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    3D FABRICATION FOR DENTAL APPLICATIONS BASED ON ABLATION
    71.
    发明申请
    3D FABRICATION FOR DENTAL APPLICATIONS BASED ON ABLATION 审中-公开

    公开(公告)号：US20200261191A1

    公开(公告)日：2020-08-20

    申请号：US16774403

    申请日：2020-01-28

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher ,  Ziv Gilan

    IPC: A61C13/00 ,  A61C13/08 ,  B29C64/268 ,  B29C64/205

    Abstract: A three-dimensional dental device is fabricated in a layer-by-layer approach using a support material. The support material is deposited in a liquid form on a surface, hardened by cooling or ultraviolet (UV) curing, and selectively ablated to create an area within which the desired structure of the dental device will be formed. Active dental material is deposited into this area, and the layer-by-layer process repeated until the three-dimensional dental device has been completed. Thereafter, any remaining support material is removed by water or other solvent.

    MULTI-MATERIAL DISPENSING AND COATING SYSTEMS
    72.
    发明申请
    MULTI-MATERIAL DISPENSING AND COATING SYSTEMS 审中-公开

    公开(公告)号：US20190283076A1

    公开(公告)日：2019-09-19

    申请号：US16292599

    申请日：2019-03-05

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan

    IPC: B05D1/26 ,  B05D7/00 ,  B05D1/40

    Abstract: Systems and methods for dispensing liquid materials as may be used in applications for coating flexible films and the like. Such a film may be coated by dispensing a rheological material onto its surface while drawing the film through a gap between a pair of rollers. The gap defines the thickness of a layer of the material applied to the film and is maintained at a desired width by microwires positioned through the gap. Another film across the gap from that to which the rheological material is applied aids in the coating of the layer and a contact area of the second film may be adjusted relative to the gap, e.g., when changing materials or when the coating film becomes abraded or deformed.

    Kit and system for laser-induced material dispensing
    73.
    发明授权
    Kit and system for laser-induced material dispensing 有权

    公开(公告)号：US10144034B2

    公开(公告)日：2018-12-04

    申请号：US15648980

    申请日：2017-07-13

    Applicant: IO TECH GROUP LTD.

    Inventor： Michael Zenou

    IPC: B41J2/01 ,  B05D3/06 ,  G02B6/26 ,  G02B6/42 ,  B41J2/48 ,  G02B6/028 ,  G02B6/04 ,  G02B6/35

    Abstract: A laser-induced dispensing system for material processing is disclosed. The laser-induced dispensing system includes a fiber bundle having optical fibers. The optical fibers have first ends arranged at the first interface and second ends arranged at the second interface. Additionally, optics that direct laser beams transmitted from the second interface by the optical fibers toward a material to be deposited a substrate is provided. The optics is configured to focus the laser beams on the material to be deposited, thereby causing the material to be deposited to be released onto the substrate. Each of the optical fibers having a first end that is adjacent to a first end of another of the optical fibers at the first interface have a second end that is non-adjacent to a second end of the another of the optical fibers at the second interface.

    Method to electrically connect chip with top connectors using 3D printing
    75.
    发明授权
    Method to electrically connect chip with top connectors using 3D printing 有权

    公开(公告)号：US12046575B2

    公开(公告)日：2024-07-23

    申请号：US15929281

    申请日：2020-04-22

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: H05K3/00 ,  H01L23/00 ,  H05K3/12 ,  H05K3/32

    CPC classification number: H01L24/82 ,  H05K3/1283 ,  H05K3/32 ,  H01L2224/82051 ,  H01L2224/82103 ,  H01L2224/8284

    Abstract: A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

    Systems for material deposition
    77.
    发明授权
    Systems for material deposition 有权

    公开(公告)号：US11858211B2

    公开(公告)日：2024-01-02

    申请号：US17457724

    申请日：2021-12-06

    Applicant: IO Tech Group Ltd.

    Inventor： Ziv Gilan ,  Daniel Liptz

    IPC: B29C64/209 ,  B33Y30/00 ,  B29C64/227 ,  B33Y10/00

    CPC classification number: B29C64/209 ,  B29C64/227 ,  B33Y30/00 ,  B33Y10/00

    Abstract: Systems for material deposition. One such system includes a number of containers arranged relative to one another in a conical or other shape, pointing toward a common deposition point. When not actively depositing material, the containers are held at a distance from the deposition point. Another system has a rod disposed within a container and a flexible tip on the rod seals a material exit of the container when biased closed. Pressurized gas introduced into the container forces the rod away from the material exit and material from the container. In yet another system, a container includes a barrel adapter having a one-way air valve that seals the container and creates a vacuum, preventing material from leaking from the container. Upon application of a pressurized gas, the one-way valve is forced open and material is deposited from the container. The valve closes automatically in the absence of the gas.

    Systems and methods for solder paste printing on components
    80.
    发明授权
    Systems and methods for solder paste printing on components 有权

    公开(公告)号：US11622451B2

    公开(公告)日：2023-04-04

    申请号：US17247981

    申请日：2021-01-04

    Applicant: IO Tech Group Ltd.

    Inventor： Ziv Gilan ,  Michael Zenou

    IPC: H05K3/34 ,  H05K3/12

    Abstract: Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

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