公开(公告)号：US20190245307A1

公开(公告)日：2019-08-08

申请号：US16255829

申请日：2019-01-24

Applicant: YUEQING HONGCHANG RADIO CO., LTD.

Inventor： Xiao-Ming Zheng

IPC: H01R13/648 ,  H05K1/02 ,  H05K1/18 ,  H01R13/50 ,  H01R24/76

CPC classification number: H01R13/648 ,  H01R12/58 ,  H01R12/707 ,  H01R13/50 ,  H01R24/76 ,  H01R2103/00 ,  H05K1/0215 ,  H05K1/184 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10325 ,  H05K2201/10916

Abstract: A grounding structure for power socket includes a grounding main body, which consists of a basic section, a first connecting section, a second connecting section, a grounding section and a contact section. The first and the second connecting section are separately downward extended from two opposite ends of the basic section, such that the basic section and the first and second connecting sections together define a receiving space in between them. The contact section is downward extended from a side edge of the basic section into the receiving space; and the first connecting section is outward bent at its lower end to form the grounding section. And, the grounding section is provided at an outer end with a grounding opening.

公开(公告)号：US20180277025A1

公开(公告)日：2018-09-27

申请号：US15989526

申请日：2018-05-25

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  F21K9/20 ,  G06F3/14 ,  F21K9/90 ,  F21V23/02 ,  F21V31/00 ,  H05K7/14 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H05K5/03 ,  H05K5/02 ,  H05K5/00 ,  H05K3/32 ,  H05K1/18 ,  H01B11/02 ,  H01B9/00 ,  H01B7/282 ,  H05K7/20 ,  G09G5/14 ,  G09G3/32 ,  G09G3/00 ,  G09F9/302 ,  G06F3/147 ,  H05K5/06 ,  F21Y115/10 ,  F21Y101/00 ,  H04N7/00

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1423 ,  G06F3/1446 ,  G06F3/147 ,  G06T1/60 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/003 ,  G09G5/14 ,  G09G2300/026 ,  G09G2300/04 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K999/99 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/1028 ,  Y02P70/611

Abstract: Embodiments of the invention are related to modular display panels. In one embodiment, a modular display panel includes a first side which includes a display surface, and an opposite second side. The modular display panel further includes a plastic enclosure including an outer surface that forms substantially all of the second side. The modular display panel further includes LEDs arranged as pixels attached to a printed circuit board which is attached to the plastic enclosure. The modular display panel further includes a circuit for controlling the LEDs and a power source for powering the LEDs. The front side of the printed circuit board is sealed to be waterproof and the plastic enclosure is sealed to be waterproof so that the modular display panel is sealed to be waterproof.

公开(公告)号：US20180277024A1

公开(公告)日：2018-09-27

申请号：US15989461

申请日：2018-05-25

Applicant: Ultravision Technologies, LLC

Inventor： William Y. Hall

IPC: G09F13/22 ,  F21K9/20 ,  G06F3/14 ,  F21K9/90 ,  F21V23/02 ,  F21V31/00 ,  H05K7/14 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H05K5/03 ,  H05K5/02 ,  H05K5/00 ,  H05K3/32 ,  H05K1/18 ,  H01B11/02 ,  H01B9/00 ,  H01B7/282 ,  H05K7/20 ,  G09G5/14 ,  G09G3/32 ,  G09G3/00 ,  G09F9/302 ,  G06F3/147 ,  H05K5/06 ,  F21Y115/10 ,  F21Y101/00 ,  H04N7/00

CPC classification number: G09F13/22 ,  F21K9/20 ,  F21K9/90 ,  F21V23/023 ,  F21V31/005 ,  F21Y2101/00 ,  F21Y2115/10 ,  G06F1/1601 ,  G06F1/182 ,  G06F1/183 ,  G06F1/188 ,  G06F1/189 ,  G06F1/20 ,  G06F1/26 ,  G06F3/1423 ,  G06F3/1446 ,  G06F3/147 ,  G06T1/60 ,  G09F9/3023 ,  G09F2013/222 ,  G09G3/006 ,  G09G3/32 ,  G09G5/003 ,  G09G5/14 ,  G09G2300/026 ,  G09G2300/04 ,  G09G2320/029 ,  G09G2330/02 ,  G09G2330/045 ,  G09G2330/10 ,  G09G2360/04 ,  H01B7/2825 ,  H01B9/003 ,  H01B11/02 ,  H04N7/00 ,  H05K1/181 ,  H05K3/32 ,  H05K5/0017 ,  H05K5/0247 ,  H05K5/0256 ,  H05K5/03 ,  H05K5/06 ,  H05K7/1422 ,  H05K7/1427 ,  H05K7/20 ,  H05K7/20127 ,  H05K7/20136 ,  H05K7/2039 ,  H05K7/20954 ,  H05K7/20963 ,  H05K999/99 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/1028 ,  Y02P70/611

Abstract: Embodiments of the invention are related to modular display panels. In one embodiment, a modular display panel includes a first side which includes a display surface, and an opposite second side formed from an outer surface of a housing made of plastic. The modular display panel further includes a printed circuit board and LEDs arranged as pixels is attached to the printed circuit board and a sealing compound is disposed over the printed circuit board. The modular display panel further includes a power source for powering the plurality of LEDs and one or more electrical connectors. The sealing compound, the housing, and the one or more electrical connectors form a waterproof enclosure so that the modular display panel is sealed to be waterproof. The modular display panel is configured to be exposed to an external environment without a protective waterproof enclosure and to be cooled passively without fans.

公开(公告)号：US10036546B2

公开(公告)日：2018-07-31

申请号：US15334439

申请日：2016-10-26

Applicant: Koito Manufacturing Co., Ltd.

Inventor： Noriaki Ito

IPC: B60Q1/06 ,  F21V29/00 ,  F21V29/80 ,  H01L33/62 ,  F21V23/06 ,  H01L33/52 ,  F21Y115/10 ,  F21Y115/30

CPC classification number: F21V29/80 ,  F21V23/06 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/0278 ,  H05K3/0014 ,  H05K3/202 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2203/1327

Abstract: According to the present disclosure, a first optical system includes a first light source and emits a first illumination light. A second optical system includes a second light source and emits a second illumination light. A controller controls turning-on/off of the first light source and the second light source. The first optical system and the second optical system are configured such that a first illumination standard is satisfied by the first illumination light and the second illumination light. The first optical system is configured such that a second illumination standard is satisfied by the first illumination light. The controller allows the turning-on of the first light source when the turning-on of the second light source is disabled, and prohibits the turning-on of the second light source when the turning-on of the first light source is disabled.

公开(公告)号：US09849297B2

公开(公告)日：2017-12-26

申请号：US15356466

申请日：2016-11-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert J Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/36 ,  A61N1/375 ,  A61N1/05 ,  H05K1/11 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/18

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20170290145A1

公开(公告)日：2017-10-05

申请号：US15507431

申请日：2015-08-31

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Hiroshi TAJIMA ,  Masahiro WATANABE

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K1/09

CPC classification number: H05K1/0281 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/09 ,  H05K1/189 ,  H05K3/321 ,  H05K2201/0715 ,  H05K2201/09136 ,  H05K2201/1028 ,  H05K2201/2009

Abstract: A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 μm to 0.9 μm thick.

公开(公告)号：US20170095671A1

公开(公告)日：2017-04-06

申请号：US15356466

申请日：2016-11-18

Applicant: SECOND SIGHT MEDICAL PRODUCTS, INC.

Inventor： Robert J. Greenberg ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  David Zhou

IPC: A61N1/375 ,  A61N1/36 ,  H05K1/11 ,  H05K3/18 ,  H05K1/18 ,  H01L23/00 ,  H05K3/32 ,  H05K3/34 ,  A61N1/05 ,  H01L23/498

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a studbump connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20160255722A1

公开(公告)日：2016-09-01

申请号：US15150234

申请日：2016-05-09

Applicant: International Business Machines Corporation

Inventor： Michael A. Christo ,  Julio A. Maldonado ,  Roger D. Weekly ,  Tingdong Zhou

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/112 ,  H05K1/0263 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/3436 ,  H05K2201/0355 ,  H05K2201/1028 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

Abstract translation: 可以根据各种技术向电子模块供电。 在一般的实施方案中，例如，用于向电子模块供电的系统可以包括印刷电路板，电子模块和导电箔。 板可以包括在第一侧上的多个接触位置，其中至少一个接触位置电耦合到通孔到板的第二侧。 电子模块可以电耦合到板的第一侧上的接触位置，并且通过电耦合到通孔的至少一个接触位置接收电力。 箔可以适于传送用于电子模块的电力并且电耦合到电路板的第二侧上至少通过电气耦合到接收用于电子模块的电力的接触位置的通孔。

公开(公告)号：US09408305B2

公开(公告)日：2016-08-02

申请号：US14947558

申请日：2015-11-20

Applicant: MC10, Inc.

Inventor： Yung-Yu Hsu

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/16 ,  H01R9/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/036 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/118 ,  H05K1/147 ,  H05K1/148 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0187 ,  H05K2201/09245 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2009

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

公开(公告)号：US20160133596A1

公开(公告)日：2016-05-12

申请号：US14997919

申请日：2016-01-18

Applicant: Intel Corporation

Inventor： Qing Ma ,  Jun He ,  Patrick Morrow ,  Paul B. Fischer ,  Sridhar Balakrishnan ,  Satish Radhakrishnan ,  Tatyana Andryushchenko ,  Guanghai Xu

IPC: H01L23/00 ,  H01L21/033

CPC classification number: H01L24/19 ,  B23K1/0016 ,  H01L21/0334 ,  H01L24/11 ,  H01L2224/245 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/4015 ,  H05K2201/1028 ,  H01L2924/00

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract translation: 本主题涉及制造微电子器件的领域。 在至少一个实施例中，本主题涉及形成具有其部分的互连，其在附接到外部设备之后在冷却期间从微电子器件脱粘。 脱粘部分允许互连件弯曲并吸收应力。