SENSOR UNIT AND IMAGE PROCESSING DEVICE

    公开(公告)号:US20210389187A1

    公开(公告)日:2021-12-16

    申请号:US17122668

    申请日:2020-12-15

    Inventor: Makoto ODANI

    Abstract: A sensor apparatus includes a photosensitive sensor, a cover, and a moving mechanism. The photosensitive sensor includes a first lens and a second lens which focus on a photosensitive element. The cover includes a first slit arranged on an optical axis of the first lens and a second slit arranged on an optical axis of the second lens. The moving mechanism is configured to move the photosensitive sensor and the cover relative to each other so that the second slit is arranged on the optical axis of the first lens.

    Thermal detector and thermal detector array

    公开(公告)号:US11199455B2

    公开(公告)日:2021-12-14

    申请号:US16642939

    申请日:2018-08-31

    Abstract: A wafer-level integrated thermal detector comprises a first wafer and a second wafer (W1, W2) bonded together. The first wafer (W1) includes a dielectric or semiconducting substrate (100), a dielectric sacrificial layer (102) deposited on the substrate, a support layer (104) deposited on the sacrificial layer or the substrate, a suspended active element (108) provided within an opening (106) in the support layer, a first vacuum-sealed cavity (110) and a second vacuum-sealed cavity (106) on opposite sides of the suspended active element. The first vacuum-sealed cavity (110) extends into the sacrificial layer (102) at the location of the suspended active element (108). The second vacuum-sealed cavity (106) comprises the opening of the support layer (104) closed by the bonded second wafer. The thermal detector further comprises front optics (120) for entrance of radiation from outside into one of the first and second vacuum-sealed cavities, aback reflector (112) arranged to reflect radiation back into the other one of the first and second vacuum-sealed cavities, and electrical connections (114) for connecting the suspended active element to a readout circuit (118).

    INFRARED THERMOMETER
    65.
    发明申请

    公开(公告)号:US20210341341A1

    公开(公告)日:2021-11-04

    申请号:US17334871

    申请日:2021-05-31

    Abstract: The present invention relates to an infrared thermometer (1) able to project the detected temperature directly on the surface (6a) of the body (2) to be measured. The determination of the ideal distance of the thermometer from the body, necessary for the correct detection of the temperature thereof, being visually identifiable by means of the relative position of luminous shapes (8a, 8b) projected on the body to be measured (6).

    A METHOD AND SYSTEM FOR DETECTION OF ELECTROMAGNETIC RADIATION

    公开(公告)号:US20210341337A1

    公开(公告)日:2021-11-04

    申请号:US17286059

    申请日:2018-10-29

    Applicant: Lyseonics BV

    Abstract: The invention relates to a device and method for imaging electromagnetic radiation from an object. The device includes entrance optics for allowing the electromagnetic radiation to enter the device, including an image plane onto which an image of the object is to be imaged. The device includes an interferometer having a measurement arm, wherein the image plane is in the measurement arm. The device includes a transformation layer, at the image plane, for transforming the electromagnetic radiation into a spatiotemporal variation of the refractive index of the transformation layer for causing spatiotemporal optical phase differences in the measurement arm of the interferometer that are processed to result in a representative image of the object.

    Thermal imaging with an integrated photonics chip

    公开(公告)号:US11150137B2

    公开(公告)日:2021-10-19

    申请号:US16704862

    申请日:2019-12-05

    Abstract: An integrated photonics chip for thermal imaging comprises a photonics substrate including a plurality of receiver elements. Each receiver element comprises a first grating coupler optically coupled to a first waveguide filter and configured to receive a first wavelength of light at a given angle, with the first waveguide filter configured to pass the first wavelength of light; and a second grating coupler optically coupled to a second waveguide filter and configured to receive a second wavelength of light at the given angle, with second waveguide filter configured to pass the second wavelength of light. Each receiver element receives the wavelengths of light from an object of interest that emits the light due to blackbody radiation, and receives the wavelengths of light at respectively different angles. Each grating coupler receives a unique wavelength of light with respect to the other wavelengths of light received by the other grating couplers.

    DIFFERENTIAL MEASUREMENT OF IR ABORPTION IN PLASMONIC MEMS SENSORS

    公开(公告)号:US20210302308A1

    公开(公告)日:2021-09-30

    申请号:US17120339

    申请日:2020-12-14

    Abstract: A differential nondispersive infrared (NDIR) sensor incorporates an infrared (IR) chopper and multiple multi-bit digital registers to store and compare parameter ratio values, as may be digitally calibrated to corresponding temperature values, from chopper clock cycle portions in which a plasmonic MEMS detector is irradiated by the IR chopper with such values from chopper clock cycle portions in which the IR detector is not irradiated by the IR chopper. The plasmonic MEMS detector is referenced to a reference MEMS device via a parameter-ratio engine. The reference device can include a broadband IR reflector or can have a lower-absorption metasurface pattern giving it a lower quality factor than the plasmonic detector. The resultant enhancements to accuracy and precision of the NDIR sensor enable it to be used as a sub-parts-per-million gas concentration sensor or gas detector having laboratory, commercial, in-home, and battlefield applications.

    Multi-spectral temperature measuring device based on adaptive emissivity model and temperature measuring method thereof

    公开(公告)号:US20210293625A1

    公开(公告)日:2021-09-23

    申请号:US17227363

    申请日:2021-04-11

    Abstract: A multi-spectral temperature measuring device based on adaptive emissivity model and temperature measuring method thereof are provided, which is configured to measure the temperature of the surface of an object under a high temperature background. The present invention relates to the technical field of radiation temperature measurement. The present invention provides a multi-spectral temperature measurement device based on an adaptive emissivity model, includes a pyrometer, a radiation detector, a constant temperature furnace, a cooling cavity, a cold air inlet pipe, a cold air outlet tube, and a thermocouple and thermocouple acquisition card. In order to more accurately measure the surface temperature of the object in a high-temperature environment, a BP network is provided to adaptively find the emissivity model, and through pre-training the network, the network has a high degree of recognition, and then classifies the spectral curve to accurately output the corresponding emissivity model.

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