-assembled monolayer (SAM).

Abstract translation: 本发明提供一种用于将细胞粘附在特定和预定位置的装置以及相关方法。 该装置包括限定表面的板和多个细胞亲和岛，其附着细胞，由细胞不粘附的细胞渗透区隔离，与细胞色素岛邻接。 岛或区域或两者可以由自组装单层（SAM）形成。