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    Process of manufacturing DOPO derivatives for printed circuit board and low-earth orbit spacecraft applications
    61.
    发明申请
    Process of manufacturing DOPO derivatives for printed circuit board and low-earth orbit spacecraft applications 审中-公开
    制造用于印刷电路板和低地球轨道航天器应用的DOPO衍生物的方法

    公开(公告)号：US20080021193A1

    公开(公告)日：2008-01-24

    申请号：US11819617

    申请日：2007-06-28

    Applicant: Ching-Hsuan Lin ,  Chun-Hung Lin

    Inventor： Ching-Hsuan Lin ,  Chun-Hung Lin

    IPC: C07D521/00 ,  C08G63/44

    CPC classification number: C08G73/1067 ,  C07F9/657172 ,  H05K1/0346 ,  H05K2201/012 ,  H05K2201/0154

    Abstract: A method of manufacturing new materials for a printed circuit board and Low-Earth Orbit (LEO) spacecraft is provided. The present invention includes dinitro, diamine, various phosphorous-containing polyimides and polyamides, and synthesizing methods thereof. The polymers of the embodiment of present invention exhibit good flame retardancy, high glass transition temperature, good mechanical properties and superior oxygen resistance, so they are good materials for Low-Earth Orbit applications. Besides, these polymers can also be used as matrix for halogen-free flexible printed circuit board.

    Abstract translation: 提供了制造印刷电路板和低地轨道（LEO）航天器新材料的方法。 本发明包括二硝基二胺，各种含磷聚酰亚胺和聚酰胺及其合成方法。 本发明实施方案的聚合物显示出良好的阻燃性，高玻璃化转变温度，良好的机械性能和优异的耐氧性，因此它们是用于低地球轨道应用的良好材料。 此外，这些聚合物也可以用作无卤柔性印刷电路板的基质。

    Flexible wiring board for tape carrier package having improved flame resistance
    64.
    发明授权
    Flexible wiring board for tape carrier package having improved flame resistance 有权
    具有改善阻燃性的胶带载体包装用挠性接线板

    公开(公告)号：US07239030B2

    公开(公告)日：2007-07-03

    申请号：US11258940

    申请日：2005-10-26

    Applicant: Masahiro Naiki ,  Koji Hayashi ,  Katsutoshi Hirashima

    Inventor： Masahiro Naiki ,  Koji Hayashi ,  Katsutoshi Hirashima

    IPC: H01L23/29

    CPC classification number: H05K1/028 ,  C08L79/08 ,  C08L2205/02 ,  C09D179/08 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K3/285 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0394 ,  C08L2666/20 ,  H01L2924/00

    Abstract: A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.

    Abstract translation: 公开了一种具有改进的阻燃性的带状载体封装的柔性布线板。 柔性布线基板具有：具有弯曲狭缝的绝​​缘膜，形成在其上的布线图案，并且与弯曲狭缝交叉;将布线图案粘合到绝缘膜上的粘合剂层;保护弯曲狭缝处的布线图案的柔性树脂层;以及 保护由固化性树脂组合物获得的外涂层的布线图案的外涂层，当固化成膜的形式时，该膜在25℃下的初始模量为10〜1500MPa，电绝缘性 足够的水平，260℃下的10秒的耐焊接性和超过22.0的氧指数。

    Curable composition, varnish, and layered product
    65.
    发明授权
    Curable composition, varnish, and layered product 有权
    可固化组合物，清漆和层状产品

    公开(公告)号：US07160609B2

    公开(公告)日：2007-01-09

    申请号：US10398284

    申请日：2001-10-15

    Applicant: Yasuhiro Wakizaka ,  Toshiyasu Matsui ,  Daisuke Uchida ,  Koichi Ikeda

    Inventor： Yasuhiro Wakizaka ,  Toshiyasu Matsui ,  Daisuke Uchida ,  Koichi Ikeda

    IPC: B32B27/20 ,  C09K21/00 ,  C09K5/49 ,  C08L63/00

    CPC classification number: H05K3/285 ,  C09D5/18 ,  H05K3/4676 ,  H05K2201/012 ,  Y10S428/901 ,  Y10T428/26 ,  Y10T428/31511 ,  Y10T428/31529

    Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 μm, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 μm being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 μm or less.

    Abstract translation: 可固化组合物包含绝缘树脂和无卤阻燃剂。 无卤阻燃剂具有颗粒形式，其一次颗粒的平均长轴为0.01至5μm，纵横比为5或更小，长径大于10μm的长度比例至多为10 ％的数量。 清漆包括绝缘树脂，固化剂，阻燃剂和有机溶剂。 阻燃剂是用偶联剂表面处理的颗粒形式的阻燃剂，并且存在于清漆中的阻燃颗粒的二次粒径为30μm以下。

    MULTILAYERED PRINTED WIRING BOARD
    68.
    发明申请
    MULTILAYERED PRINTED WIRING BOARD 失效
    多层印刷线路板

    公开(公告)号：US20040018348A1

    公开(公告)日：2004-01-29

    申请号：US10334103

    申请日：2002-12-31

    Applicant: Fuji Electric Co., Ltd.

    Inventor： Shigemasa Saito

    IPC: B32B003/00

    CPC classification number: H05K3/285 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2203/122 ,  Y10S428/901 ,  Y10T428/24917

    Abstract: A fire retardant multilayered printed wiring board without halogen compounds, having enhanced thermal conductivity of insulator layers to prevent electronic components from being damaged during soldering. The insulator layers are formed of a glass cloth impregnated with an epoxy resin composition. Metal foil layers, in each of which a circuit is formed, are laminated alternately with the insulator layers. The epoxy resin composition includes at least phosphate ester, aluminum hydroxide, silica, calcium oxide, strontium titanate, and iron oxide. Inorganic components are provided in the insulator layers as about 8% to about 18% by mass of P2O5, about 20% to about 28% by mass of Al2O3, about 0.1% to about 0.6% by mass of SiO2, about 0.1% to about 1.0% by mass of Cl, about 15% to about 20% by mass of CaO, about 0.3% to about 0.5% by mass of TiO2, about 0.2% to about 0.4% by mass of Fe2O3, and about 0.1% to about 0.3% by mass of SrO, in converted values as measured by an X-ray fluorescence analysis.

    Abstract translation: 一种不含卤素化合物的阻燃多层印刷电路板，具有增强的绝缘体层的导热性，以防止电子元件在焊接过程中受损。 绝缘体层由浸渍有环氧树脂组合物的玻璃布形成。 在其中形成电路的金属箔层与绝缘体层交替层叠。 环氧树脂组合物至少包含磷酸酯，氢氧化铝，二氧化硅，氧化钙，钛酸锶和氧化铁。 无机组分在绝缘体层中提供为约8％至约18质量％的P2O5，约20％至约28质量％的Al2O3，约0.1％至约0.6质量％的SiO 2，约0.1％至约 0.1质量％的Cl，约15质量％至约20质量％的CaO，约0.3％至约0.5质量％的TiO 2，约0.2％至约0.4质量％的Fe 2 O 3，以及约0.1％至约0.3 通过X射线荧光分析测定的转化值中的SrO的质量％。

    Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards
    70.
    发明授权
    Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards 有权
    制造印刷电路板相对低介电常数的预浸料和层压板

    公开(公告)号：US06632511B2

    公开(公告)日：2003-10-14

    申请号：US10035975

    申请日：2001-11-09

    Applicant: Dong Zhang

    Inventor： Dong Zhang

    IPC: B32B300

    CPC classification number: C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0212 ,  Y10T428/24917 ,  Y10T428/249999 ,  Y10T428/253 ,  Y10T428/2933 ,  Y10T442/209 ,  Y10T442/2139 ,  Y10T442/259 ,  Y10T442/2631

    Abstract: The present invention is directed to filled prepregs, laminates, printed circuit boards comprising a reinforcing material impregnated with a cured polymeric resin, the cured polymeric resin comprising multicellular polymeric microspheres as a filler. Pre-pregs, laminates and printed circuit boards prepared by this method have reduced dielectric constant as low as 3.0, depending upon the resin system of the matrix. In addition, such laminates and printed circuit boards have enhanced electrical, thermal and mechanical properties as well as improved machinability, low density and a uniform appearance.

    Abstract translation: 本发明涉及填充的预浸料，层压板，印刷电路板，其包含浸渍有固化的聚合物树脂的增强材料，所述固化的聚合物树脂包含多细胞聚合物微球体作为填料。 通过该方法制备的预浸料，层压板和印刷电路板根据基体的树脂体系将介电常数降低到3.0。 此外，这种层压板和印刷电路板具有增强的电，热和机械性能以及改善的机械加工性，低密度和均匀的外观。

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