公开(公告)号：US07524920B2

公开(公告)日：2009-04-28

申请号：US11170508

申请日：2005-06-29

Applicant: Thomas Joseph Pecorini ,  Douglas Stephens McWilliams ,  Spencer Allen Gilliam ,  Mark Elliott Tincher ,  Candace Michele Tanner

Inventor： Thomas Joseph Pecorini ,  Douglas Stephens McWilliams ,  Spencer Allen Gilliam ,  Mark Elliott Tincher ,  Candace Michele Tanner

IPC: C08G63/00

CPC classification number: H05K1/0326 ,  C08J5/18 ,  C08J2367/02 ,  H05K1/0393 ,  H05K1/116 ,  H05K3/281 ,  H05K3/386 ,  H05K3/429 ,  H05K2201/0145 ,  H05K2201/0969 ,  H05K2201/099 ,  Y10T428/1086 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31786

Abstract: Disclosed is a biaxially-oriented polyester film produced from a polyester comprising: (1) diacid residues comprising between about 95 and about 100 mole percent of terephthalic acid residues; (2) diol residues comprising between about 95 and about 100 mole percent of 1,4-cyclohexanedimethanol residues; and (3) about 0.5 to about 5 mole percent of another dicarboxylic acid or diol residue, wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues. In one embodiment, the biaxially-oriented film has a thickness of 70 to 150 microns (3-5 mils). In another embodiment, the biaxially-oriented film undergoes not more than 3% shrinkage when immersed for 10 seconds in a solder bath preheated to 260° C. The film can be made by stretching an essentially amorphous cast film of thickness between about 450-1800 micron (18-70 mil) at a ratio from about 2.5×2.5 to 3.5×3.5 while being held at a temperature between 90° C. and 130° C., and heat-setting the stretched film at an actual film temperature of from 260° C. to Tm, where Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

Abstract translation: 公开了一种由聚酯制成的双轴取向聚酯膜，包括：（1）包含约95-约100摩尔％对苯二甲酸残基的二酸残基; （2）包含约95至约100摩尔％的1,4-环己烷二甲醇残基的二醇残基; 和（3）约0.5至约5摩尔％的另一种二羧酸或二醇残基，其中聚酯包含总共100摩尔％的二酸残基和总共100摩尔％的二醇残基。 在一个实施方案中，双轴取向膜具有70至150微米（3-5密耳）的厚度。 在另一个实施方案中，当预热至260℃的焊料浴中浸渍10秒钟时，双轴取向薄膜的收缩率不超过3％。该薄膜可通过将厚度基本上为非晶态的流延膜拉伸至约450-1800 微米（18-70密耳），比例为约2.5×2.5〜3.5×3.5，同时保持在90℃至130℃之间的温度，并将拉伸膜在实际的膜温度 为Tm，Tm为通过差示扫描量热法（DSC）测定的聚酯的熔点，同时保持拉伸膜的尺寸。

公开(公告)号：US20080113184A1

公开(公告)日：2008-05-15

申请号：US11939973

申请日：2007-11-14

Applicant: Shinichiro YOSHIDA ,  Masahiro Usuki ,  Tadashi Amano

Inventor： Shinichiro YOSHIDA ,  Masahiro Usuki ,  Tadashi Amano

IPC: B32B7/12

CPC classification number: H05K3/386 ,  C09J7/35 ,  C09J163/00 ,  C09J2463/00 ,  C09J2475/00 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0209 ,  Y10T428/26

Abstract: An adhesive sheet including a releasable base material, and an adhesive layer formed on one surface of the base material is provided. The adhesive layer includes an adhesive composition including (A) 100 parts by mass of a carboxyl group-containing urethane-modified polyester resin, (B) an epoxy resin, (C) a curing agent, and (D) an inorganic filler, and has a thickness within a range from 40 to 100 μm. The adhesive sheet has a high degree of adhesiveness and excellent anti-migration properties, and is also effective as an interlayer insulating material.

Abstract translation: 提供了包括可释放基材的粘合片和形成在基材的一个表面上的粘合剂层。 粘合剂层包括粘合剂组合物，其包含（A）100质量份含羧基的氨基甲酸酯改性聚酯树脂，（B）环氧树脂，（C）固化剂和（D）无机填料，以及 具有40至100μm的范围内的厚度。 粘合片具有高粘合性和优异的抗迁移性，并且也作为层间绝缘材料是有效的。

公开(公告)号：US20070074316A1

公开(公告)日：2007-03-29

申请号：US11504822

申请日：2006-08-14

Applicant: Jonathan Alden ,  Haixia Dai ,  Michael Knapp ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael Spaid ,  Adrian Winoto ,  Jeffrey Wolk

Inventor： Jonathan Alden ,  Haixia Dai ,  Michael Knapp ,  Shuo Na ,  Hash Pakbaz ,  Florian Pschenitzka ,  Xina Quan ,  Michael Spaid ,  Adrian Winoto ,  Jeffrey Wolk

IPC: H01L23/52

CPC classification number: H01B1/22 ,  B22F1/0025 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可嵌入矩阵中的纳米线网络。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：US20060134409A1

公开(公告)日：2006-06-22

申请号：US11170508

申请日：2005-06-29

Applicant: Thomas Pecorini ,  Douglas McWilliams ,  Spencer Gilliam ,  Mark Tincher ,  Candace Tanner

Inventor： Thomas Pecorini ,  Douglas McWilliams ,  Spencer Gilliam ,  Mark Tincher ,  Candace Tanner

IPC: C08G63/02 ,  B32B7/12

CPC classification number: H05K1/0326 ,  C08J5/18 ,  C08J2367/02 ,  H05K1/0393 ,  H05K1/116 ,  H05K3/281 ,  H05K3/386 ,  H05K3/429 ,  H05K2201/0145 ,  H05K2201/0969 ,  H05K2201/099 ,  Y10T428/1086 ,  Y10T428/2852 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31786

Abstract: Disclosed is a biaxially-oriented polyester film produced from a polyester comprising: (1) diacid residues comprising between about 95 and about 100 mole percent of terephthalic acid residues; (2) diol residues comprising between about 95 and about 100 mole percent of 1,4-cyclohexanedimethanol residues; and (3) about 0.5 to about 5 mole percent of another dicarboxylic acid or diol residue, wherein the polyester comprises a total of 100 mole percent diacid residues and a total of 100 mole percent diol residues. In one embodiment, the biaxially-oriented film has a thickness of 70 to 150 microns (3-5 mils). In another embodiment, the biaxially-oriented film undergoes not more than 3% shrinkage when immersed for 10 seconds in a solder bath preheated to 260° C. The film can be made by stretching an essentially amorphous cast film of thickness between about 450-1800 micron (18-70 mil) at a ratio from about 2.5×2.5 to 3.5×3.5 while being held at a temperature between 90° C. and 130° C., and heat-setting the stretched film at an actual film temperature of from 260° C. to Tm, where Tm is the melting point of the polyester as measured by differential scanning calorimetry (DSC), while maintaining the dimensions of the stretched film.

Abstract translation: 公开了一种由聚酯制成的双轴取向聚酯膜，包括：（1）包含约95-约100摩尔％对苯二甲酸残基的二酸残基; （2）包含约95至约100摩尔％的1,4-环己烷二甲醇残基的二醇残基; 和（3）约0.5至约5摩尔％的另一种二羧酸或二醇残基，其中聚酯包含总共100摩尔％的二酸残基和总共100摩尔％的二醇残基。 在一个实施方案中，双轴取向膜具有70至150微米（3-5密耳）的厚度。 在另一个实施方案中，当预热至260℃的焊料浴中浸渍10秒钟时，双轴取向薄膜的收缩率不超过3％。该薄膜可通过将厚度基本上为非晶态的流延膜拉伸至约450-1800 微米（18-70密耳），比例为约2.5×2.5〜3.5×3.5，同时保持在90℃〜130℃的温度，并将拉伸膜以实际的膜温度 为Tm，Tm为通过差示扫描量热法（DSC）测定的聚酯的熔点，同时保持拉伸膜的尺寸。

公开(公告)号：US20050181223A1

公开(公告)日：2005-08-18

申请号：US11046751

申请日：2005-02-01

Applicant: Michio Aizawa ,  Masahiro Usuki ,  Tatsuya Fujimoto ,  Shigehiro Hoshida ,  Tadashi Amano

Inventor： Michio Aizawa ,  Masahiro Usuki ,  Tatsuya Fujimoto ,  Shigehiro Hoshida ,  Tadashi Amano

IPC: B32B15/088 ,  B32B15/08 ,  C08G69/26 ,  C09J179/08 ,  H05K1/03 ,  H05K3/38

CPC classification number: B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/281 ,  B32B27/34 ,  B32B2307/306 ,  B32B2307/74 ,  H05K1/0346 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  Y10T428/31681

Abstract: A flexible metal foil-polyimide laminate is prepared by joining a polyimide film to a metal foil via an intervening adhesive layer. The adhesive is a mixture of polyamic acids: (A) the reaction product of 3,4,3′,4′-biphenyltetracarboxylic anhydride with p-phenylenediamine, (B) the reaction product of 3,4,3′,4′-biphenyltetracarboxylic anhydride with 4,4′-diaminodiphenyl ether, and (C) the reaction product of pyromellitic dianhydride with 4,4′-diaminodiphenyl ether, in a weight ratio (A+B)/C between 75/25 and 25/75. The method is simple and inexpensive, and yields a flexible metal foil-polyimide laminate that is improved in peel strength and curling resistance while maintaining the heat resistance of polyimide.

Abstract translation: 通过中间粘合剂层将聚酰亚胺膜与金属箔接合来制备柔性金属箔 - 聚酰亚胺层压体。 粘合剂是聚酰胺酸的混合物：（A）3,4,3'，4'-联苯四羧酸酐与对苯二胺的反应产物，（B）3,4,3'，4'- 联苯四羧酸酐与4,4'-二氨基二苯醚，（C）均苯四酸二酐与4,4'-二氨基二苯醚的反应产物，重量比（A + B）/ C在75/25和25/75之间。 该方法简单且便宜，并且产生柔软的金属箔 - 聚酰亚胺层压板，其在保持聚酰亚胺的耐热性的同时提高了剥离强度和抗卷曲性。

公开(公告)号：US06447886B1

公开(公告)日：2002-09-10

申请号：US09528621

申请日：2000-03-20

Applicant: Mansour H. Mohamed ,  R. Bradley Lienhart ,  Pu Gu

Inventor： Mansour H. Mohamed ,  R. Bradley Lienhart ,  Pu Gu

IPC: B32B300

CPC classification number: D03D25/005 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T442/3195

Abstract: A base material for a printed circuit board, and a printed circuit board constructed therefrom. The base material is formed from a three-dimensional orthogonally woven fabric having a crimp-free fiber architecture in the x-y plane and an integrated multi-layer structure. The base material comprises a first system of straight first fibers extending along a first direction in a first plane, a second system of straight second fibers extending along a second direction in a second plane parallel to the first plane, and a third system of third fibers extending along a third direction through the first and second systems and binding the first and second fibers thereof. A filler material coats a portion of the first, second and third systems. The printed circuit board comprises the base material and one or more conductive layers attached to surfaces of the base material.

Abstract translation: 用于印刷电路板的基材和由其构成的印刷电路板。 基材由在x-y平面上具有无卷曲纤维结构的三维正交织物和集成的多层结构形成。 基体材料包括沿着第一平面中的第一方向延伸的直的第一纤维的第一系统，在平行于第一平面的第二平面中沿着第二方向延伸的直的第二纤维的第二系统，以及第三系统的第三纤维 沿着第三方向延伸穿过第一和第二系统并且将其第一和第二纤维捆绑在一起。 填充材料涂覆第一，第二和第三系统的一部分。 印刷电路板包括基材和连接到基材表面的一个或多个导电层。

公开(公告)号：US6040252A

公开(公告)日：2000-03-21

申请号：US295954

申请日：1999-04-21

Applicant: Minoru Ootuka ,  Hirokazu Hiraoka ,  Toru Shimadu ,  Masayuki Noda

Inventor： Minoru Ootuka ,  Hirokazu Hiraoka ,  Toru Shimadu ,  Masayuki Noda

IPC: C08J5/24 ,  B29C70/06 ,  B29K101/10 ,  B29K105/12 ,  D04H1/587 ,  H05K1/03 ,  B32B27/34

CPC classification number: H05K1/0366 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/54 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/31681 ,  Y10T428/31725 ,  Y10T442/2475 ,  Y10T442/273 ,  Y10T442/2738 ,  Y10T442/2746 ,  Y10T442/2861 ,  Y10T442/2893 ,  Y10T442/2902 ,  Y10T442/60 ,  Y10T442/697 ,  Y10T442/698

Abstract: A laminate base material of aromatic polyamide fiber non-woven fabric which comprises a combined non-woven fabric of para-aramid fibers and meta-aramid fibers bonded with each other by a resin binder such as an epoxy resin binder and meta-aramid fibers being thermally adhered to each other and meta-aramid fibers being thermally adhered to para-aramid fibers while they are passing through a pair of thermal rolls and heated and pressed by them and the meta-aramid fibers being included preferably by 5 through 30 weight %.

Abstract translation: 芳族聚酰胺纤维无纺织物的叠层基材包括对位芳族聚酰胺纤维的组合无纺织物和间位芳族聚酰胺纤维，它们通过树脂粘合剂如环氧树脂粘合剂和间位芳族聚酰胺纤维彼此粘合， 彼此热粘合并且间位芳族聚酰胺纤维在它们通过一对热辊时被热粘附到对位芳族聚酰胺纤维上，并被它们加热和加压，间位芳族聚酰胺纤维优选包含5至30重量％。

公开(公告)号：US5719354A

公开(公告)日：1998-02-17

申请号：US307958

申请日：1994-09-16

Applicant: Randy Douglas Jester ,  Edwin Charles Culbertson ,  Detlef M. Frank ,  Sherman Hall Rounsville ,  John Arthur Penoyer ,  Takeichi Tsugaka ,  Minoru Onodera ,  Toshiaki Sato ,  Toru Sanefuji

Inventor： Randy Douglas Jester ,  Edwin Charles Culbertson ,  Detlef M. Frank ,  Sherman Hall Rounsville ,  John Arthur Penoyer ,  Takeichi Tsugaka ,  Minoru Onodera ,  Toshiaki Sato ,  Toru Sanefuji

IPC: B32B7/02 ,  B32B7/12 ,  C08L67/00 ,  C08L67/04 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4632 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K3/28 ,  H05K3/386

Abstract: The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer. The boards are produced by stacking a plurality of circuit layer sheets in appropriate electrical alignment such that they are separated by an interposed layer of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers in contact with the higher melting point polymer of the circuit layers.

Abstract translation: 本发明提供了一种多层微电子电路板，其包括多个电路层的叠层，该多个电路层在层内包含导电通孔，或者在该层的表面上的导电通路和导电布线图案的组合，该层包括第一液晶聚合物， 插入在所述电路层之间，具有比第一液晶聚合物的熔点低至少约10℃的第二液晶聚合物层。 这些板是通过以适当的电气对准层叠多个电路层片而制成的，使得它们被具有较低熔点的第二液晶聚合物的插入层隔开，并且在压力下加热堆叠的聚合物片材足以粘合片材或 层到微电子印刷电路板中，加热的温度足以熔化较低熔点的第二聚合物，但不足以熔化存在于电路层中的聚合物。 第二聚合物层可以在组装期间作为单独的片材插入，或者可以作为与电路层的较高熔点聚合物接触的一个或两个分开的表面层存在。

公开(公告)号：US5466535A

公开(公告)日：1995-11-14

申请号：US76590

申请日：1993-06-15

Applicant: David E. Higgins ,  Martin Wright

Inventor： David E. Higgins ,  Martin Wright

IPC: B32B27/08 ,  B32B27/30 ,  B32B27/36 ,  C08J5/12 ,  C08J7/04 ,  H05K1/03 ,  C08K5/12

CPC classification number: C08J7/047 ,  C08J5/124 ,  H05K1/036 ,  C08J2367/02 ,  C08J2433/00 ,  H05K2201/0145 ,  Y10T428/24901 ,  Y10T428/31797 ,  Y10T428/31913 ,  Y10T428/3192

Abstract: A polymeric film has a polyester substrate layer and a cross-linked adherent layer of an acrylic resin and a phthalate ester. The adherent layer exhibits improved adhesion to the substrate and to a range of subsequently applied layers, such as inks, lacquers, and vinyl chloride polymers.

Abstract translation: 聚合物膜具有聚酯基材层和丙烯酸树脂和邻苯二甲酸酯的交联粘合层。 粘附层对基材和随后施加的一些层，例如油墨，漆和氯乙烯聚合物具有改进的粘合性。

公开(公告)号：US5387493A

公开(公告)日：1995-02-07

申请号：US599428

申请日：1990-10-18

Applicant: Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

Inventor： Shinichiro Imabayashi ,  Hitoshi Oka ,  Isamu Tanaka ,  Hiroshi Kikuchi ,  Makio Watanabe

IPC: G03F7/027 ,  G03F7/004 ,  G03F7/028 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42 ,  H05K3/46 ,  G03C1/492

CPC classification number: H05K3/185 ,  G03F7/004 ,  G03F7/028 ,  H05K3/4661 ,  H05K2201/0145 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602

Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Abstract translation: 用于形成导体图案的树脂组合物，其包含光固化树脂，光聚合引发剂，热固性树脂，热固性树脂的试剂，光敏半导体颗粒，并且如果需要，多官能不饱和化合物适合于在构型中形成非常细的导体图案， up方法。