公开(公告)号：US20080081391A1

公开(公告)日：2008-04-03

申请号：US11538281

申请日：2006-10-03

Applicant: John R. Martin ,  Thomas D. Chen ,  Jinbo Kuang ,  Thomas Kieran Nunan ,  Xin Zhang

Inventor： John R. Martin ,  Thomas D. Chen ,  Jinbo Kuang ,  Thomas Kieran Nunan ,  Xin Zhang

IPC: H01L21/00

CPC classification number: B81B3/001 ,  B81B2201/0257 ,  B81C2201/115

Abstract: A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced from the first layer, and an insulator layer between the first layer and second layer. The first layer has a top surface, while the second layer has a bottom surface facing the top surface. After providing the MEMS apparatus, the method increases the roughness of at least the top surface of the first layer or the bottom surface of the second layer.

Abstract translation: 制造MEMS器件的方法提供了具有释放结构的MEMS装置。 MEMS器件至少部分地由具有第一层，与第一层隔开的第二层和在第一层和第二层之间的绝缘体层的SOI晶片形成。 第一层具有顶表面，而第二层具有面向顶表面的底表面。 在提供MEMS装置之后，该方法增加了至少第一层的顶表面或第二层的底表面的粗糙度。

公开(公告)号：US20070218630A1

公开(公告)日：2007-09-20

申请号：US11681627

申请日：2007-03-02

Applicant: Mayumi YAMAGUCHI ,  Konami IZUMI

Inventor： Mayumi YAMAGUCHI ,  Konami IZUMI

IPC: H01L21/336

CPC classification number: H01L27/1266 ,  B81B3/001 ,  B81C2201/115 ,  H01L27/1214

Abstract: A microstructure includes a first structural layer and a second structural layer which faces the first structural layer with a space interposed therebetween and is partially fixed to the first structural layer. At least one of the first structural layer and the second structural layer can be displaced. Further, opposed surfaces of the first structural layer and the second structural layer are different in roughness.

Abstract translation: 微结构包括第一结构层和第二结构层，第一结构层和第二结构层面向第一结构层，并且间隔开间隔并且部分地固定到第一结构层。 可移位第一结构层和第二结构层中的至少一个。 此外，第一结构层和第二结构层的相对表面的粗糙度不同。

公开(公告)号：US07002439B2

公开(公告)日：2006-02-21

申请号：US10663340

申请日：2003-09-15

Applicant: Xavier Rottenberg ,  Henri Jansen ,  Hendrikus Tilmans ,  Walter De Raedt

Inventor： Xavier Rottenberg ,  Henri Jansen ,  Hendrikus Tilmans ,  Walter De Raedt

IPC: H01G23/00

CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B2201/016 ,  B81C2201/115 ,  H01G5/16 ,  H01G5/18

Abstract: A micro electromechanical switchable capacitor is disclosed, comprising a substrate, a bottom electrode, a dielectric layer deposited on at least part of said bottom electrode, a conductive floating electrode deposited on at least part of said dielectric layer, an armature positioned proximate to the floating electrode and a first actuation area in order to stabilize the down state position of the armature. The device may furthermore comprise a second actuation area. The present invention provides shunt switches and series switches with actuation in zones attached to the floating electrode area or with relay actuation.

Abstract translation: 公开了一种微机电可切换电容器，包括衬底，底电极，沉积在所述底电极的至少一部分上的电介质层，沉积在所述介电层的至少一部分上的导电浮动电极，位于浮动 电极和第一致动区域，以便稳定电枢的向下状态位置。 该装置还可以包括第二致动区域。 本发明提供了分流开关和串联开关，其在附接到浮动电极区域的区域中具有致动，或者具有继电器致动。

公开(公告)号：US20040124497A1

公开(公告)日：2004-07-01

申请号：US10663340

申请日：2003-09-15

Inventor： Xavier Rottenberg ,  Henri Jansen ,  Hendrikus Tilmans ,  Walter De Raedt

IPC: H01L029/00

CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B2201/016 ,  B81C2201/115 ,  H01G5/16 ,  H01G5/18

Abstract: A micro electromechanical switchable capacitor is disclosed, comprising a substrate, a bottom electrode, a dielectric layer deposited on at least part of said bottom electrode, a conductive floating electrode deposited on at least part of said dielectric layer, an armature positioned proximate to the floating electrode and a first actuation area in order to stabilize the down state position of the armature. The device may furthermore comprise a second actuation area. The present invention provides shunt switches and series switches with actuation in zones attached to the floating electrode area or with relay actuation.

Abstract translation: 公开了一种微机电可切换电容器，包括衬底，底电极，沉积在所述底电极的至少一部分上的电介质层，沉积在所述介电层的至少一部分上的导电浮动电极，位于浮动 电极和第一致动区域，以便稳定电枢的向下状态位置。 该装置还可以包括第二致动区域。 本发明提供了分流开关和串联开关，其在附接到浮动电极区域的区域中具有致动，或者具有继电器致动。

公开(公告)号：US06219015B1

公开(公告)日：2001-04-17

申请号：US08591231

申请日：1996-01-18

Applicant: David M. Bloom ,  Andrew Huibers

Inventor： David M. Bloom ,  Andrew Huibers

IPC: G09G336

CPC classification number: B81B3/001 ,  B81C2201/115 ,  G02B5/1828 ,  G02B26/0808

Abstract: A multicolor optical image-generating device comprised of an array of grating light valves (GLVs) organized to form light-modulating pixel units for spatially modulating incident rays of light. The pixel units are comprised of three subpixel components each including a plurality of elongated, equally spaced apart reflective grating elements arranged parallel to each other with their light-reflective surfaces also parallel to each other. Each subpixel component includes means for supporting the grating elements in relation to one another, and means for moving alternate elements relative to the other elements and between a first configuration wherein the component acts to reflect incident rays of light as a plane mirror, and a second configuration wherein the component diffracts the incident rays of light as they are reflected from the grating elements. The three subpixel components of each pixel unit are designed such that when red, green and blue light sources are trained on the array, colored light diffracted by particular subpixel components operating in the second configuration will be directed through a viewing aperture, and light simply reflected from particular subpixel components operating in the first configuration will not be directed through the viewing aperture.

Abstract translation: 一种多色光学图像产生装置，包括被组织以形成用于空间调制入射光线的光调制像素单元的光栅光阀阵列（GLV）。 像素单元由三个子像素部件组成，每个子像素部件包括彼此平行布置的多个细长的等间隔开的反射光栅元件，其光反射表面也彼此平行。 每个子像素部件包括用于相对于彼此支撑光栅元件的装置，以及用于相对于其它元件移动交替元件的装置，以及用于将入射光线反射为平面镜的第一配置之间的第一配置，以及第二 配置，其中所述分量在入射光线从所述光栅元件反射时衍射。 每个像素单元的三个子像素分量被设计成使得当在阵列上训练红色，绿色和蓝色光源时，由在第二配置中操作的特定子像素分量衍射的彩色光将被引导通过观察孔，并且光简单地反射 来自在第一配置中操作的特定子像素组件将不被引导通过观察孔。

公开(公告)号：US20170313573A1

公开(公告)日：2017-11-02

申请号：US15142381

申请日：2016-04-29

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： RUBEN B. MONTEZ ,  ARVIND S. SALIAN ,  ROBERT F. STEIMLE

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81B2201/0235 ,  B81B2203/0315 ,  B81C1/00976 ,  B81C2201/0132 ,  B81C2201/115 ,  B81C2203/0118

Abstract: A surface of a cavity of a MEMS device that is rough to reduce stiction. In some embodiments, the average roughness (Ra) of the surface is 5 nm or greater. In some embodiments, the rough surface is formed by forming one or more layers of a rough oxidizable material, then oxidizing the material to form an oxide layer with a rough surface. Another layer is formed over the oxide layer with the rough surface, wherein the roughness of the oxide layer is transferred to the another layer.

公开(公告)号：US20170305738A1

公开(公告)日：2017-10-26

申请号：US15138419

申请日：2016-04-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Hang Chang ,  I-Shi Wang ,  Jen-Hao Liu

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0005 ,  B81B3/001 ,  B81B2207/012 ,  B81C2201/112 ,  B81C2201/115

Abstract: A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.

公开(公告)号：US09611133B2

公开(公告)日：2017-04-04

申请号：US14667169

申请日：2015-03-24

Applicant: INVENSENSE, INC.

Inventor： Fang Liu ,  Martin Lim ,  Jong Il Shin ,  Jongwoo Shin

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81B3/001 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2201/115 ,  B81C2203/0792

Abstract: Various embodiments provide for a method for roughening a surface of a MEMs device or the surface of a CMOS surface. A first material can be deposited in a thin layer over a surface made of a second material. After heating, the first and second materials, they can partially melt and interdiffuse, forming an alloy. The first material can then be removed and the alloy is removed at the same time. The surface of the second material that is left behind has then been roughened due to the interdiffusion of the first and second materials.

公开(公告)号：US20170055081A1

公开(公告)日：2017-02-23

申请号：US15119116

申请日：2014-07-15

Applicant: GOERTEK INC.

Inventor： Quanbo ZOU ,  Zhe WANG

IPC: H04R7/14 ,  H04R1/04 ,  B81B3/00 ,  H04R19/04

CPC classification number: H04R7/14 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/019 ,  B81C1/0023 ,  B81C2201/115 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15192 ,  H04R1/04 ,  H04R19/016 ,  H04R19/04 ,  H04R2201/003 ,  H04R2307/027 ,  H01L2924/00014

Abstract: The present invention provides a silicon microphone with a high-aspect-ratio corrugated diaphragm and a microphone package including the same. The microphone comprises the corrugated diaphragm on which at least one ring-shaped corrugation is formed in the vicinity of the edge of the diaphragm which is fixed to the substrate, the corrugated diaphragm is flexible, wherein the ratio of the depth of the corrugation to the thickness of the diaphragm is larger than 5:1, preferably 20:1, and the walls of the corrugation are inclined to the surface of the diaphragm at an angle in the range of 80° to 100°. The microphone with the high-aspect-ratio corrugated diaphragm can achieve a consistent and optimal sensitivity and greatly reduce impact applied thereto in a drop test so that the performances, the reproducibility, the reliability and the yield can be improved. The microphone package of the present invention further provides a simplified processing, an improved sensitivity and an improved SNR.

Abstract translation: 本发明提供一种具有高纵横比的波纹状隔膜的硅麦克风和包括该硅麦克风的麦克风封装。 麦克风包括波纹膜片，在该波纹膜片上，在隔膜的边缘附近形成有至少一个环形波纹，该波纹膜片固定到基底上，波纹膜片是柔性的，其中波纹深度与 隔膜的厚度大于5:1，优选为20:1，并且波纹壁相对于隔膜的表面以80°至100°的范围内的角度倾斜。 具有高纵横比波纹膜片的麦克风可以实现一致和最佳的灵敏度，并且在跌落测试中大大降低了对其的影响，从而可以提高性能，再现性，可靠性和产量。 本发明的麦克风封装还提供简化的处理，改进的灵敏度和改进的SNR。

公开(公告)号：US20160167944A1

公开(公告)日：2016-06-16

申请号：US15051264

申请日：2016-02-23

Applicant: Freescale Semiconductor, Inc.

Inventor： Robert F. Steimle ,  Ruben B. Montez

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/001 ,  B81B3/0005 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2203/0181 ,  B81B2203/06 ,  B81C1/0096 ,  B81C2201/115 ,  G01P15/0802 ,  G01P2015/0871 ,  G01P2015/0874

Abstract: A mechanism for reducing stiction in a MEMS device by decreasing surface area between two surfaces that can come into close contact is provided. Reduction in contact surface area is achieved by increasing surface roughness of one or both of the surfaces. The increased roughness is provided by forming a micro-masking layer on a sacrificial layer used in formation of the MEMS device, and then etching the surface of the sacrificial layer. The micro-masking layer can be formed using nanoclusters. When a next portion of the MEMS device is formed on the sacrificial layer, this portion will take on the roughness characteristics imparted on the sacrificial layer by the etch process. The rougher surface decreases the surface area available for contact in the MEMS device and, in turn, decreases the area through which stiction can be imparted.

Abstract translation: 提供了一种用于通过减小可以紧密接触的两个表面之间的表面积来减小MEMS器件中的静摩擦的机构。 通过增加一个或两个表面的表面粗糙度来实现接触表面积的减小。 通过在用于形成MEMS器件的牺牲层上形成微掩模层，然后蚀刻牺牲层的表面来提供增加的粗糙度。 微掩模层可以使用纳米团簇形成。 当MEMS器件的下一部分形成在牺牲层上时，该部分将通过蚀刻工艺承受赋予牺牲层的粗糙度特性。 较粗糙的表面减小了可用于MEMS器件中的接触的表面积，并且进而降低了可赋予粘性的面积。