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公开(公告)号:US11981085B2
公开(公告)日:2024-05-14
申请号:US17381053
申请日:2021-07-20
Applicant: Raytheon Company
Inventor: Lisa M. Smith , Nicholas C. Day , Jacob H. Steinberg
IPC: B29C64/393 , B29C64/153 , B29C64/245 , B29C64/40 , B33Y10/00 , B33Y30/00 , B33Y50/02
CPC classification number: B29C64/393 , B29C64/153 , B29C64/245 , B29C64/40 , B33Y10/00 , B33Y30/00 , B33Y50/02
Abstract: A method includes controlling an additive manufacturing system to fabricate a 3D structure using successive layers of material. The additive manufacturing system includes a build platform having a first region, second region, and overlapping third region between the first and second regions; and multiple sources configured to build (e.g., deposit, bond, melt, solidify) the successive layers of material in the regions of the build platform. Controlling the additive manufacturing system includes controlling the additive manufacturing system to build first, second, and third portions of the 3D structure within the regions of the build platform. Each portion of the 3D structure includes (i) one or more test features that are common to the portions of the 3D structure and (ii) a substrate onto or into which the one or more common test features are formed.
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公开(公告)号:US20240138073A1
公开(公告)日:2024-04-25
申请号:US17971307
申请日:2022-10-20
Applicant: Raytheon Company
Inventor: Patrick J. Lott , Christopher O'Brien
IPC: H05K3/32
CPC classification number: H05K3/32
Abstract: A method is provided for assembling an apparatus. During this method, a circuit element is arranged with a circuit board. The circuit element includes an element aperture. The circuit board includes a board aperture. A plunger is moved in a first direction to pass a distal end of the plunger through the element aperture and the board aperture and into a volume adjacent the circuit board. A retainer is pivoted within the volume. The retainer is pivotally mounted to the plunger at the distal end of the plunger. The plunger is moved in a second direction to clamp the circuit board between the retainer and the circuit element.
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公开(公告)号:US20240127180A1
公开(公告)日:2024-04-18
申请号:US17965496
申请日:2022-10-13
Applicant: Raytheon Company
Inventor: Fernando Alvarez , Marcos Alejandro Ayon , Daniel A. Colica
IPC: G06Q10/08
CPC classification number: G06Q10/0875
Abstract: A computer implemented method and system for determining a change to an article of manufacture by analyzing Bills of Materials associated with the article for providing a corresponding change for the article in a Logistics Product Database which drives a corresponding change for the article in a Common Source Database. At least first and second Bill of Materials associated with the article are accessed wherein the first and second Bills of Materials are modeled by forming a respective block chain for each. A change of article data is detected by determining a difference of hash values regarding an aspect of the article when comparing the respective block chains of the first and second Bill of Materials. A notification is provided of a change to the article responsive to the detecting a change of article data.
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公开(公告)号:US20240126140A1
公开(公告)日:2024-04-18
申请号:US18486394
申请日:2023-10-13
Applicant: Raytheon Company
Inventor: Brook Garrettson , Lacy G. Cook , Andrew L. Bullard
IPC: G03B11/04
CPC classification number: G03B11/043
Abstract: A movable sunshade system includes a baffle extending along a central axis of an entrance pupil of a lens and a sunshade movably connected to the baffle. The sunshade includes a first portion shaped to cover a portion of the baffle that is spaced from the first end of the baffle and a second portion that extends from the first portion. The second portion is shaped to cover a portion of a field of view (FOV) of the entrance pupil. The movable sunshade system further includes an actuator configured to move at least one of the baffle or the sunshade to selectively cover portions of the FOV of the entrance pupil.
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公开(公告)号:US11963328B2
公开(公告)日:2024-04-16
申请号:US17069762
申请日:2020-10-13
Applicant: Raytheon Company
Inventor: Don W. West , Evan Haynes
IPC: H05K7/20 , H01R13/622
CPC classification number: H05K7/20009 , H01R13/622 , H05K7/20145
Abstract: An electronic component connector cooling device can include a base portion and a conduit portion extending from the base portion. The conduit portion can have a cooling channel. The electronic component connector cooling device can further include a housing coupling interface formed in the base portion and operable to facilitate coupling the electronic component connector cooling device to a housing that at least partially forms an enclosure about an electronic component. The electronic component connector cooling device can also include a connector coupling interface formed in the base portion and operable to facilitate coupling a connector to the electronic component connector cooling device. The connector can operably connect the electronic component to a component external to the enclosure. The electronic component connector cooling device can further include an inlet port formed in the conduit portion and in fluid communication with the cooling channel. The inlet port can be operable to couple to a cooling fluid source external to the enclosure and to receive a cooling fluid from the cooling fluid source. The electronic component connector cooling device can include one or more outlet ports formed in the base portion and in fluid communication with the cooling channel operable to direct the cooling fluid internal to the enclosure to cool the electronic component.
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公开(公告)号:US11958785B2
公开(公告)日:2024-04-16
申请号:US16680602
申请日:2019-11-12
Applicant: RAYTHEON COMPANY
Inventor: Stephanie Silberstein Bell , Thomas M. Hartnett , Richard Gentilman , Derrick J. Rockosi , Jeremy Wagner
CPC classification number: C04B37/003 , C04B37/005 , C09K11/08 , C04B2235/764 , C04B2237/10 , C04B2237/34
Abstract: A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.
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公开(公告)号:US11953765B2
公开(公告)日:2024-04-09
申请号:US18298097
申请日:2023-04-10
Applicant: Raytheon Company
Inventor: Jamal I. Mustafa , Justin Gordon Adams Wehner , Christopher R. Koontz
IPC: G02F1/017
CPC classification number: G02F1/017 , G02F2203/11 , G02F2203/52
Abstract: A method is provided for operating one or more one solid-state electro-optic device to provide an electrically switching shutter. The method includes forming an alternating stack of first semiconductor layers having a first dopant and second semiconductor layers having a second dopant to form at least one superlattice semiconductor device. The method further includes applying to the at least one superlattice semiconductor device a first voltage to induce a transparent state of the alternating stack such that light is transmitted through the alternating stack, and applying to the at least one superlattice semiconductor device a second voltage different from the first voltage to induce an opaque state of the alternating stack such that light is inhibited from passing through the alternating stack.
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公开(公告)号:US11951850B2
公开(公告)日:2024-04-09
申请号:US17739554
申请日:2022-05-09
Applicant: Raytheon Company
Inventor: Boris S. Jacobson , Sara L. Makowiec , Mark S. Langelier , Michael F. Janik , George E. Anderson
IPC: B60L53/12 , B60L53/36 , B60L53/38 , H01F27/24 , H01F38/14 , H02J7/00 , H02J50/12 , H02J50/40 , H02M7/219 , H02M7/5387 , H02M3/335
CPC classification number: B60L53/12 , B60L53/36 , B60L53/38 , H01F27/24 , H01F38/14 , H02J50/12 , H02J50/40 , H02M7/219 , H02M7/5387 , H02J7/0013 , H02J7/0042 , H02J2207/20 , H02M3/33584
Abstract: A multi-cell inductive wireless power transfer system includes multiple transmitting elements. Each transmitting element includes one or more transmitting windings and one or more transmitting magnetic cores. The multi-cell inductive wireless power transfer system also includes multiple receiving elements. The transmitting elements are separated from the receiving elements by an air gap. Each receiving element includes one or more receiving windings and one or more receiving magnetic cores.
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公开(公告)号:US11949216B2
公开(公告)日:2024-04-02
申请号:US17658344
申请日:2022-04-07
Applicant: Raytheon Company
Inventor: Channing P. Favreau , Alexander Gilbert , Thomas V. Sikina
CPC classification number: H02G15/10 , H05K5/0247
Abstract: Methods and apparatus for a housing assembly including a housing comprising a conductive material, a conductor extending through the housing, and a dielectric material at least partially surrounding the conductor. Portions of the housing may surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.
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公开(公告)号:US11945757B2
公开(公告)日:2024-04-02
申请号:US16447229
申请日:2019-06-20
Applicant: RAYTHEON COMPANY
Inventor: Michael W. Cason
IPC: C04B41/52 , C04B41/00 , C04B41/45 , C04B41/46 , C04B41/50 , C04B41/82 , C04B41/85 , C04B41/89 , G02B1/10 , G02B3/00 , G02B5/00 , B29L11/00
CPC classification number: C04B41/522 , C04B41/009 , C04B41/4556 , C04B41/46 , C04B41/5003 , C04B41/82 , C04B41/85 , C04B41/89 , G02B1/10 , G02B3/00 , G02B5/00 , B29L2011/00
Abstract: An optical element includes an optical surface including a ceramic material. The optical element further includes a coating that includes a bifunctional molecule arranged on the optical surface. The bifunctional molecule includes a first functional group and a second functional group. The first functional group forms a covalent bond to the ceramic material of the optical surface, and the second functional group includes an aromatic functional group. The optical element further includes a carbon-containing material non-covalently bonded to the second functional group of the bifunctional molecule of the coating.
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