公开(公告)号：US20170202107A1

公开(公告)日：2017-07-13

申请号：US14280040

申请日：2014-05-16

Applicant: Nautilus Data Technologies, Inc.

Inventor： Arnold C. Magcale ,  Daniel Kekai

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2079

Abstract: A water based closed loop cooling system employed to cool waterborne data center facility generally comprise a plurality of filtered water intake pipes, a plurality of filtered water exhaust pipes, a plurality of heat exchangers, a plurality of closed loop cooling systems or closed loop coolant distribution units that may use freshwater as a coolant, and a plurality of piping systems. The energy efficient water based closed loop cooling system and method described may use naturally occurring cold water as a heat sink in a plurality of heat exchange systems. The systems and methods described in this document may be employed to provide an energy efficient water-based closed-loop cooling system to maintain interior ambient conditions suitable for proper operation of the plurality of computer systems therein.

公开(公告)号：US20170164517A1

公开(公告)日：2017-06-08

申请号：US14959804

申请日：2015-12-04

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Joo Han Kim ,  Hendrik Pieter Jacobus de Bock

IPC: H05K7/20

CPC classification number: H05K7/20672 ,  F28D15/0233 ,  F28D15/046 ,  F28F21/02 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20336 ,  H05K7/20681

Abstract: According to one embodiment, a thermal management system is provided that includes at least one chassis frame configured to minimize a thermal spreading resistance of the thermal management system. The chassis frame included at least one chassis body, at least one thermal skeleton embedded into the chassis body, and a working fluid contained within the thermal skeleton and used to dissipate heat from the chassis body.

公开(公告)号：US20170162475A1

公开(公告)日：2017-06-08

申请号：US14958420

申请日：2015-12-03

Applicant: Intel Corporation

Inventor： Emery E. Frey ,  Eric D. McAfee ,  Shankar Krishnan ,  Juan G. Cevallos ,  Roger D. Flynn

IPC: H01L23/473 ,  H01L23/00 ,  H01L23/367 ,  H01L21/48 ,  B23P15/26 ,  G06F1/20

CPC classification number: H01L23/473 ,  B23P15/26 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/28 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/40 ,  H01L23/44 ,  H01L23/46 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/1432

Abstract: Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

公开(公告)号：US09648730B2

公开(公告)日：2017-05-09

申请号：US14610719

申请日：2015-01-30

Applicant: Xyratex Technology Limited

Inventor： Laurence Harvilchuck

IPC: H05K1/02 ,  G06F1/20 ,  H05K7/20 ,  H01L23/467 ,  H05K1/14

CPC classification number: H05K1/0272 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L2224/16225 ,  H05K1/0209 ,  H05K1/144 ,  H05K7/20154 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/10159

Abstract: Apparatus for thermally cooling a solid state memory unit, such as but not limited to densely packed flash memory storage devices in a data storage system. In some embodiments, a thermally conductive corrugated plate has one or more corrugations. The corrugations are adapted for positioning adjacent at least one solid state memory unit to form one or more channels for a cooling fluid to flow therethrough.

公开(公告)号：US20170127556A1

公开(公告)日：2017-05-04

申请号：US15400946

申请日：2017-01-06

Applicant: David Lane Smith

Inventor： David Lane Smith

IPC: H05K7/20 ,  H05K5/00 ,  H05K5/02

CPC classification number: H05K7/203 ,  G06F1/20 ,  G06F2200/201 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/067 ,  H05K5/068 ,  H05K7/20236 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20381 ,  H05K7/20809

Abstract: A system and method for cooling electronic devices disposed with a volume of a fluid-tight sealed enclosure. Thermally conductive fluids that fill one or more volumes of said sealed enclosure may be circulated away from said sealed enclosure to an external heat exchange mechanism. The volume of the sealed container contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that conform to or occupy space between said electronic devices. Pressure balancing mechanisms are included to maintain suitable pressure of gaseous fluid in a volume of the sealed container.

公开(公告)号：US20170068258A1

公开(公告)日：2017-03-09

申请号：US15354982

申请日：2016-11-17

Applicant: COOLIT SYSTEMS, INC.

Inventor： Geoff Sean Lyon ,  Mike Holden

IPC: G05D7/06 ,  G05D23/19

CPC classification number: G05D7/0635 ,  G06F1/206 ,  G06F2200/201

Abstract: An observed operational state can include an operational state of one or more system devices. A sensor can emit, in response to a detected observable condition reflective of a given operational state, a simulated signal reflective of a different operational state as a proxy for the detected condition. A controller receiving such a proxy signal can, at least partially responsively to the proxy signal, issue a command corresponding to the given operational state. An electro-mechanical actuator can be selectively activatable responsive to the command.

Abstract translation: 观察到的操作状态可以包括一个或多个系统设备的操作状态。 传感器可以响应于反映给定操作状态的检测到的可观察条件而发射反映作为检测条件的代理的不同操作状态的模拟信号。 接收这种代理信号的控制器可以至少部分地响应于代理信号发出对应于给定操作状态的命令。 响应于该命令，可以选择性地激活机电致动器。

公开(公告)号：US20170052575A1

公开(公告)日：2017-02-23

申请号：US14828400

申请日：2015-08-17

Applicant: Microsoft Technology Licensing, LLC

Inventor： Taylor STELLMAN ,  Bert B. BUXTON ,  Nathan M. THOME

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1658 ,  G06F2200/201 ,  H01L23/4093 ,  H01L23/552 ,  H01L23/66 ,  H05K7/20409 ,  H05K7/20436 ,  H05K9/0035

Abstract: The description relates to devices, such as computing devices. One example can include a shielded and cooled circuit board assembly including a biasing sub-assembly that can bias a heat generating component and a thermal module together. The biasing sub-assembly can also define a portion of a Faraday cage around the heat generating component.

Abstract translation: 该描述涉及诸如计算设备的设备。 一个示例可以包括屏蔽和冷却的电路板组件，其包括可将发热部件和热模块偏置在一起的偏置子组件。 偏置子组件还可以围绕发热部件限定法拉第笼的一部分。

公开(公告)号：US09568960B2

公开(公告)日：2017-02-14

申请号：US14627657

申请日：2015-02-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Evan G. Colgan ,  Monty M. Denneau ,  John Knickerbocker

IPC: H01L23/473 ,  G06F1/18 ,  G06F1/20 ,  H01L23/367 ,  H01L23/498

CPC classification number: G06F1/185 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/367 ,  H01L23/473 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13109 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/29116 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81805 ,  H01L2224/92125 ,  H01L2224/92242 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2224/81

Abstract: A semiconductor structure includes a substrate with cooling layers, cooling channels, coolant inlets and outlets in fluid communication with the cooling channels, and a device layer on the cooling layers with one or more connection points and a device layer area. The device layer thermal coefficient of expansion is substantially equal to that of the cooling layers. A plurality of laminate substrates are disposed on, and electrically attached to, the device layer. The laminate substrate thermal coefficient of expansion differs from that of the device layer, each laminate substrate is smaller than the device layer portion to which it is attached, and each laminate substrate includes gaps between sides of adjacent laminate substrates. The laminate substrates are not electrically or mechanically connected to each other across the gaps therebetween and the laminate substrates are small enough to prevent warping of the device, interconnection and cooling layers due to thermal expansion.

Abstract translation: 半导体结构包括具有冷却层的衬底，冷却通道，与冷却通道流体连通的冷却剂入口和出口，以及具有一个或多个连接点和器件层区域的冷却层上的器件层。 器件层的热膨胀系数基本上等于冷却层的热膨胀系数。 多个层叠基板设置在器件层上并电连接到器件层。 叠层基板的热膨胀系数与装置层的热膨胀系数不同，每个层压基板的尺寸小于与其相连的装置层部分，并且各层叠基板在相邻层叠基板的侧面之间具有间隙。 层压基板在它们之间的间隙彼此不电或机械连接，并且层叠基板足够小以防止由于热膨胀而引起的装置，互连和冷却层翘曲。

公开(公告)号：US20170031393A1

公开(公告)日：2017-02-02

申请号：US14814269

申请日：2015-07-30

Applicant: Dell Products L.P.

Inventor： Travis Christian North ,  David Michael Meyers ,  Shawn Paul Hoss ,  Austin Michael Shelnutt

IPC: G06F1/20

CPC classification number: H05K7/2079 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20272 ,  H05K7/20727 ,  H05K7/20772

Abstract: An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.

Abstract translation: 外部底盘壁液体冷却系统包括限定底盘壳体的底盘。 底盘壁位于底盘上，并且包括位于底盘壳体附近的第一表面和与第一表面相对的底盘壁并且提供底盘的外表面的第二表面。 液体冷却通道由底盘壁限定，并在第一表面和第二表面之间延伸通过底盘壁。 液体位于液体冷却通道中，并且泵耦合到液体冷却通道并且构造成使液体移动通过液体冷却通道。 底盘壳体中的风扇系统可以将空气移动通过制热部件以传递由这些发热部件产生的热量，并且液体可以进一步将热量从底盘中散出。

公开(公告)号：US20170020032A1

公开(公告)日：2017-01-19

申请号：US15206499

申请日：2016-07-11

Applicant: Acer Incorporated

Inventor： Yung-Chih Wang ,  Cheng-Wen Hsieh ,  Wen-Neng Liao

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F2200/201

Abstract: A heat dissipation module suitable for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator and a pipe assembly. An internal space of the evaporator is divided into a first space and a second space, and the heat source is thermally contacted with the second space. The pipe assembly is connected to the evaporator to form a loop. A working fluid is filled in the loop. The working fluid in liquid receiving heat from the heat source is transformed into vapor and flows to the pipe assembly. Then, the working fluid in vapor is transformed into liquid by dissipating heat in the pipe assembly and flows to the first space of the evaporator. The working fluid in liquid is stored in the first space and is used for supplying to the second space.

Abstract translation: 提供了适用于电子设备的散热模块。 电子设备具有热源。 散热模块包括蒸发器和管道组件。 蒸发器的内部空间分为第一空间和第二空间，热源与第二空间热接触。 管组件连接到蒸发器以形成回路。 工作流体填充在回路中。 从热源接收热量的液体中的工作流体转变成蒸汽并流到管道组件。 然后，蒸气中的工作流体通过在管组件中散热而转变成液体，并流到蒸发器的第一空间。 液体中的工作流体储存在第一空间中，用于供给第二空间。