公开(公告)号：US20080225461A1

公开(公告)日：2008-09-18

申请号：US12039284

申请日：2008-02-28

Applicant: Yukihiko SHIRAKAWA ,  Iwao MIURA

Inventor： Yukihiko SHIRAKAWA ,  Iwao MIURA

IPC: H01G4/224

CPC classification number: H01G2/06 ,  H01C1/14 ,  H01G4/228 ,  H01G9/008 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613

Abstract: There are provided an electronic component permitting easy surface mounting onto a circuit board and, a mounted structure and an inverter device therewith.A surface mount type electronic component has a dielectric element body, electrodes, lead conductors, and lead wires. The dielectric element body has principal faces and side faces. One electrode is formed on one principal face, the other electrode is formed on the other principal face, and the electrodes face each other. A first portion of one lead conductor is laid on one side face. A first portion of the other lead conductor is laid on another side face. First portions of the lead wires are connected to the corresponding first portions of the lead conductors.

Abstract translation: 提供了允许容易地安装到电路板上的电子部件，以及安装的结构和与其相反的逆变器装置。 表面安装型电子部件具有电介质元件主体，电极，引线导体和引线。 电介质元件主体具有主面和侧面。 一个电极形成在一个主面上，另一个电极形成在另一个主面上，电极彼此面对。 一个引线导体的第一部分放置在一个侧面上。 另一个引线导体的第一部分被放置在另一侧面上。 引线的第一部分连接到引线导体的对应的第一部分。

公开(公告)号：US20070188975A1

公开(公告)日：2007-08-16

申请号：US11703171

申请日：2007-02-07

Applicant: Masaaki Togashi ,  Kentaro Ushioda

Inventor： Masaaki Togashi ,  Kentaro Ushioda

IPC: H01G4/228

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K3/3426 ,  H05K2201/10469 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A ceramic capacitor comprises a ceramic sintered body, and first and second terminal electrodes formed on outer surfaces of the ceramic sintered body. The first terminal electrode is electrically connected to a land formed on a substrate through a first metal terminal. The first metal terminal has a first capacitor connecting portion mechanically connected to the first terminal electrode, a first terminal portion mechanically connected to the land, and a first intermediate portion electrically connecting the first capacitor connecting portion and the first terminal portion to each other. The first capacitor connecting portion of the first metal terminal is parallel to the substrate.

Abstract translation: 陶瓷电容器包括陶瓷烧结体和形成在陶瓷烧结体的外表面上的第一和第二端电极。 第一端子电极通过第一金属端子电连接到形成在基板上的焊盘。 第一金属端子具有机械地连接到第一端子电极的第一电容器连接部分，机械地连接到焊盘的第一端子部分和将第一电容器连接部分和第一端子部分彼此电连接的第一中间部分。 第一金属端子的第一电容器连接部分平行于基板。

公开(公告)号：US07243834B2

公开(公告)日：2007-07-17

申请号：US10803884

申请日：2004-03-19

Applicant: Takayuki Mori ,  Shuichi Komamizu ,  Kazumi Makino

Inventor： Takayuki Mori ,  Shuichi Komamizu ,  Kazumi Makino

IPC: B23K31/00

CPC classification number: H05K3/3484 ,  B41N1/248 ,  H05K3/1225 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10818 ,  H05K2203/0545

Abstract: A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member 6, and moving a printing squeegee along the upper surface of the metal mask 1 to thereby print a lead-free solder paste on the surface of the electrode 21 on the circuit board 2. The method produces on the electrode 21 of the circuit board 2 two lead-free solder paste patterns 30a, 30a each circular or elliptical in shape and arranged in a direction in which the lead member 6 is to extend from the electrode.

Abstract translation: 使用本发明的金属掩模，通过将金属掩模1放置在具有以预定图案形成的电极21的电路板2上以连接引线构件6的端部来实现无铅焊膏印刷方法， 并且沿着金属掩模1的上表面移动印刷刮板，从而在电路板2上的电极21的表面上印刷无铅焊膏。 该方法在电路板2的电极21上产生两个无铅焊膏图形30a，30a，每个圆形或椭圆形形状并且沿引线构件6从电极延伸的方向排列。

公开(公告)号：US20060255455A1

公开(公告)日：2006-11-16

申请号：US11263115

申请日：2005-10-31

Applicant: Craig Rotay

Inventor： Craig Rotay

IPC: H01L23/34

CPC classification number: H01L23/49562 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/3426 ,  H05K2201/10166 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high power density transistor structure includes a transistor package capable of housing a high power density transistor. The transistor package has a package insulator and a plurality of transistor leads. Each of the transistor leads has a far end, a near end and a lead periphery. The high power density transistor structure also includes a solder lock located on at least one of the transistor leads. At least a portion of the solder lock is attachable to a printed circuit board (PCB). At least a portion of the lead periphery of each transistor lead is attachable to at least one of: the PCB and the package insulator.

Abstract translation: 高功率密度晶​​体管结构包括能够容纳高功率密度晶​​体管的晶体管封装。 晶体管封装具有封装绝缘体和多个晶体管引线。 每个晶体管引线具有远端，近端和引线周边。 高功率密度晶​​体管结构还包括位于至少一个晶体管引线上的焊接锁。 焊接锁的至少一部分可附接到印刷电路板（PCB）。 每个晶体管引线的引线周边的至少一部分可附接到PCB和封装绝缘体中的至少一个。

公开(公告)号：US07064278B2

公开(公告)日：2006-06-20

申请号：US10106977

申请日：2002-03-25

Applicant: Michael C. Seckora

Inventor： Michael C. Seckora

IPC: H05K1/16

CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K3/305 ,  H05K3/3426 ,  H05K2201/09727 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided. Connecting elements having length, width, and thickness, are provided for terminals of a component to be connected to a trace. The connecting element is electrically coupled between the terminal and the trace, typically by soldering. The dimensions of the connecting element are chosen to reduce or eliminate the impedance mismatch which would result from a direct connection between the trace and component. Connecting elements are generally L-shaped, i.e., having first and second planar portions perpendicular with respect to each other, and having a curving portion that connects the first and second planar portions. In one embodiment, dimensions of at least a portion of the connecting element are such that its width increases as its distance from a ground plane within the substrate increases.

公开(公告)号：US20030136656A1

公开(公告)日：2003-07-24

申请号：US10056240

申请日：2002-01-23

Inventor： John Edmund Dunne ,  Martin John Tatara

IPC: H01H009/00

CPC classification number: H01H9/0271 ,  H01H1/5805 ,  H01H11/0006 ,  H01H11/0031 ,  H05K1/0286 ,  H05K1/119 ,  H05K3/308 ,  H05K2201/049 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2201/10818

Abstract: An interchangeable printed circuit board having electrical components is attached externally proximate to the base of a switch to customize switch performance. The circuit board includes openings which slide over and electrically engage the terminals of the switch proximate the base, leaving the remainder of the terminals exposed and available for plug-in or solder electrical connection within an electrical system. The openings may be copper contact members having fingers which engage and electrically connect to the switch terminals.

公开(公告)号：US20030102357A1

公开(公告)日：2003-06-05

申请号：US10261727

申请日：2002-10-01

Applicant: EMC Corporation

Inventor： Stuart D. Downes

IPC: B23K031/00

CPC classification number: H01R12/585 ,  H01R43/0256 ,  H05K3/3447 ,  H05K3/3452 ,  H05K13/04 ,  H05K2201/10704 ,  H05K2201/10818 ,  H05K2201/10856 ,  H05K2201/10984 ,  H05K2203/0415 ,  H05K2203/0557

Abstract: The invention is directed to techniques for forming a soldered connection using a pin having a channel. The channel enables the pin to form a secure connection with a via (e.g., by facilitating gas percolation out of the via hole during soldering to improve solder flow, by holding solder prior to pin insertion and soldering, or by facilitating accurate pin bending to hold solder or a pin insert prior to pin insertion and soldering) to improve connection system reliability and increase manufacturing yields. In one arrangement, the pin has a surface which includes (i) a first surface area, (ii) a second surface area that is substantially parallel to the first surface area, and (iii) a channel surface area which defines a channel that extends from the first surface area toward the second surface area. To form a soldered connection, the pin is inserted into a cavity defined by a via of a connecting member (e.g., a circuit board), in a direction that is parallel to a central axis of the via. The pin is then soldered to the via to establish an electrical pathway between the pin and the via. Depending on the particular arrangement, the channel generally facilitates the introduction of solder into the cavity of the via. Accordingly, the cavity dimension of the via can be smaller than that required for vias of a conventional reflow soldering approach (i.e., less than 100% of the maximum pin cross-section as for a conventional reflow soldering approach). Hence, the invention is suitable for use in high-density, micro-soldered connection arrangements (e.g., in situations with vias closer together than in the conventional reflow soldering approach).

公开(公告)号：US06570280B2

公开(公告)日：2003-05-27

申请号：US09920863

申请日：2001-08-03

Applicant: Hideyuki Takahashi

Inventor： Hideyuki Takahashi

IPC: H05K334

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H02K3/50 ,  H02K11/33 ,  H05K3/4046 ,  H05K2201/09854 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10856

Abstract: A bonding portion of a connector terminal includes embossed portions and a slit. Each embossed portion is formed by embossing the bonding portion in a thicknesswise direction of the bonding portion to provide an embossed recess on one of opposed sides of the bonding portion. Each embossed recess communicates opposed open ends of an elongated hole provided in a circuit board with each other when the bonding portion is inserted to a predetermined position in the elongated hole. The slit penetrates through the bonding portion. The slit extends over at least one of the opposed open ends of the elongated hole in the thickensswise direction of the circuit board when the bonding portion is inserted to the predetermined position in the elongated hole.

公开(公告)号：US06432745B1

公开(公告)日：2002-08-13

申请号：US08866064

申请日：1997-05-30

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L2144

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract translation: 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US5760472A

公开(公告)日：1998-06-02

申请号：US690500

申请日：1996-07-31

Applicant: Arthur Woodworth ,  Peter Richard Ewer

Inventor： Arthur Woodworth ,  Peter Richard Ewer

IPC: H01L25/07 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L25/18 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/26 ,  H05K3/30 ,  H05K3/34 ,  H01L39/02

CPC classification number: H05K1/145 ,  H01L23/3107 ,  H01L23/49555 ,  H05K3/341 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/05 ,  H05K2201/09781 ,  H05K2201/10136 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10969 ,  H05K2203/162 ,  H05K3/26 ,  H05K3/308 ,  H05K3/3447 ,  Y02P70/613

Abstract: A surface-mount semiconductor package comprises a semiconductor which is embedded within a plastics material body (10). Electrical control connections to the semiconductor comprise first and second upstanding legs (12,14) which are offset from each other, making it easier to couple the devices in parallel. Power output is provided by metal pads (16,18). The pads may be partially sheared, to step them, thereby allowing a single thickness leadframe to be used in the manufacture of the device. On the lower face of the body (10) there are channels (22,24) which increase the electrical tracking distance and allow improved washing of residues after the device has been secured to a substrate.

Abstract translation: 表面安装半导体封装包括嵌入在塑料材料体（10）内的半导体。 与半导体的电气控制连接包括彼此偏移的第一和第二直立腿（12,14），使得更容易并联连接装置。 功率输出由金属焊盘（16,18）提供。 垫可以被部分地剪切，以便将它们逐步进行，从而允许在制造装置中使用单个厚度的引线框架。 在主体（10）的下表面上有通道（22,24），其增加了电气跟踪距离，并且允许在器件固定到基底之后改进残留物的洗涤。