公开(公告)号：US20040229035A1

公开(公告)日：2004-11-18

申请号：US10870629

申请日：2004-06-17

Inventor： E. Mikhail Sagal ,  Kevin A. McCullough ,  James D. Miller

IPC: B22F007/00

CPC classification number: H05K1/0209 ,  B29C45/0013 ,  B29C70/58 ,  B29K2021/00 ,  B29K2995/0013 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0215 ,  Y10T428/12028 ,  Y10T428/12111 ,  Y10T428/12153 ,  Y10T428/2958

Abstract: The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.

Abstract translation: 本发明涉及导热弹性垫。 垫可以通过注塑成型包含约30至60体积％的弹性体聚合物基质和约25至60体积％的导热填料的导热组合物来制备。 所得到的垫片具有传热性能，并且可以用作热界面以保护发热电子器件。

公开(公告)号：US06796025B2

公开(公告)日：2004-09-28

申请号：US10084370

申请日：2002-02-28

Applicant: Kazuyuki Imamura ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Toshiya Akamatsu

Inventor： Kazuyuki Imamura ,  Osamu Yamaguchi ,  Yasunori Fujimoto ,  Toshiya Akamatsu

IPC: H05K334

CPC classification number: H01L24/81 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R4/04 ,  H01R43/0256 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: In a method for mounting an electronic part on a mounting substrate in that projection electrodes provided on the electronic part are welded by fusion to join connection terminals provided on the mounting substrate, the flux paste includes a base flux and metal grains having diameters smaller than the diameters of projection electrodes and having a thickness so as to form a space between the flux paste and the electronic part when the electronic part is mounted on the mounting substrate and the flux paste is arranged on the mounting substrate. A resin is sealed in the space formed between the electronic part and the mounting substrate after the projection electrodes are joined to the connection terminals.

Abstract translation: 在将电子部件安装在安装基板上的方法中，通过熔接焊接设置在电子部件上的突起电极来焊接设置在安装基板上的连接端子，焊剂膏包括基极焊剂和直径小于 投影电极的直径，并且当电子部件安装在安装基板上并且焊剂膏体被布置在安装基板上时具有厚度以形成焊剂糊和电子部件之间的空间。 在突起电极接合到连接端子之后，树脂被密封在形成在电子部件和安装基板之间的空间中。

公开(公告)号：US20040134976A1

公开(公告)日：2004-07-15

申请号：US10341788

申请日：2003-01-14

Inventor： Frank Keyser ,  Robert Fuerst

IPC: B23K031/02

CPC classification number: B23K35/0244 ,  B23K35/025 ,  H01L2224/10165 ,  H01L2224/8114 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/10636 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: A system and method are disclosed for providing a solder joint between a pair of electrical devices which have juxtapositionable solderable portions. A solder material is provided between the solderable portions at the solder joint. A spacer material is suspended in the solder material to maintain the electrical devices spaced a predetermined distance from each other at the solder joint. The spacer material has a melting point higher than that of the solder material.

Abstract translation: 公开了一种用于在具有可并置可焊接部分的一对电气装置之间提供焊接接头的系统和方法。 在焊料接合处的可焊接部分之间设置焊料。 间隔材料悬浮在焊料材料中，以保持电气装置在焊接接头处彼此间隔预定的距离。 间隔材料的熔点高于焊料材料。

公开(公告)号：US20040065949A1

公开(公告)日：2004-04-08

申请号：US10249758

申请日：2003-05-06

Inventor： William Tze-You Chen ,  Ho-Ming Tong ,  Chun-Chi Lee ,  Su Tao ,  Jeng-Da Wu ,  Chih-Huang Chang ,  Po-Jen Cheng

IPC: H01L023/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/0215 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05166

Abstract: A flip chip interconnect structure is formed on a bump pad of a chip, and includes an under bump metallurgy (UBM) formed on the bump pad, and a solder bump formed on the UBM. The solder bump includes tin and is further doped with metallic particles that are capable of reacting with tin in the solder bump to from an inter-metallic compound due to a thermal effect produced in use of a later fabrication process or an operation on the chip. Furthermore, the material of the metal particles is selected from a group consisting of copper, silver and nickel.

Abstract translation: 倒装芯片互连结构形成在芯片的凸块焊盘上，并且包括形成在凸块焊盘上的凸块下金属（UBM）和形成在UBM上的焊料凸块。 焊料凸块包括锡，并且由于在后续制造工艺或芯片上的操作产生的热效应，进一步掺杂能够与焊料凸块中的锡反应从金属间化合物的金属颗粒。 此外，金属颗粒的材料选自铜，银和镍。

公开(公告)号：US06708404B1

公开(公告)日：2004-03-23

申请号：US09593494

申请日：2000-06-14

Applicant: Morio Gaku ,  Nobuyuki Ikeguchi ,  Yoshihiro Kato ,  Hiroki Aoto

Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Yoshihiro Kato ,  Hiroki Aoto

IPC: H01K310

CPC classification number: H05K3/0038 ,  B23K2101/42 ,  H05K3/429 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/0346 ,  H05K2203/1383 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of making a high-density copper-clad multi-layered printed wiring board having a reliable through hole including providing a stacked assembly including three copper foil layers and at least two resin layers; providing an auxiliary material on a top surface of the stacked assembly and providing a backup sheet on a bottom surface of the stacked assembly to form an assembly; subjecting the top surface of the assembly to pulsed oscillation from a carbon dioxide laser to form at least one through-hole to produce a pulsed assembly; reducing the thickness of the front and reverse copper foil layers and simultaneously with reducing, removing copper foil burrs, to produce a cleaned assembly; and plating the cleaned assembly with copper to produce the high-density copper-clad multi-layered printed wiring board.

Abstract translation: 一种制造具有可靠通孔的高密度铜包层多层印刷布线板的方法，包括提供包括三个铜箔层和至少两个树脂层的层叠组件; 在所述堆叠组件的顶表面上提供辅助材料，并且在所述堆叠组件的底表面上提供备用片以形成组件; 对组件的顶表面进行来自二氧化碳激光器的脉冲振荡以形成至少一个通孔以产生脉冲组件; 减少前后铜箔层的厚度，同时减少去除铜箔毛刺，生产清洁组件; 并用铜电镀清洁组件，以生产高密度铜包层多层印刷线路板。

公开(公告)号：US20030062616A1

公开(公告)日：2003-04-03

申请号：US09391133

申请日：1999-09-07

Inventor： WILLIAM PATRICK HUSSEY

IPC: H01L031/115 ,  H01L023/053 ,  H01L021/00

CPC classification number: H05K3/4069 ,  H05K1/0293 ,  H05K1/0373 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/24893

Abstract: A structure and method thereof for providing an electrically conductive path between a first conductive point and a second conductive point. The structure includes an insulating material disposed between the first conductive point and the second conductive point. A dipole material is distributed within the insulating material. The dipole material is comprised of randomly oriented magnetic particles. The magnetic particles in a selected localized region of the insulating material are aligned to form an electrically conductive path between the first conductive point and the second conductive point through the insulating material.

Abstract translation: 一种用于在第一导电点和第二导电点之间提供导电路径的结构和方法。 该结构包括设置在第一导电点和第二导电点之间的绝缘材料。 偶极材料分布在绝缘材料内。 偶极材料由随机取向的磁性颗粒组成。 在绝缘材料的选定的局部区域中的磁性颗粒被对准以在第一导电点和第二导电点之间通过绝缘材料形成导电路径。

公开(公告)号：US20020168510A1

公开(公告)日：2002-11-14

申请号：US10062562

申请日：2002-02-05

Inventor： Yuichi Satsu ,  Akio Takahashi ,  Tadashi Fujieda ,  Takumi Ueno ,  Haruo Akahoshi

IPC: B32B005/16

CPC classification number: H05K1/162 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/642 ,  H01L23/66 ,  H01L2924/0002 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/0218 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/26 ,  Y10T428/269 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2998 ,  Y10T428/31 ,  H01L2924/00

Abstract: A high dielectric composite material obtained by subjecting submicron particles of an inorganic filler containing a metal as its essential component to an insulating treatment such as a chemical treatment, further subjecting to a surface treatment for improving their compatibility with organic resins, and then dispersing in an organic resin, has a dielectric constant of 15 or above, with its dielectric loss tangent in the frequency region of from 100 MHz to 80 GHz being 0.1 or less, and can therefore be used effectively for multilayer wiring boards and module substrates.

Abstract translation: 通过将含有金属的无机填料的亚微米颗粒作为必要组分进行绝缘处理如化学处理获得的高介电复合材料，进一步进行表面处理以提高其与有机树脂的相容性，然后分散在 有机树脂的介电常数为15以上，在100MHz〜80GHz的频率范围内的介电损耗角正切为0.1以下，因此能够有效地用于多层布线基板和模块基板。

公开(公告)号：US06360939B1

公开(公告)日：2002-03-26

申请号：US09414207

申请日：1998-10-07

Applicant: Mohan R. Paruchuri ,  Dongkai Shangguan

Inventor： Mohan R. Paruchuri ,  Dongkai Shangguan

IPC: B23K3102

CPC classification number: H05K3/3484 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/0215 ,  H05K2201/0272

Abstract: A method of manufacturing a lead-free electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary powder is the same as is used in conventional solder paste. The additive powder has a melting point substantially higher than the melting point of the primary powder. The primary powder comprises between 80-99% Sn and 1-20% Ag. The additive powder metal is selected from the metal group comprising Sn, Ni, Cu, Ag, and Bi and mixtures thereof.

Abstract translation: 一种制造无铅电焊膏的方法，其具有在焊接过程中不熔化的主要焊料粉末和添加金属粉末成分。 金属粉末可以是元素金属或金属合金。 初级粉末与常规焊膏中使用的粉末相同。 添加剂粉末的熔点显着高于初级粉末的熔点。 初级粉末包含80-99％的Sn和1-20％的Ag。 添加剂粉末金属选自Sn，Ni，Cu，Ag和Bi及其混合物。

公开(公告)号：US06342680B1

公开(公告)日：2002-01-29

申请号：US09027214

申请日：1998-02-20

Applicant: Takeo Nakagawa ,  Hiroyuki Noguchi

Inventor： Takeo Nakagawa ,  Hiroyuki Noguchi

IPC: H05K109

CPC classification number: H05K1/095 ,  B29C45/0013 ,  B29C70/58 ,  B29C70/882 ,  H01B1/22 ,  H05K1/185 ,  H05K3/101 ,  H05K3/107 ,  H05K3/284 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/0113 ,  H05K2203/0425 ,  H05K2203/1469 ,  Y10S428/901 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T428/2804 ,  Y10T428/31681

Abstract: A lead-free super-highly conductive plastic is formed of a conductive resin composition which includes a thermoplastic resin, a lead-free solder that melts during plasticization, and metal powder or a mixture of metal powder and metal short fibers that promotes the fine dispersion of particles of the lead-free solder within the thermoplastic resin. In the lead-free super-highly conductive plastic, since particles of the lead-free solder are connected with each other via solder melted within the plastic, the particles of the lead-free solder are mutually joined, so that high conductivity is attained.

Abstract translation: 无铅超高导电性塑料由导电树脂组合物形成，该导电树脂组合物包括热塑性树脂，在增塑期间熔化的无铅焊料，以及促进细分散的金属粉末或金属粉末和金属短纤维的混合物 的热塑性树脂内的无铅焊料颗粒。 在无铅超导电塑料中，由于无铅焊料的颗粒通过在塑料内熔化的焊料相互连接，所以无铅焊料的颗粒相互连接，从而达到高导电性。

公开(公告)号：US06283358B1

公开(公告)日：2001-09-04

申请号：US09650304

申请日：2000-08-29

Applicant: Michael Ball

Inventor： Michael Ball

IPC: B23K3524

CPC classification number: B23K35/0244 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11823 ,  H01L2224/11849 ,  H01L2224/13124 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13366 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81024 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2203/041 ,  H05K2203/104 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract translation: 提供了一种用于在半导体部件上形成接触的方法和系统，例如晶片，芯片和封装。 该方法采用磁体来对准和保持组件衬底的结合位置上的铁磁性球。 该系统包括用于保持组件衬底的保持器，并且保持器上的磁体与构件上的结合位置对准。 该系统还包括用于将铁磁球放置在接合位置上的球放置机构，以及用于将铁磁球结合到接合位置的接合机构，例如烘箱或聚焦能量源。 铁磁球可以作为具有外部焊料层的铁磁芯提供，作为具有导电粘合剂外层的固体铁磁材料，或者作为嵌入可结合基质材料中的铁磁性颗粒。 替代实施例系统包括用于将铁磁球动态对准到结合位置的聚焦磁源。