公开(公告)号：US06180215B2

公开(公告)日：2001-01-30

申请号：US09353310

申请日：1999-07-14

Applicant: John T. Sprietsma ,  James V. Noval

Inventor： John T. Sprietsma ,  James V. Noval

IPC: B32B300

CPC classification number: B32B5/024 ,  B32B5/022 ,  B32B7/12 ,  B32B27/04 ,  B32B27/10 ,  B32B2315/085 ,  B32B2457/08 ,  H05K1/024 ,  H05K3/4688 ,  H05K2201/0284 ,  H05K2201/09309 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Disclosed is a multilayer (e.g., 4-layer) printed circuit board and method of manufacture thereof. The multilayer printed circuit board has at least one inner substrate (inner core) that includes a phenolic resin (e.g., a phenolic resin-laminated paper). Outer insulating layers of the multilayer printed circuit board can have a low dielectric constant (e.g., 3.8-4.4) and a high Tg (e.g., 180°-200° C.). The multilayer printed circuit board can be provided by steps including forming electrical circuit patterns from a copper foil on the inner substrate, to form a printed circuit board, forming a stack of at least one printed circuit board and outer copper foil layers, with insulating layers of, e.g., a semi-cured resin (e.g., prepreg layers) interposed between adjacent conductive metal layers, and then laminating the stack.

Abstract translation: 公开了一种多层（例如4层）印刷电路板及其制造方法。 多层印刷电路板具有至少一个包含酚醛树脂（例如酚醛树脂层压纸）的内基材（内芯）。 多层印刷电路板的外绝缘层可以具有低介电常数（例如3.8-4.4）和高Tg（例如180°-200℃）。 多层印刷电路板可以通过包括从内部基板上的铜箔形成电路图案的步骤来形成印刷电路板，形成具有绝缘层的至少一个印刷电路板和外部铜箔层的堆叠 例如介于相邻的导电金属层之间的半固化树脂（例如，预浸料层），然后层叠该叠层。

公开(公告)号：US5833883A

公开(公告)日：1998-11-10

申请号：US781301

申请日：1997-01-13

Applicant: Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

Inventor： Ali Afzali-Ardakani ,  Jeffrey Donald Gelorme ,  Laura Louise Kosbar

IPC: C08L97/00 ,  H05K1/03 ,  H01B1/00

CPC classification number: C08H6/00 ,  C08L97/005 ,  H05K1/0313 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fiberglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

Abstract translation: 描述了生物基交联组合物，制造方法和结构，特别是使用组合物的生物基印刷线路板和制造结构的方法。 生物基材料如木质素，作物油，木材树脂，单宁和多糖及其组合是优选使用热交联剂和引发剂交联的。 制造的材料具有适用于印刷线路板的性能，其通过用生物基材料，交联剂和引发剂的混合物浸渍玻璃纤维或生物基布而制成，其通过常规方法加工以生产印刷线路板。

公开(公告)号：US5229192A

公开(公告)日：1993-07-20

申请号：US748690

申请日：1991-08-21

Applicant: Horst Kober ,  Thomas Kuhlmann ,  Jorg Hausdorf ,  Steffen Kosack ,  Werner Schafer ,  Volker Siekermann

Inventor： Horst Kober ,  Thomas Kuhlmann ,  Jorg Hausdorf ,  Steffen Kosack ,  Werner Schafer ,  Volker Siekermann

IPC: B32B27/04 ,  B32B27/18 ,  C08K3/02 ,  C08K3/32 ,  D04H1/58 ,  D04H1/64 ,  D21H19/24 ,  D21H21/00 ,  D21H21/34 ,  H01B3/44 ,  H05K1/00 ,  H05K3/28

CPC classification number: H05K3/281 ,  C08K3/02 ,  C08K3/32 ,  H01B3/44 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A flame-resistant cover film for flexible circuit boards having excellent flame-resistance, handling, and storage qualities may be produced by treating an insulating film of a nonwoven polymer fabric with a flame-resistant, halogen-free polymeric adhesive. The polymeric adhesive comprises an aqueous mixture of a copolymerizate of acrylic acid esters and styrene, and an aminoplastic or phenoplastic precondensate to which a mixture of fine-particle red phosphorus and fine-particle ammonium polyphosphate is also added.

Abstract translation: 通过用耐火无卤聚合物粘合剂处理非织造聚合物织物的绝缘膜，可以制备具有优异的阻燃性，操作性和储存性的柔性电路板的阻燃覆盖膜。 聚合物粘合剂包括丙烯酸酯和苯乙烯的共聚物的水性混合物，以及还加入微粒红磷和细颗粒多磷酸铵的混合物的氨基塑料或酚醛预缩合物。

公开(公告)号：US4853273A

公开(公告)日：1989-08-01

申请号：US136746

申请日：1987-12-21

Applicant: Earl C. Harris, Jr.

Inventor： Earl C. Harris, Jr.

IPC: B23B35/00 ,  B32B3/28 ,  H05K3/00

CPC classification number: B32B3/28 ,  B23B35/005 ,  H05K3/0047 ,  B23B2228/36 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0214 ,  Y10S428/901 ,  Y10T156/1049 ,  Y10T156/1051 ,  Y10T428/24149 ,  Y10T428/24686 ,  Y10T428/24711 ,  Y10T428/24934

Abstract: A backup board for use when drilling through a circuit board having a conductive layer therein, the backup board comprises a lamination of outer planar sheets, and an inner core of a double wall corrugated material, the outer sheets being impregnated with a thermosetting adhesive, the sheets and the core being subjected to heat and pressure to form a laminate where said corrugations fold over and bond to said outer planar sheets, to provide a backup board giving surface support by said outer sheets with a less rigid core therebetween.

Abstract translation: 一种用于在通过其中具有导电层的电路板钻孔时使用的备用板，所述备用板包括外平面片的叠层和双壁波纹材料的内芯，外片浸渍有热固性粘合剂， 片材和芯经受热和压力以形成层压体，其中所述波纹折叠并结合到所述外平面片材上，以提供备用板，其通过所述外片在其间具有较小刚性的芯片给予表面支撑。

公开(公告)号：US4652324A

公开(公告)日：1987-03-24

申请号：US655446

申请日：1984-09-28

Applicant: Naotoshi Yamashina ,  Fumihiko Yabuta

Inventor： Naotoshi Yamashina ,  Fumihiko Yabuta

IPC: B32B37/10 ,  B32B15/08 ,  B32B15/088 ,  B32B15/092 ,  B32B21/08 ,  B32B27/02 ,  B32B29/06 ,  C08J5/24 ,  D21H11/00 ,  D21H19/04 ,  D21H27/00 ,  D21H27/30 ,  H05K1/03 ,  B32B23/06 ,  B32B31/04

CPC classification number: D21H19/04 ,  B32B29/06 ,  C08J5/24 ,  D21H27/30 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S162/05

Abstract: A process for the production of a laminated sheet is disclosed, which comprises impregnating a base paper for laminated sheet using a wood pulp having an .alpha.-cellulose content of 87.0% or more with a synthetic resin to prepare a prepreg and subjecting the prepreg to laminate molding by heat. A process for the production of a metal foil-clad laminated sheet is also disclosed, which comprises impregnating a base paper for laminated sheet using a wood pulp having an .alpha.-cellulose content of 87.0% or more with a synthetic resin to prepare a prepreg, piling up the prepreg, placing a metal foil one either one or both sides of the prepregs, and subjecting the resulting prepregs with metal foil to laminate molding by heat. The laminated sheet or metal foil-clad laminated sheet of this invention has not only excellent punchability but also excellent electric characteristics and heat resistance and hence, it is quite useful as a laminated sheet for high density printed wiring system.

Abstract translation: 公开了一种层压片材的制造方法，其包括用合成树脂浸渍含有α-纤维素含量为87.0％以上的木浆的层压片材用原料，制备预浸料坯，并对预浸料进行层压 热成型。 还公开了一种用于生产金属箔包覆层压片的方法，其包括用合成树脂使用α-纤维素含量为87.0％或更高的木浆浸渍用于层压片材的原纸以制备预浸料， 堆叠预浸料，将预浸料坯的一面或两面放置金属箔，并用金属箔对所得的预浸料进行加热成型。 本发明的层压片或金属箔包覆层压片不仅具有优异的冲压性，而且具有优异的电特性和耐热性，因此作为高密度印刷布线系统的层压片是非常有用的。

公开(公告)号：US4572859A

公开(公告)日：1986-02-25

申请号：US722762

申请日：1985-04-15

Applicant: Yasuo Fushiki ,  Masaharu Abe ,  Masayuki Oizumi

Inventor： Yasuo Fushiki ,  Masaharu Abe ,  Masayuki Oizumi

IPC: B32B27/04 ,  B32B27/10 ,  H01B3/48 ,  H05K1/03 ,  B32B7/00

CPC classification number: B32B27/04 ,  B32B27/10 ,  H01B3/48 ,  H05K1/036 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1476 ,  Y10S428/901 ,  Y10T428/24967 ,  Y10T428/31515 ,  Y10T428/31529 ,  Y10T428/31692 ,  Y10T428/3179 ,  Y10T428/3188 ,  Y10T428/31906 ,  Y10T428/31967

Abstract: An electrical laminate comprising a plurality of fibrous cellulosic substrate layers and alternately interposed layers of cured epoxy or unsaturated polyester resin between the adjacent substrate layers, wherein each of the substrate layers is embedded in a matrix of said cured resin which is substantially integral with said layers of cured resin, and consists essentially of cellulosic fibers having thereon a coating of methylol group-containing resin such as aminoplast resins. The laminate may be unclad or cladded with a metal foil.

Abstract translation: 一种电气层压板，包括多个纤维状纤维素基材层，并且在相邻的基材层之间交替插入固化的环氧树脂或不饱和聚酯树脂层，其中每个基材层嵌入所述固化树脂的基质中，所述基质与所述层基本上成一体 的固化树脂，并且基本上由其上具有含羟甲基基团的树脂如氨基塑料树脂的涂层的纤维素纤维组成。 层压体可以用金属箔未包覆或包覆。

公开(公告)号：US4518646A

公开(公告)日：1985-05-21

申请号：US557016

申请日：1983-12-01

Applicant: Roy F. Nichols, Jr.

Inventor： Roy F. Nichols, Jr.

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/00

CPC classification number: H05K1/036 ,  H05K1/0254 ,  H05K1/0268 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24934 ,  Y10T442/3455

Abstract: A high voltage arc-resistant laminate for printed circuit boards comprising a substrate and metallic foil bonded on one or both surfaces of the substrate. The substrate includes core sheets of cellulosic paper impregnated with a resin formulation comprising an admixture of resin solids including a major amount of phenolic resins, and minor amount of curing agents for the resins, and face sheets of glass fiber cloth impregnated with a resin formulation consisting substantially entirely of brominated aromatic epoxy resin solids, and minor amount of dicyandiamide curing agent and amine catalyst along with, antimony oxide, thixotropic agent, and pigments. Also disclosed is a process for manufacturing the laminate. A high temperature resistant embodiment is also disclosed in which the core sheet resin is brominated aromatic epoxy instead of phenolic resin.

Abstract translation: 一种用于印刷电路板的耐高压电弧层压板，包括基板和金属箔，所述金属箔接合在所述基板的一个或两个表面上。 基材包括浸渍有树脂配方的纤维素纸芯片，该树脂制剂包括含有大量酚醛树脂的树脂固体的混合物和少量用于树脂的固化剂，以及浸渍有树脂制剂的玻璃纤维布面片 基本上完全是溴化芳族环氧树脂固体，以及少量的双氰胺固化剂和胺催化剂以及氧化锑，触变剂和颜料。 还公开了一种制造层压体的方法。 还公开了耐高温的实施方案，其中芯片树脂是溴代芳族环氧树脂代替酚醛树脂。

公开(公告)号：US4501787A

公开(公告)日：1985-02-26

申请号：US490098

申请日：1983-04-29

Applicant: Joseph R. Marchetti ,  Wilbur R. Thomas

Inventor： Joseph R. Marchetti ,  Wilbur R. Thomas

IPC: C08L61/00 ,  B32B15/08 ,  B32B15/092 ,  C08G59/00 ,  C08J5/10 ,  C08J5/24 ,  C08L61/04 ,  C08L63/00 ,  C08L77/00 ,  H05K1/03 ,  B32B7/00 ,  B32B17/10 ,  H05K1/00

CPC classification number: B32B15/08 ,  H05K1/034 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/122 ,  Y10S428/901 ,  Y10S428/92 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/31761 ,  Y10T428/31964 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3439 ,  Y10T442/3585 ,  Y10T442/3813

Abstract: A prepreg useful in flame resistant copper clad printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a prebrominated epoxy resin or a mixture of a non-halogenated epoxy resin and flame retarding additive containing bromine, and phenolic hydroxyl groups. A phenolic novolac oligomer having an average of over 2.5 phenolic hydroxyl groups per oligomeric unit is used as curing agent. Optionally, a suitable catalyst may be included. The impregnated substrate is heated to cure or advance the resin to the "B"-stage.

Abstract translation: 用于阻燃铜包层印刷电路板的预浸料通过用含有溴化物的预溴化环氧树脂或非卤化环氧树脂和阻燃添加剂混合物和酚羟基的浸渍剂浸渍多孔基材来制备。 使用每个低聚单元平均具有超过2.5个酚羟基的酚醛清漆低聚物作为固化剂。 任选地，可以包括合适的催化剂。 将浸渍的基材加热固化或将树脂推进到“B”阶段。

公开(公告)号：US4440833A

公开(公告)日：1984-04-03

申请号：US437305

申请日：1982-10-28

Applicant: Arnold Franz ,  Siegfried Koepnick

Inventor： Arnold Franz ,  Siegfried Koepnick

IPC: B32B5/28 ,  B32B15/08 ,  B32B15/12 ,  B32B27/42 ,  B32B29/00 ,  C08J5/24 ,  C08K5/00 ,  C08L61/06 ,  C08L61/14 ,  C08L75/08 ,  D21H17/48 ,  D21H17/57 ,  H05K1/03 ,  B32B27/00 ,  B32B15/10

CPC classification number: H05K1/0373 ,  B32B15/12 ,  C08K5/00 ,  C08L61/06 ,  D21H17/48 ,  D21H17/57 ,  H05K1/0313 ,  C08L75/08 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/921 ,  Y10T428/31591 ,  Y10T428/31594 ,  Y10T428/31605 ,  Y10T428/31703 ,  Y10T428/31964

Abstract: Increased elasticity of a laminate is obtained by adding 5-20% by weight of a blocked polyetherurethane component from a reaction product of polyethylene glycol, polypropylene glycol and p-nonylphenol with toluene-2,4-diisocyanate having the following composition:______________________________________ polyethylene glycol 15-20% by weight polypropylene glycol 50-60% by weight toluene-2,4-diisocyanate 8-12% by weight nonylphenol 10-15% by weight ______________________________________ in the manufacture of a fire resistant laminate based on a cellulose-containing substrate material and an impregnating varnish made up of a phenol-resol with additives of plasticizers and flame retardants. A copper-laminated hard paper made of this phenolic resin laminate is distinguished by reduced punching resistance and stripping resistance.

Abstract translation: 通过从聚乙二醇，聚丙二醇和对壬基苯酚的反应产物中加入5-20重量％的封端聚醚聚氨酯组分与具有以下组成的甲苯-2,4-二异氰酸酯获得层压体的增加的弹性：聚乙二醇 15-20重量％ - 聚丙二醇50-60重量％甲苯-2,4-二异氰酸酯8-12重量％壬基酚10-15重量％ - 在制造基于纤维素的耐火层压板 含有酚醛树脂的增塑剂和阻燃剂添加剂的浸渍清漆。 由该酚醛树脂层压板制成的铜层压硬纸的特征在于抗冲击性和耐剥离性降低。

公开(公告)号：US4372800A

公开(公告)日：1983-02-08

申请号：US223402

申请日：1981-01-08

Applicant: Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

Inventor： Masayuki Oizumi ,  Masakazu Uekita ,  Masana Goto ,  Ichiro Azumi ,  Shoji Uozumi ,  Masaharu Abe ,  Yasuo Fushiki ,  Minoru Isshiki ,  Kunio Kawasaki

IPC: B32B37/00 ,  B29C57/00 ,  B29C63/00 ,  B29C67/00 ,  B29C70/00 ,  B29C70/50 ,  B32B15/08 ,  B32B27/04 ,  B32B38/08 ,  D21H25/06 ,  H05K1/03 ,  H05K3/02 ,  C09J5/02

CPC classification number: B32B38/08 ,  B29C70/50 ,  B32B27/04 ,  D21H25/06 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1545 ,  H05K3/022 ,  Y10S428/901 ,  Y10T156/1085 ,  Y10T29/49124 ,  Y10T442/3431 ,  Y10T442/3528 ,  Y10T442/656 ,  Y10T442/67

Abstract: A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.