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    Method of joining an electrical contact element to a substrate
    61.
    发明授权
    Method of joining an electrical contact element to a substrate 失效
    将电接触元件接合到基板的方法

    公开(公告)号：US5670418A

    公开(公告)日：1997-09-23

    申请号：US767918

    申请日：1996-12-17

    Applicant: Balaram Ghosal

    Inventor： Balaram Ghosal

    IPC: H01L21/48 ,  H05K3/34 ,  H05K3/40 ,  H01L21/44

    CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/2081 ,  Y02P70/613

    Abstract: An outer coating of an electrically conductive material having low wetability with respect to solder is deposited over a gold coating previously deposited on an electrical contact element. After soldering the contact element to a substrate, the portion of the outer coating not covered by solder is removed from the contact element. The method of joining a contact element to a substrate in accordance with the present invention effectively solves the problem of solder climb to the critical contact area of the element without the need to provide masking or apply plating resist coatings to selected areas of the element.

    Abstract translation: 相对于焊料具有低可润湿性的导电材料的外涂层沉积在预先沉积在电接触元件上的金涂层上。 在将接触元件焊接到基板之后，未被焊料覆盖的外部涂层的部分从接触元件移除。 根据本发明将接触元件接合到基板的方法有效地解决了焊料攀爬到元件的临界接触区域的问题，而不需要为元件的选定区域提供掩模或涂覆抗蚀剂涂层。

    Green ceramic via metallization technique
    62.
    发明授权
    Green ceramic via metallization technique 失效
    绿色陶瓷通过金属化技术

    公开(公告)号：US5651180A

    公开(公告)日：1997-07-29

    申请号：US518735

    申请日：1995-08-24

    Applicant: Richard P. Himmel ,  Raymond Brown

    Inventor： Richard P. Himmel ,  Raymond Brown

    IPC: H01L21/48 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40 ,  H01R43/16

    CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/3677 ,  H01L23/5383 ,  H05K3/4046 ,  H01L2224/16 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0382 ,  H05K2201/10234 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49224

    Abstract: The present invention provides a method and apparatus for metallizing vias in co-fired ceramic green tape. A vacuum operated pick and place anvil comprising a porous block is used to pick up conductor balls from a bed. Air pressure is used to create a vacuum which pulls the conductor balls to the porous block. A stencil having openings is placed on a contact surface of the anvil, thereby permitting only one conductor ball to attach to each opening in the stencil. With the conductor balls attached to the anvil, the anvil is lowered onto the green tape. Next the anvil pushes the conductor balls into the tape until the conductor balls break through the opposite side of the tape. The anvil is retracted leaving the conductor balls lodged in the tape. It is possible to provide a green tape with pre-formed vias so that forcing the conductor balls into the tape is a simpler task. The locations of the openings in the stencil determines the location of the vias or must correspond to the vias in a tape having pre-formed vias. If the conductor balls protrude from any surface of the tape, the anvil or similar device can be used to flatten the protrusion. In alternative embodiments, the present invention conductor balls can be substituted with a material having a high thermal conductivity, or a high dielectric constant, or to include ferrite.

    Abstract translation: 本发明提供了一种用于在共烧陶瓷生胶带中金属化通孔的方法和装置。 使用包括多孔块的真空操作的拾取和放置砧座从床上拾取导体球。 空气压力用于产生将导体球拉到多孔块的真空。 具有开口的模板被放置在砧座的接触表面上，从而仅允许一个导体球附着在模板中的每个开口上。 将导体球连接到砧座上，将砧座下降到生胶带上。 接下来，砧将导体球推入带中，直到导体球穿过带的相对侧。 砧座被收回，使导体球落在带中。 可以提供具有预先形成的通孔的绿色带，使得将导体球强制进入带是更简单的任务。 模板中的开口的位置决定了通孔的位置，或者必须与具有预先形成的通孔的带中的通孔相对应。 如果导体球从带的任何表面突出，则可以使用砧座或类似装置使突起平坦化。 在替代实施例中，本发明的导体球可以用具有高导热性或高介电常数的材料代替，或者包括铁氧体。

    Via and pad structure for thermoplastic substrates and method and apparatus for forming the same
    66.
    发明授权
    Via and pad structure for thermoplastic substrates and method and apparatus for forming the same 失效
    用于热塑性基材的通孔和垫结构及其形成方法和装置

    公开(公告)号：US5401911A

    公开(公告)日：1995-03-28

    申请号：US863645

    申请日：1992-04-03

    Applicant: Herbert Anderson ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

    Inventor： Herbert Anderson ,  Arthur Bross ,  Julian G. Cempa ,  Robert O. Lussow ,  Donald E. Myers ,  Thomas J. Walsh

    IPC: B29C65/70 ,  H01R12/04 ,  H01R43/20 ,  H05K1/11 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/4046 ,  H01L2224/11003 ,  H01L2224/11334 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/091 ,  H05K2201/10234 ,  H05K2203/1105 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49153

    Abstract: An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer. Perfecting features of the substrate and method and apparatus for forming the substrate, embedding to a selected depth to form protrusions and recesses to assist in registration of a substrate layer with another substrate layer, metallization to form pads, improved connection between metallization patterns on the substrate and the conductive elements, the regulation of pressurization of substrate material by means of differently shaped dimples or a renewable surface and several alternative arrangements for positioning and embedding the conductive elements. Multiple types of conductive elements may be simultaneously embedded to different depths in a single substrate and from either or both sides thereof to form a variety of substrate structures.

    Abstract translation: 通过在热塑性材料（其优选为液晶聚合物）中将诸如针的导电元件嵌入一个或多个球或球体上而形成改进的连接。 衬底可以被加热以便于嵌入过程，其中衬底层的材料在压力下被回流以通过预加载力来保持导电元件。 与引脚或多个导电元件的这种连接的形成允许独立于连接的纵横比，因此独立于衬底上导电图案的特征尺寸和衬底层的厚度。 衬底的完善特征以及用于形成衬底的方法和装置，嵌入到所选择的深度以形成突出和凹陷以辅助衬底层与另一衬底层对准，金属化以形成衬垫，改善衬底上的金属化图案之间的连接 和导电元件，通过不同形状的凹坑或可再生表面调节衬底材料的加压以及用于定位和嵌入导电元件的几种替代布置。 多种类型的导电元件可以同时嵌入到单个基板中的不同深度并且从其一侧或两侧嵌入到不同深度以形成各种基板结构。

    Electrical connector tape
    69.
    发明授权
    Electrical connector tape 失效
    电连接胶带

    公开(公告)号：US4931598A

    公开(公告)日：1990-06-05

    申请号：US292050

    申请日：1988-12-30

    Applicant: Clyde D. Calhoun ,  David C. Koskenmaki

    Inventor： Clyde D. Calhoun ,  David C. Koskenmaki

    IPC: H01R4/04 ,  H05K3/32

    CPC classification number: H01R4/04 ,  H05K3/323 ,  H05K2201/09945 ,  H05K2201/10234 ,  H05K2203/0338

    Abstract: The invention provides a sheet material adapted to make bonded electrical connection to an array of closely spaced conductive terminal pads. The material may be provided as a roll of an elongated flexible connector tape. The sheet material of the invention comprises a thin, flexible insulating substrate and a plurality of longitudinally-extending, regularly-spaced, metal conductive members. The sheet may also include an adhesive layer that may cover the conductive members or at least a portion of the conductive members may extend above the adhesive layer. The conductive members may be supported and held on the substrate or may be suspended in the adhesive, out of contact with the substrate.

    Abstract translation: 本发明提供了一种片材，其适于使得与紧密间隔的导电端子焊盘的阵列的结合电连接。 材料可以被设置为细长柔性连接器带的卷。 本发明的片材包括薄的柔性绝缘基底和多个纵向延伸的规则间隔的金属导电构件。 片材还可以包括可以覆盖导电构件的粘合剂层，或者导电构件的至少一部分可以在粘合剂层的上方延伸。 导电构件可以被支撑并保持在基底上，或者可以悬挂在粘合剂中，与基底不接触。

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